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Global Next-Generation Memory Market Growth, Size, Trends Analysis- By Technology, By Water Size, By Application - Regional Outlook, Competitive Strategies and Segment Forecast to 2034

Publisher SPER Market Research Pvt. Ltd.
Published Jun 20, 2025
Length 250 Pages
SKU # SPER20222474

Description

Global Next-Generation Memory Market Introduction and Overview

According to SPER market research, ‘Global Next-Generation Memory Market Size- By Technology, By Water Size, By Application – Regional Outlook, Competitive Strategies and Segment Forecast to 2034’ state that the Global Next-Generation Memory Market is predicted to reach 47.06 Billion by 2034 with a CAGR 17.86%.

Next-generation memory encompasses a range of advanced data storage technologies developed to address the limitations of conventional memory systems such as DRAM and NAND flash. These innovative memory types provide benefits like faster data access speeds, greater storage capacity, lower energy consumption, and enhanced reliability. Examples include MRAM (Magnetoresistive RAM), ReRAM (Resistive RAM), PCM (Phase-Change Memory), and 3D XPoint.

Restraints:

Despite its strong growth potential, the next-generation memory market encounters several significant challenges. A major hurdle is the high cost of research, development, and manufacturing, which can limit adoption, particularly in price-sensitive markets. Integrating these advanced memory technologies into existing systems is another challenge, often requiring complex and time-intensive modifications to both hardware and software.

Scope of the report:

Report Metric Details
Market size available for years 2021-2034
Base year considered 2024
Forecast period 2025-2034

Segments covered

By Technology, By Water Size, By Application

Regions covered

North America, Latin America, Asia-Pacific, Europe, and Middle East & Africa

Companies Covered

Samsung, Micron Technology, Inc., Fujitsu, SK HYNIX INC, Honeywell International Inc., Microchip Technology Inc, Everspin Technologies Inc, Infineon Technologies AG, Kingston Technology Europe Co LLP, KIOXIA Singapore Pte. Ltd.

Global Next-Generation Memory Market Segmentation:

By Technology: Based on the Technology, Global Next-Generation Memory Market is segmented as; Volatile, Non-Volatile.

By Wafer Size: Based on the Wafer Size, Global Next-Generation Memory Market is segmented as; 200 mm, 300 mm.

By Application:

Based on the Application, Global Next-Generation Memory Market is segmented as; BFSI, Consumer Electronics, Government, Telecommunications, Information Technology, Others.

By Region:

This research also includes data for North America, Latin America, Asia-Pacific, Europe and Middle East & Africa.

