Automotive Power Management ICs and Signal Chain Chips Industry Research Report, 2025
Description
Analog chips are used to process continuous analog signals from the natural world, such as light, sound, electricity/magnetism, position/speed/acceleration, and temperature. They are mainly composed of resistors, capacitors, transistors, integrated circuits, etc. According to their functions, analog chips can be divided into two major categories: power management chips and signal chain chips.
Signal Chain Chips: They process the analog signals (sound, light, electricity, speed, position, etc.) collected by sensors through transmission, reception, analog-to-digital conversion, amplification, filtering, and other operations, converting them into digital signals for further storage and processing. The main product types include amplifiers/comparators, data converters, isolation/interfaces, and clock chips.
Power Management Chips: They are often used for the management, monitoring, and distribution of power supplies in electronic devices. Their functions generally include voltage conversion, current control, low-dropout voltage regulation, power supply selection, dynamic voltage adjustment, and power switch timing control. They can be divided into AC/DC, DC/DC, LDO, battery management chips (BMIC), driver chips, multi-channel power management integrated circuits (PMIC), and system basis chips (SBC).
Power Supply Strategy for Central Computing Platforms: High-Performance SoCs Adopt Multi-Phase Controllers + DrMOS, Combined with Large PMICs + Small PMICs
A System-on-Chip (SoC) integrates computing, storage, communication, and sensor interfaces into a single chip. Taking an intelligent driving SoC as an example, it usually integrates components such as a CPU, GPU, NPU/BPU, DSP/ISP, storage and interface units, and security modules. These SoCs can process large amounts of data and perform complex calculations that enable vehicles to make real-time decisions. Therefore, advanced power management solutions are required, especially for core voltage rails.
With the rapid development of Zonal control + central computing architecture and AI, higher requirements are put forward for the computing power and performance of SoCs. SoCs need a large amount of parallel computing capabilities, higher clock frequencies, and faster dynamic response speeds. Higher computing power and performance mean greater heat generation, higher power consumption, and larger currents. At the same time, with the improvement of GPU performance, its requirements for power supply stability are also higher. Therefore, high-performance SoCs need more sophisticated power management solutions to achieve better conversion efficiency, dynamic load adaptation capabilities, more refined power distribution and control strategies, and also reduce heat generation to a certain extent.
In the SoC, current requirement of a single GPU module is close to 100A, and the currents of several other circuits are also close to 50A. In order to supply power to the power-hungry NPU, GPU, and CPU cores in the SoC, the high-power core rails of the SoC usually adopt a power distribution scheme of multi-phase controllers + DrMOS to support the high-computing-power requirements of the SoC.
Taking MPS's SoC power supply solution for central computing platforms as an example: For central computing platforms, MPS has launched the MPSafe central computing unit power solution suitable for high-performance SoCs. The solution of MPQ2967-AEC1 (multi-phase controller) + MPQ86960 (DrMOS) is specially designed for core power supply of high-computing-power and high-current main chips. This solution can achieve higher power density and efficiency, and realize a timing controller and monitoring that comply with the ISO 26262 ASIL functional safety standard.
MPQ2967-AEC1: As a multi-phase digital PWM controller, it can be configured as a four-phase two-rail controller at most, with fast transient response, programmability, and scalability.
MPQ86960-AEC1: As a high-performance DrMOS device, it is a monolithic half-bridge that integrates a power MOSFET and a gate driver. It can achieve a continuous output current (IOUT) of up to 50A within a wide input voltage (VIN) range.
The power management of central computing platform is extremely complex. In addition to the power supply for the SoC, devices such as MCUs, LPDDR, Flash, Ethernet switches, and SerDes also need power supply. Generally speaking, in addition to battery protection devices, primary power supplies, and ""multi-phase controllers + DrMOS"", the power supply of the entire central computing platform will also use large PMICs + small PMICs as supplements to ensure the stable transition of the system, automatic power-on and power-off, and help integrate functional safety. PMICs are very closely coupled with SoCs. Generally, manufacturers of SoCs and MCUs will design their own matching PMICs, and at most, an external ASIL-D power supply will be used as a ""gatekeeper"" for functional safety.
Taking NXP's central computing platform solution as an example: If the S32N series of processors is adopted, it can be combined with NXP's own PMIC power management chips PF53 and FS04. FS04 is a high-voltage ASIL-D PMIC for S32N processors, integrating 1 HV BUCK, 5 LV BUCKs, and 1 LDO. The FS04 PMIC improves accuracy through an analog-to-digital converter and complies with the ASIL D safety standard. The PF53 POL regulator supplies power to the S32N core, providing high-power support while optimizing material costs.
Power Supply Strategy for Zonal Controllers: PMICs/SBCs Will Replace Some LDOs and DC/DCs, and Leading Enterprises Launch One-Stop Solutions
PCB board of a Zone Control Unit (ZCU) is mainly composed of a main control MCU, a power management unit, a communication circuit, an interface circuit, etc. Among them, the power management unit includes chips such as DC/DC, LDO, PMIC, and SBC, which supply power to devices such as MCUs and CAN/LIN/Ethernet transceivers. In the interface circuit, the ZCU drives the electronic loads of the vehicle body through high/low-side driver chips, electronic fuses, motor driver chips, gate driver chips, and discrete MOSFETs.
The power supply for main control MCU of ZCU is relatively complex. The core, digital peripherals, and ADC all need independent power supplies, and the required voltages are 1.25V, 3.3V, 5V, etc. In addition, ZCUs basically integrate gateway functions, so they also need to supply power to Ethernet switches and PHYs, usually 3.3V with a current of 2-3A, and 0.9V and 1.1V with a current of less than 1A. Because the ZCU includes motor control for seats and doors, and the sensors of such motors are generally not on the ZCU main board, a tracker LDO is required to follow the power supply of the MCU to obtain sensor data more accurately.
In line with the changes in zonal control architecture, power supply demand of MCUs in scattered small ECUs through LDOs may be integrated into PMICs for zonal controller power supply. LDOs will be integrated with DC/DCs into PMICs to provide system-level power solutions for ZCUs. At present, most of the power supply solutions for ZCUs use PMICs or SBCs, and a small part use DC/DCs and LDOs.
Taking Infineon's zonal controller solution as an example: For zonal controllers, Infineon can provide one-stop solutions including the OPTIREG™ product series, supplementary NOR Flash solutions, microcontroller solutions, PROFET™ intelligent power switches, MOSFETs, and corresponding gate drivers.
In addition to power supply, SBCs also integrate other functions such as CAN/LIN transceivers, watchdog timers, LIMP HOME, and high-side drivers. In some designs, to simplify system design and reduce PCB area, DC/DC, LDO, Tracking LDO, watchdog, voltage monitoring, communication, and diagnostic functions are integrated into a single chip, facilitating functional redundancy and reducing PCB size.
Taking Novosense Microelectronics as an example, to meet the integrated needs of intelligent control modules in the next-generation automotive electronic architecture for power supply, communication, and driving functions, in July 2025, Novosense Microelectronics launched the new NSR926X series of automotive-grade SBC system basis chips. Adopting an all-in-one platform-level design, it integrates three low-dropout regulators (LDOs), four high-side drivers (HSS), a LIN transceiver, and a high-speed CAN transceiver with Partial Networking (PN) function.
Steer-by-Wire Systems: Transition from 12V to 48V Power Supply, and Development towards Full-Link Solutions for Sensing, Communication, Driving, and Control
Since steer-by-wire systems eliminate the mechanical connection between the steering wheel and the steering wheels and rely entirely on electronic signals and electric drives to perform steering operations, they not only need to drive high-torque steering motors (six-phase dual-motor redundancy design) but also support high-power consumption components such as road feel simulation motors, sensors, and controllers, and must meet the ASIL-D functional safety level. Therefore, the requirements of steer-by-wire systems for power management chips and driver chips are much higher than those of traditional steering systems.
In a steer-by-wire system, the power supply system is responsible for supplying power to two redundant six-phase steering motors, two redundant torque feedback motors, the electronic control unit in the system, and other vehicle electrical appliances, so the power supply bears a huge load. If the 12V power supply is still used, a larger current is required to obtain greater power, and excessive current will have an adverse impact on the overall stability of the system. Therefore, the power supply voltage of the steer-by-wire system can be increased, and a 48V power supply can be used to solve this problem. Compared with the 12V system, the 48V system can make the redundant actuators of high-peak load devices such as steer-by-wire systems lighter and more cost-effective.
Taking ON Semiconductor's steer-by-wire system solution as an example: For 48V steer-by-wire systems, ON Semiconductor has built a full-link technology from sensing and communication to driving and control, covering various products such as sensors, power supplies, signal chains, and isolation protection.
NIV3071: NIV3071 is an electronic fuse (e-Fuse) that integrates 4 independent channels in one package, supporting a continuous output current of up to 10A, and is suitable for a wide range of automotive applications from 12V to 48V.
NCV51511: It is an automotive-grade low-side gate driver with high driving current capability and options, optimized for DC-DC power supplies and inverters. NCV51511 can be used to drive MOSFETs in half-bridge or synchronous buck architectures.
T10 MOSFET Series: Based on the new shielded gate trench technology, the T10 MOSFET series significantly improves efficiency and effectively reduces output capacitance, RDS (ON), and gate charge compared with traditional designs. The T10-M is designed with extremely low RDS (ON), equipped with a soft recovery body diode, and also effectively reduces ringing, overshoot, and electromagnetic interference noise during switching. It is particularly suitable for application scenarios that require high switching speed and efficiency, such as motor drives and load switches.
NCV77320: It is an inductive position sensor for automotive applications, which can measure angle or linear position. NCV77320 has strong anti-interference ability and can be used in places such as pedals, throttles, chassis heights, and actuator position feedback. In 48V steer-by-wire systems, it can be used as a steer-by-wire sensor.
NCV7041: It is a high-voltage, high-resolution current sensing amplifier with a common-mode input range of-5.0V to + 80V, which can perform one-way or two-way current measurement across a sensing resistor in various applications.
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Signal Chain Chips: They process the analog signals (sound, light, electricity, speed, position, etc.) collected by sensors through transmission, reception, analog-to-digital conversion, amplification, filtering, and other operations, converting them into digital signals for further storage and processing. The main product types include amplifiers/comparators, data converters, isolation/interfaces, and clock chips.
Power Management Chips: They are often used for the management, monitoring, and distribution of power supplies in electronic devices. Their functions generally include voltage conversion, current control, low-dropout voltage regulation, power supply selection, dynamic voltage adjustment, and power switch timing control. They can be divided into AC/DC, DC/DC, LDO, battery management chips (BMIC), driver chips, multi-channel power management integrated circuits (PMIC), and system basis chips (SBC).
Power Supply Strategy for Central Computing Platforms: High-Performance SoCs Adopt Multi-Phase Controllers + DrMOS, Combined with Large PMICs + Small PMICs
A System-on-Chip (SoC) integrates computing, storage, communication, and sensor interfaces into a single chip. Taking an intelligent driving SoC as an example, it usually integrates components such as a CPU, GPU, NPU/BPU, DSP/ISP, storage and interface units, and security modules. These SoCs can process large amounts of data and perform complex calculations that enable vehicles to make real-time decisions. Therefore, advanced power management solutions are required, especially for core voltage rails.