Table of Contents

250 Pages
1. Introduction
1.1. Scope of the report
1.2. Market segment analysis
2. Research Methodology
2.1. Research data source
2.1.1. Secondary Data
2.1.2. Primary Data
2.1.3. SPERs internal database
2.1.4. Premium insight from KOLs
2.2. Market size estimation
2.2.1. Top-down and Bottom-up approach
2.3. Data triangulation
3. Executive Summary
4. Market Dynamics
4.1. Driver, Restraint, Opportunity and Challenges analysis
4.1.1. Drivers
4.1.2. Restraints
4.1.3. Opportunities
4.1.4. Challenges
5. Market variable and outlook
5.1. SWOT Analysis
5.1.1. Strengths
5.1.2. Weaknesses
5.1.3. Opportunities
5.1.4. Threats
5.2. PESTEL Analysis
5.2.1. Political Landscape
5.2.2. Economic Landscape
5.2.3. Social Landscape
5.2.4. Technological Landscape
5.2.5. Environmental Landscape
5.2.6. Legal Landscape
5.3. PORTERs Five Forces
5.3.1. Bargaining power of suppliers
5.3.2. Bargaining power of buyers
5.3.3. Threat of Substitute
5.3.4. Threat of new entrant
5.3.5. Competitive rivalry
5.4. Heat Map Analysis
6. Competitive Landscape
6.1. Global Next-Generation Memory Market Manufacturing Base Distribution, Sales Area, Product Type
6.2. Mergers & Acquisitions, Partnerships, Product Launch, and Collaboration in Global Next-Generation Memory Market
7. Global Next-Generation Memory Market, By Technology, (USD Million) 2021-2034
7.1. Volatile
7.1.1. SRAM
7.1.2. Magneto-Resistive Random-Access Memory (MRAM)
7.1.3. Ferroelectric RAM (FRAM)
7.1.4. Resistive Random-Access Memory (ReRAM)
7.1.5. Nano RAM
7.1.6. Other
7.2. Non-volatile
7.2.1. Hybrid Memory Cube (HMC)
7.2.2. High-bandwidth Memory (HBM)
8. Global Next-Generation Memory Market, By Wafer Size, (USD Million) 2021-2034
8.1.200 mm
8.2.300 mm
9. Global Next-Generation Memory Market, By Application, (USD Million) 2021-2034
9.1. BFSI
9.2. Consumer Electronics
9.3. Government
9.4. Telecommunications
9.5. Information Technology
9.6. Others
10. Global Next-Generation Memory Market, (USD Million) 2021-2034
10.1. Global Next-Generation Memory Market Size and Market Share
11. Global Next-Generation Memory Market, By Region, 2021-2034 (USD Million)
11.1. Asia-Pacific
11.1.1. Australia
11.1.2. China
11.1.3. India
11.1.4. Japan
11.1.5. South Korea
11.1.6. Rest of Asia-Pacific
11.2. Europe
11.2.1. France
11.2.2. Germany
11.2.3. Italy
11.2.4. Spain
11.2.5. United Kingdom
11.2.6. Rest of Europe
11.3. Middle East and Africa
11.3.1. Kingdom of Saudi Arabia
11.3.2. United Arab Emirates
11.3.3. Qatar
11.3.4. South Africa
11.3.5. Egypt
11.3.6. Morocco
11.3.7. Nigeria
11.3.8. Rest of Middle-East and Africa
11.4. North America
11.4.1. Canada
11.4.2. Mexico
11.4.3. United States
11.5. Latin America
11.5.1. Argentina
11.5.2. Brazil
11.5.3. Rest of Latin America
12. Company Profile
12.1. Samsung
12.1.1. Company details
12.1.2. Financial outlook
12.1.3. Product summary
12.1.4. Recent developments
12.2. Micron Technology, Inc.
12.2.1. Company details
12.2.2. Financial outlook
12.2.3. Product summary
12.2.4. Recent developments
12.3. Fujitsu
12.3.1. Company details
12.3.2. Financial outlook
12.3.3. Product summary
12.3.4. Recent developments
12.4. SK HYNIX INC
12.4.1. Company details
12.4.2. Financial outlook
12.4.3. Product summary
12.4.4. Recent developments
12.5. Honeywell International Inc.
12.5.1. Company details
12.5.2. Financial outlook
12.5.3. Product summary
12.5.4. Recent developments
12.6. Microchip Technology Inc
12.6.1. Company details
12.6.2. Financial outlook
12.6.3. Product summary
12.6.4. Recent developments
12.7. Everspin Technologies Inc
12.7.1. Company details
12.7.2. Financial outlook
12.7.3. Product summary
12.7.4. Recent developments
12.8. Infineon Technologies AG
12.8.1. Company details
12.8.2. Financial outlook
12.8.3. Product summary
12.8.4. Recent developments
12.9. Kingston Technology Europe Co LLP
12.9.1. Company details
12.9.2. Financial outlook
12.9.3. Product summary
12.9.4. Recent developments
12.10. KIOXIA Singapore Pte. Ltd
12.10.1. Company details
12.10.2. Financial outlook
12.10.3. Product summary
12.10.4. Recent developments
12.11. Others
13. Conclusion
14. List of Abbreviations
15. Reference Links

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