With the rapid development of Zonal control + central computing architecture and AI, higher requirements are put forward for the computing power and performance of SoCs. SoCs need a large amount of parallel computing capabilities, higher clock frequencies, and faster dynamic response speeds. Higher computing power and performance mean greater heat generation, higher power consumption, and larger currents. At the same time, with the improvement of GPU performance, its requirements for power supply stability are also higher. Therefore, high-performance SoCs need more sophisticated power management solutions to achieve better conversion efficiency, dynamic load adaptation capabilities, more refined power distribution and control strategies, and also reduce heat generation to a certain extent.
In the SoC, current requirement of a single GPU module is close to 100A, and the currents of several other circuits are also close to 50A. In order to supply power to the power-hungry NPU, GPU, and CPU cores in the SoC, the high-power core rails of the SoC usually adopt a power distribution scheme of multi-phase controllers + DrMOS to support the high-computing-power requirements of the SoC.
Taking MPS's SoC power supply solution for central computing platforms as an example: For central computing platforms, MPS has launched the MPSafe central computing unit power solution suitable for high-performance SoCs. The solution of MPQ2967-AEC1 (multi-phase controller) + MPQ86960 (DrMOS) is specially designed for core power supply of high-computing-power and high-current main chips. This solution can achieve higher power density and efficiency, and realize a timing controller and monitoring that comply with the ISO 26262 ASIL functional safety standard.
MPQ2967-AEC1: As a multi-phase digital PWM controller, it can be configured as a four-phase two-rail controller at most, with fast transient response, programmability, and scalability.
MPQ86960-AEC1: As a high-performance DrMOS device, it is a monolithic half-bridge that integrates a power MOSFET and a gate driver. It can achieve a continuous output current (IOUT) of up to 50A within a wide input voltage (VIN) range.
The power management of central computing platform is extremely complex. In addition to the power supply for the SoC, devices such as MCUs, LPDDR, Flash, Ethernet switches, and SerDes also need power supply. Generally speaking, in addition to battery protection devices, primary power supplies, and ""multi-phase controllers + DrMOS"", the power supply of the entire central computing platform will also use large PMICs + small PMICs as supplements to ensure the stable transition of the system, automatic power-on and power-off, and help integrate functional safety. PMICs are very closely coupled with SoCs. Generally, manufacturers of SoCs and MCUs will design their own matching PMICs, and at most, an external ASIL-D power supply will be used as a ""gatekeeper"" for functional safety.
Taking NXP's central computing platform solution as an example: If the S32N series of processors is adopted, it can be combined with NXP's own PMIC power management chips PF53 and FS04. FS04 is a high-voltage ASIL-D PMIC for S32N processors, integrating 1 HV BUCK, 5 LV BUCKs, and 1 LDO. The FS04 PMIC improves accuracy through an analog-to-digital converter and complies with the ASIL D safety standard. The PF53 POL regulator supplies power to the S32N core, providing high-power support while optimizing material costs.
Power Supply Strategy for Zonal Controllers: PMICs/SBCs Will Replace Some LDOs and DC/DCs, and Leading Enterprises Launch One-Stop Solutions
PCB board of a Zone Control Unit (ZCU) is mainly composed of a main control MCU, a power management unit, a communication circuit, an interface circuit, etc. Among them, the power management unit includes chips such as DC/DC, LDO, PMIC, and SBC, which supply power to devices such as MCUs and CAN/LIN/Ethernet transceivers. In the interface circuit, the ZCU drives the electronic loads of the vehicle body through high/low-side driver chips, electronic fuses, motor driver chips, gate driver chips, and discrete MOSFETs.
The power supply for main control MCU of ZCU is relatively complex. The core, digital peripherals, and ADC all need independent power supplies, and the required voltages are 1.25V, 3.3V, 5V, etc. In addition, ZCUs basically integrate gateway functions, so they also need to supply power to Ethernet switches and PHYs, usually 3.3V with a current of 2-3A, and 0.9V and 1.1V with a current of less than 1A. Because the ZCU includes motor control for seats and doors, and the sensors of such motors are generally not on the ZCU main board, a tracker LDO is required to follow the power supply of the MCU to obtain sensor data more accurately.
In line with the changes in zonal control architecture, power supply demand of MCUs in scattered small ECUs through LDOs may be integrated into PMICs for zonal controller power supply. LDOs will be integrated with DC/DCs into PMICs to provide system-level power solutions for ZCUs. At present, most of the power supply solutions for ZCUs use PMICs or SBCs, and a small part use DC/DCs and LDOs.
Taking Infineon's zonal controller solution as an example: For zonal controllers, Infineon can provide one-stop solutions including the OPTIREG™ product series, supplementary NOR Flash solutions, microcontroller solutions, PROFET™ intelligent power switches, MOSFETs, and corresponding gate drivers.
In addition to power supply, SBCs also integrate other functions such as CAN/LIN transceivers, watchdog timers, LIMP HOME, and high-side drivers. In some designs, to simplify system design and reduce PCB area, DC/DC, LDO, Tracking LDO, watchdog, voltage monitoring, communication, and diagnostic functions are integrated into a single chip, facilitating functional redundancy and reducing PCB size.
Taking Novosense Microelectronics as an example, to meet the integrated needs of intelligent control modules in the next-generation automotive electronic architecture for power supply, communication, and driving functions, in July 2025, Novosense Microelectronics launched the new NSR926X series of automotive-grade SBC system basis chips. Adopting an all-in-one platform-level design, it integrates three low-dropout regulators (LDOs), four high-side drivers (HSS), a LIN transceiver, and a high-speed CAN transceiver with Partial Networking (PN) function.
Steer-by-Wire Systems: Transition from 12V to 48V Power Supply, and Development towards Full-Link Solutions for Sensing, Communication, Driving, and Control
Since steer-by-wire systems eliminate the mechanical connection between the steering wheel and the steering wheels and rely entirely on electronic signals and electric drives to perform steering operations, they not only need to drive high-torque steering motors (six-phase dual-motor redundancy design) but also support high-power consumption components such as road feel simulation motors, sensors, and controllers, and must meet the ASIL-D functional safety level. Therefore, the requirements of steer-by-wire systems for power management chips and driver chips are much higher than those of traditional steering systems.
In a steer-by-wire system, the power supply system is responsible for supplying power to two redundant six-phase steering motors, two redundant torque feedback motors, the electronic control unit in the system, and other vehicle electrical appliances, so the power supply bears a huge load. If the 12V power supply is still used, a larger current is required to obtain greater power, and excessive current will have an adverse impact on the overall stability of the system. Therefore, the power supply voltage of the steer-by-wire system can be increased, and a 48V power supply can be used to solve this problem. Compared with the 12V system, the 48V system can make the redundant actuators of high-peak load devices such as steer-by-wire systems lighter and more cost-effective.
Taking ON Semiconductor's steer-by-wire system solution as an example: For 48V steer-by-wire systems, ON Semiconductor has built a full-link technology from sensing and communication to driving and control, covering various products such as sensors, power supplies, signal chains, and isolation protection.
NIV3071: NIV3071 is an electronic fuse (e-Fuse) that integrates 4 independent channels in one package, supporting a continuous output current of up to 10A, and is suitable for a wide range of automotive applications from 12V to 48V.
NCV51511: It is an automotive-grade low-side gate driver with high driving current capability and options, optimized for DC-DC power supplies and inverters. NCV51511 can be used to drive MOSFETs in half-bridge or synchronous buck architectures.
T10 MOSFET Series: Based on the new shielded gate trench technology, the T10 MOSFET series significantly improves efficiency and effectively reduces output capacitance, RDS (ON), and gate charge compared with traditional designs. The T10-M is designed with extremely low RDS (ON), equipped with a soft recovery body diode, and also effectively reduces ringing, overshoot, and electromagnetic interference noise during switching. It is particularly suitable for application scenarios that require high switching speed and efficiency, such as motor drives and load switches.
NCV77320: It is an inductive position sensor for automotive applications, which can measure angle or linear position. NCV77320 has strong anti-interference ability and can be used in places such as pedals, throttles, chassis heights, and actuator position feedback. In 48V steer-by-wire systems, it can be used as a steer-by-wire sensor.
NCV7041: It is a high-voltage, high-resolution current sensing amplifier with a common-mode input range of-5.0V to + 80V, which can perform one-way or two-way current measurement across a sensing resistor in various applications.
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Table of Contents
710 Pages
- 1 Overview of Automotive Analog Chips and Vehicle Power Distribution Architecture
- 1.1 Classification and Market of Automotive PMICs and Signal Chain Chips
- Analog Chips: Working Principles
- Functional Classification of Analog Chips: Signal Chain Chips, Power Management Chips
- Applications of Analog Chips in Automotive Electronics
- Power Management Chips: Definition
- Power Management Chips: Product Classification
- Signal Chain Chips: Definition and Product Classification
- Overview of Vehicle Chip Types, Processes, and Per-Vehicle Usage
- Global Analog Chip Market Size
- Chinese Analog Chip Market Size
- Chinese Analog Chip Market: Localization Substitution Process
- Chinese Automotive Analog Chip Market Size
- 2024 Global and Chinese Analog Chip Market Patterns
- 1.2 Vehicle Power Supply Strategies and Evolution Trends
- Development Trends of Vehicle Power Distribution Architecture:
- Traditional Power Distribution Architecture
- Domain Controller Power Distribution Architecture
- Zonal Power Distribution Architecture
- Two Forms of Low-Voltage Power Distribution for Zonal Controllers
- Low-Voltage Power Distribution Solutions for Zonal Controllers
- Requirements for Future Intelligent Power Distribution Architecture
- 2 Application Automotive Analog Chips (by Sub-Scenarios)
- 2.1 Scenario 1: Intelligent Driving
- 2.1.1 Intelligent Driving Domain Controllers
- Intelligent Driving Domain Controllers: Hardware Structure
- Four Core Requirements of ADAS Systems for Power Management Chips
- Power Management and Power Distribution Design of Intelligent Driving Domain Controllers (1)
- Power Management and Power Distribution Design of Intelligent Driving Domain Controllers (2)
- Power Management and Power Distribution Design of Intelligent Driving Domain Controllers (3)
- Power Supply Design of Central Computing Platforms (1)
- Power Supply Design of Central Computing Platforms (5)
- Power Management Chip Products for Central Computing Platforms (1)
- Power Management Chip Products for Central Computing Platforms (2)
- Power Management Solutions for Intelligent Driving Domain Controllers (1)
- Power Management Solutions for Intelligent Driving Domain Controllers (5)
- 2.1.2 Intelligent Driving Sensors
- 2.1.2.1 ADAS Cameras
- Power Management Links of ADAS Cameras (1)
- Power Management Links of ADAS Cameras (2)
- Three Power Architecture Designs of ADAS Camera Modules (1)
- Three Power Architecture Designs of ADAS Camera Modules (2)
- Three Power Architecture Designs of ADAS Camera Modules (3)
- Mainstream Power Supply Architectures for ADAS Cameras
- Four Major Power Supply Challenges of ADAS Front-view Cameras (1)
- Four Major Power Supply Challenges of ADAS Front-view Cameras (2)
- Four Major Power Supply Challenges of ADAS Front-view Cameras (3)
- ADAS Camera PMIC Chips (1)
- ADAS Camera PMIC Chips (2)
- Power Management Solutions for Automotive Cameras (1)
- Power Management Solutions for Automotive Cameras (4)
- In-vehicle Radar: Hardware Structure
- Power Architecture Design of In-vehicle Radar (1)
- Power Architecture Design of In-vehicle Radar (2)
- Three Major Power Supply Design Challenges of Corner Radar
- Power Management Solutions for In-vehicle Radar (1)
- Power Management Solutions for In-vehicle Radar (2)
- Teardown Cases of In-vehicle Radar
- LiDAR: Hardware Composition
- LiDAR: Power Management Link
- LiDAR Power Management Chips:
- LiDAR Power Management Solutions
- Teardown Cases of In-vehicle LiDAR (1)
- Teardown Cases of In-vehicle LiDAR (2)
- 2.2 Scenario 2: Intelligent Cockpit
- 2.2.1 Intelligent Cockpit Domain Controller
- Cockpit Domain Controller: Hardware Structure
- Typical Power Architecture of Cockpit Domain Controller
- Power Supply Architecture and Performance Requirements of Cockpit Domain Controller
- Primary Power Supply Design for Cockpit Domain Controller Based on Qualcomm 8295 (1)
- Primary Power Supply Design for Cockpit Domain Controller Based on Qualcomm 8295 (5)
- Power Management Chip Products for Cockpit Domain Controller
- Power Management/Signal Chain Solutions for Cockpit Domain Controller (1)
- Power Management/Signal Chain Solutions for Cockpit Domain Controller (2)
- Power Management/Signal Chain Solutions for Cockpit Domain Controller (3)
- 2.2.2 In-vehicle Display
- In-vehicle Display: Chip Composition
- Power Supply Design Solutions for In-vehicle Display (1)
- Power Supply Design Solutions for In-vehicle Display (2)
- Power Management Chips for In-vehicle Display (1)
- Power Management Chips for In-vehicle Display (2)
- Power Management Chips for In-vehicle Display (3)
- Teardown Cases of In-vehicle Display
- 2.2.3 Automotive Audio
- Automotive Audio: Transmission Link
- Power Management/Signal Chain Solutions for Automotive Audio Systems (1)
- Power Management/Signal Chain Solutions for Automotive Audio Systems (2)
- Power Management/Signal Chain Solutions for Automotive Audio Systems (3)
- 2.3 Scenario 3: Body Electronics
- 2.3.1 Body (Zonal) Controller
- 2.3.1.1 Body (Zonal) Power Supply Module
- Zonal Controller: Hardware Composition
- Power Supply Design Challenges of Zonal Controller
- Power Supply Module Design of Zonal Controller (1)
- Power Supply Module Design of Zonal Controller (2)
- Power Management Chips for Body (Zonal) Controller (1)
- Power Management Chips for Body (Zonal) Controller (2)
- Power Management Chips for Body (Zonal) Controller (3)
- 2.3.1.2 Body (Zonal) Drive Module
- Drive Module Design of Zonal Controller (1)
- Drive Module Design of Zonal Controller (4)
- Power Supply Solutions for Off-board Capacitive Loads in Zonal Controllers (1)
- Power Supply Solutions for Off-board Capacitive Loads in Zonal Controllers (2)
- Power Supply Solutions for Off-board Capacitive Loads in Zonal Controllers (3)
- Summary of Manufacturers and Products of HSD Chips for Body (Zonal) Controllers (1)
- Summary of Manufacturers and Products of HSD Chips for Body (Zonal) Controllers (2)
- Summary of Manufacturers and Products of HSD Chips for Body (Zonal) Controllers (3)
- HSD Chips for Body (Zonal) Controllers (1)
- HSD Chips for Body (Zonal) Controllers (2)
- Summary of Manufacturers and Products of LSD Chips for Body (Zonal) Controllers (1)
- Summary of Manufacturers and Products of LSD Chips for Body (Zonal) Controllers (2)
- LSD Chips for Body (Zonal) Controllers (1)
- LSD Chips for Body (Zonal) Controllers (2)
- Summary of Manufacturers and Products of Half-bridge Driver Chips for Body (Zonal) Controllers (1)
- Summary of Manufacturers and Products of Half-bridge Driver Chips for Body (Zonal) Controllers (2)
- Half-bridge Driver Chips for Body (Zonal) Controllers (1)
- Half-bridge Driver Chips for Body (Zonal) Controllers (2)
- Summary of Manufacturers and Products of H-bridge Driver Chips for Body (Zonal) Controllers (1)
- Summary of Manufacturers and Products of H-bridge Driver Chips for Body (Zonal) Controllers (2)
- H-bridge Driver Chips for Body (Zonal) Controllers (1)
- H-bridge Driver Chips for Body (Zonal) Controllers (2)
- Summary of Manufacturers and Products of e-Fuse Chips for Body (Zonal) Controllers (1)
- Summary of Manufacturers and Products of e-Fuse Chips for Body (Zonal) Controllers (2)
- Summary of Manufacturers and Products of e-Fuse Chips for Body (Zonal) Controllers (3)
- eFuse Chips for Body (Zonal) Controllers (1)
- eFuse Chips for Body (Zonal) Controllers (2)
- 2.3.1.3 Chip Solutions and Teardown Case Body (Zonal) Controllers
- Power Management/Signal Chain Solutions for Body (Zonal) Controllers (1)
- Power Management/Signal Chain Solutions for Body (Zonal) Controllers (4)
- PCBA Teardown Cases of Body (Zonal) Controllers (1)
- PCBA Teardown Cases of Body (Zonal) Controllers (4)
- 2.3.2 Automotive Lighting
- Automotive Lighting Electronic System: Hardware Composition
- Power Architecture of Automotive Headlights (1)
- Power Architecture of Automotive Headlights (2)
- Power Architecture of Automotive Headlights (3)
- Automotive Headlights: Solution Requirements and Summary of Common Chips
- Automotive Taillights: LED Requirements
- Power Architecture of Automotive Taillights (1)
- Power Architecture of Automotive Taillights (2)
- Power Architecture of Automotive Taillights (3)
- Automotive Through-type Taillights: Solution Requirements and Summary of Common Chips
- Selection Logic of Automotive LED Lighting Driver Chips
- Selection Strategy of LED Driver Chips for Headlights
- Selection Strategy of LED Driver Chips for Taillights, Ambient Lights, and ISD (Intelligent Interactive Lights)
- Power Management Chips for Automotive Lighting Systems (1)
- Power Management Chips for Automotive Lighting Systems (4)
- Power Management Solutions for Automotive Lighting (1)
- Power Management Solutions for Automotive Lighting (4)
- 2.4 Scenario 4: Vehicle Control
- 2.4.1 Vehicle Controller/Powertrain Domain Controller
- Powertrain Domain Controller: Hardware Composition
- Power Circuit Design of Powertrain Domain Controller
- Power Management Solutions for Powertrain Domain Controller (1)
- Power Management Solutions for Powertrain Domain Controller (2)
- Power Management Solutions for Powertrain Domain Controller (3)
- PCBA Teardown Cases of Vehicle Controller/Powertrain Domain Controller
- 2.4.2 Motor Controller
- Motor Controller: Hardware Structure
- Power Architectures for Different Functional Safety Requirements of Motor Controllers (1)
- Power Architectures for Different Functional Safety Requirements of Motor Controllers (2)
- Traditional Power Supply Design of Inverters
- Next-generation Power Supply Design of Inverters
- Power Management Chips for Motor Controllers
- Power Management/Signal Chain Solutions for Motor Controllers
- PCBA Teardown Cases of Motor Controllers (1)
- PCBA Teardown Cases of Motor Controllers (2)
- 2.4.3 OBC/DC-DC
- On-board Charger (OBC): Main Components
- On-board DC-DC Converter: Main Components
- Integrated On-board Power Supply (OBC + DC-DC): Isolated Driving Required for High-voltage PFC Stage
- Power Management Solutions for On-board OBC/DC-DC (1)
- Power Management Solutions for On-board OBC/DC-DC (2)
- PCBA Teardown Cases of Integrated Two-in-one On-board Power Supply
- 2.4.4 Battery Management System (BMS)
- Battery Management System (BMS): Working Principle and Composition
- Battery Pack Control Unit (BCU/BMU): Working Principle and Component Composition
- Cell Supervision Unit (CSC/CSU): Working Principle
- Battery Disconnect Unit (BDU): Working Principle and Component Composition
- Classification of BMS System Chips
- BMS Pure Hardware Solutions
- Power Distribution System Design for BMS
- Power Management Chips for BMS
- Summary of Foreign Manufacturers and Products of BMS Analog Front-end (AFE) Chips
- Summary of Domestic Manufacturers and Products of BMS Analog Front-end (AFE) Chips (1)
- Summary of Domestic Manufacturers and Products of BMS Analog Front-end (AFE) Chips (2)
- Summary of Domestic Manufacturers and Products of BMS Analog Front-end (AFE) Chips (3)
- Battery Management IC (BMIC) Products (1)
- Battery Management IC (BMIC) Products (2)
- Battery Management IC (BMIC) Products (3)
- Power Management Solutions for BMS (1)
- Power Management Solutions for BMS (2)
- PCBA Teardown Cases of BMS (1)
- PCBA Teardown Cases of BMS (2)
- 2.4.5 Steering System
- Electric Power Steering (EPS): Working Principle and Composition
- Power Management/Signal Chain Solutions for EPS Steering Systems (1)
- Power Management/Signal Chain Solutions for EPS Steering Systems (2)
- Steer-by-Wire (SBW): Working Principle and Composition
- Steer-by-Wire (SBW): Controller Hardware Architecture
- Power Management/Signal Chain Solutions for Steer-by-Wire Systems (1)
- Power Management/Signal Chain Solutions for Steer-by-Wire Systems (2)
- Power Management/Signal Chain Solutions for Steer-by-Wire Systems (3)
- Case Power Architecture for Steering Systems
- 2.5 Scenario 5: 48V Low-voltage Power Supply
- 2.5.1 Impact of 48V Low-voltage Power Supply Architecture on Components
- Development History of Automotive Low-voltage Power Supply Architectures
- Phased Conversion of 48V Low-voltage System Components
- Summary of Component Upgrades for 48V Low-voltage Power Supply Network Architecture
- Component Efficiency of 48V Low-voltage Power Supply Network Architecture
- High-power Loads of Components in 48V Low-voltage Power Supply Network Architecture
- Development Process and Trends of Components in 48V Low-voltage Power Supply Network Architecture
- Priority Evaluation for Component Development in 48V Low-voltage Power Supply Network Architecture (1)
- Priority Evaluation for Component Development in 48V Low-voltage Power Supply Network Architecture (2)
- Priority Evaluation for Component Development in 48V Low-voltage Power Supply Network Architecture (3)
- Priority Evaluation for Component Development in 48V Low-voltage Power Supply Network Architecture (4)
- 2.5.2 Summary of 48V Component Manufacturers and Product Solutions
- Summary of Maturity of 48V Component Supply Chain
- Mainstream Power Management Solutions for 48V Applications
- Summary of 48V DC-DC Manufacturers and Products (1)
- Summary of 48V DC-DC Manufacturers and Products (2)
- 48V DC-DC Products (1)
- 48V DC-DC Products (2)
- 48V DC-DC Products (3)
- Summary of 48V LDO Manufacturers and Products
- 48V LDO Products
- Summary of Manufacturers and Products of 48V Application SBC (System Basis Chip)
- 48V SBC Chip Products
- Summary of 48V e-Fuse Manufacturers and Products
- 48V e-Fuse Products (1)
- 48V e-Fuse Products (2)
- 48V e-Fuse Products (3)
- Summary of Manufacturers and Products of 48V BLDC (Brushless DC Motor) Drivers (1)
- Summary of Manufacturers and Products of 48V BLDC (Brushless DC Motor) Drivers (2)
- Summary of Manufacturers and Products of 48V BDC (Brushed DC Motor) Drivers
- Summary of 48V Gate Driver Manufacturers and Products (1)
- Summary of 48V Gate Driver Manufacturers and Products (2)
- Summary of 48V HSD Chip Manufacturers and Products
- 48V Driver Chip Products (1)
- 48V Driver Chip Products (2)
- 48V Driver Chip Products (3)
- Chip Solutions for 48V Applications (1)
- Chip Solutions for 48V Applications (4)
- 3 Application and Market Automotive Analog Chips (by Product Type)
- 3.1 Power Management Chain: DC-DC Chips
- DC-DC Switching Regulators: Working Principle
- DC-DC Switching Regulators: Classification, Main Functions, Key Parameters, Application Scenarios
- Foreign Automotive-grade DC-DC Chip Manufacturers and Product Selection (1)
- Foreign Automotive-grade DC-DC Chip Manufacturers and Product Selection (2)
- Foreign Automotive-grade DC-DC Chip Manufacturers and Product Selection (3)
- Foreign Automotive-grade DC-DC Chips (1)
- Foreign Automotive-grade DC-DC Chips (2)
- Foreign Automotive-grade DC-DC Chips (3)
- Domestic Automotive-grade DC-DC Chip Manufacturers and Product Selection (1)
- Domestic Automotive-grade DC-DC Chip Manufacturers and Product Selection (5)
- Domestic Automotive-grade DC-DC Chips (1)
- Domestic Automotive-grade DC-DC Chips (4)
- Market Size of DC-DC Chips for China’s Passenger Cars (2022-2030E) (1)
- Market Size of DC-DC Chips for China’s Passenger Cars (2022-2030E) (2)
- 3.2 Power Management Chain: LDO Chips
- LDO Linear Regulators: Working Principle and Structural Composition
- LDO Linear Regulators: Classification, Key Indicators, Application Scenarios
- Main Automotive Application Scenarios of Tracking LDO: Power Supply for Off-board Sensors
- Key Selection Criteria for Automotive-grade LDO Linear Regulators (1)
- Key Selection Criteria for Automotive-grade LDO Linear Regulators (2)
- Foreign Automotive-grade LDO Chip Manufacturers and Product Selection
- Domestic Automotive-grade LDO Chip Manufacturers and Product Selection (1)
- Domestic Automotive-grade LDO Chip Manufacturers and Product Selection (4)
- Market Size of LDO Chips for China’s Passenger Cars (2023-2030E)
- 3.3 Power Management Chain: Driver Chips
- Driver Chips: Classification by Circuit Topology
- Driver Chips: Classification by Load Type (1)
- Driver Chips: Classification by Load Type (2)
- Driver Chips: Classification by Load Type (3)
- LED Lighting Driver Chips: Working Principle
- LED Display Driver Chips: Working Principle
- Foreign Automotive-grade LED Driver Chip Manufacturers and Product Selection
- Domestic Automotive-grade LED Driver Chip Manufacturers and Product Selection (1)
- Domestic Automotive-grade LED Driver Chip Manufacturers and Product Selection (4)
- Domestic Automotive-grade LED Driver Chips (1)
- Domestic Automotive-grade LED Driver Chips (2)
- Domestic Automotive-grade LED Driver Chips (3)
- Upgrade Directions of LED Lighting Driver Chips (1)
- Upgrade Directions of LED Lighting Driver Chips (2)
- Gate Driver Chips: Working Principle
- Gate Driver Chips: Automotive Application Scenarios
- Domestic Automotive-grade Gate Driver Chip Manufacturers and Product Selection (1)
- Domestic Automotive-grade Gate Driver Chip Manufacturers and Product Selection (4)
- Domestic Automotive-grade Gate Driver Chips
- Motor Driver Chips: Working Principle
- Motor Driver Chips: Automotive Application Scenarios
- Main Application Scenarios of DC Motors (1)
- Main Application Scenarios of DC Motors (2)
- Domestic Automotive-grade Motor Driver Chip Manufacturers and Product Selection (1)
- Domestic Automotive-grade Motor Driver Chip Manufacturers and Product Selection (2)
- Domestic Automotive-grade Motor Driver Chips
- Driver Chips: Quantity per Vehicle
- Market Size of Driver Chips for China’s Passenger Cars (2023-2030E)
- 3.4 Power Management Chain: Battery Management IC (BMIC)
- Battery Management IC (BMIC): Working Principle
- Battery Management IC (BMIC): Classification, Main Functions
- BMS AFE Chips: Working Principle
- Foreign Automotive-grade Analog Front-end (AFE) Chip Manufacturers and Product Selection (1)
- Foreign Automotive-grade Analog Front-end (AFE) Chip Manufacturers and Product Selection (2)
- Foreign Automotive-grade Analog Front-end (AFE) Chip Manufacturers and Product Selection (3)
- Domestic Automotive-grade Analog Front-end (AFE) Chip Manufacturers and Product Selection (1)
- Domestic Automotive-grade Analog Front-end (AFE) Chip Manufacturers and Product Selection (2)
- Domestic Automotive-grade Analog Front-end (AFE) Chip Manufacturers and Product Selection (3)
- Domestic Automotive-grade BMS AFE Chips (1)
- Domestic Automotive-grade BMS AFE Chips (2)
- Domestic Automotive-grade BMS AFE Chips (3)
- Market Size of AFE Chips for Chinese New Energy Passenger Cars (2022-2030E) (1)
- Market Size of AFE Chips for Chinese New Energy Passenger Cars (2022-2030E) (2)
- Market Pattern of Automotive-grade AFE Chips
- 3.5 Power Management Chain: PMIC/SBC
- Multi-channel Power Integrated PMIC: Working Principle
- Automotive-grade PMIC: Application Scenarios
- Foreign Automotive-grade PMIC Chip Manufacturers and Product Selection (1)
- Foreign Manufacturers and Product Selection of Automotive-grade PMIC Chips (4)
- Domestic Manufacturers and Product Selection of Automotive-grade PMIC Chips (1)
- Domestic Manufacturers and Product Selection of Automotive-grade PMIC Chips (2)
- Domestic Manufacturers and Product Selection of Automotive-grade PMIC Chips (3)
- Domestic Automotive-grade PMIC Chips (1)
- Domestic Automotive-grade PMIC Chips (2)
- Market Size of PMIC Chips in China's Passenger Car Market (2022-2030E)
- SBC (System Basis Chip): Working Principle
- SBC (System Basis Chip): Assisting MCU Operation
- SBC (System Basis Chip): Automotive Application Scenarios
- Foreign Manufacturers and Product Selection of Automotive-grade SBC Chips (1)
- Foreign Manufacturers and Product Selection of Automotive-grade SBC Chips (2)
- Foreign Automotive-grade SBC Chips (1)
- Foreign Automotive-grade SBC Chips (2)
- Domestic Manufacturers and Product Selection of Automotive-grade SBC Chips (1)
- Domestic Manufacturers and Product Selection of Automotive-grade SBC Chips (2)
- Domestic Automotive-grade SBC Chips (1)
- Domestic Automotive-grade SBC Chips (2)
- Market Size of SBC Chips in China's Passenger Car Market (2022-2030E)
- Market Pattern of SBC Chips in China's Passenger Car Market
- 3.6 Signal Chain: Amplifier
- Amplifier: Classification
- Operational Amplifier: Working Principle, Key Performance Indicators
- Audio Amplifier: Working Principle
- Amplifier: Automotive Application Scenarios
- Domestic Manufacturers and Product Selection of Automotive-grade Current-sensing Amplifiers (1)
- Domestic Manufacturers and Product Selection of Automotive-grade Current-sensing Amplifiers (2)
- Domestic Automotive-grade Current-sensing Amplifiers (1)
- Domestic Automotive-grade Current-sensing Amplifiers (2)
- Domestic Manufacturers and Product Selection of Automotive-grade Operational Amplifiers (1)
- Domestic Manufacturers and Product Selection of Automotive-grade Operational Amplifiers (2)
- Domestic Manufacturers and Product Selection of Automotive-grade Operational Amplifiers (3)
- Domestic Automotive-grade Operational Amplifiers (1)
- Domestic Automotive-grade Operational Amplifiers (2)
- Summary of Domestic Manufacturers and Products of Automotive-grade Audio Amplifiers
- Domestic Automotive-grade Audio Amplifiers (1)
- Domestic Automotive-grade Audio Amplifiers (2)
- Market Size of Amplifier Chips in China's Passenger Car Market (2022-2030E) (1)
- Market Size of Amplifier Chips in China's Passenger Car Market (2022-2030E) (2)
- 3.7 Signal Chain: Data Converter
- Data Converter: Working Principle
- Data Converter: Classification, Key Performance Indicators and Automotive Application Scenarios
- Types of Analog-to-Digital Converters (ADC) Used in Automotive Systems
- Enhancing Safety and Performance of Automotive Systems with ADC
- Scheme Comparison of ADC Chips: Built-in VS Standalone
- Domestic Manufacturers and Product Selection of Automotive-grade Analog-to-Digital Converters (ADC) (1)
- Domestic Manufacturers and Product Selection of Automotive-grade Analog-to-Digital Converters (ADC) (2)
- Market Size of Analog-to-Digital Converters (ADC) in China's Passenger Car Market (2022-2030E) (1)
- Market Size of Analog-to-Digital Converters (ADC) in China's Passenger Car Market (2022-2030E) (2)
- 3.8 Signal Chain: Clock Chip
- Clock Chip: Working Principle
- Clock Chip: Product Classification
- Clock Chip: Automotive Application Scenarios
- Automotive-grade Clock Oscillator: Technical Classification, Working Principle, Key Performance
- Major Manufacturers and Product Selection of Automotive-grade Oscillators
- Real-Time Clock (RTC) Chip: Automotive Application Scenarios (1)
- Real-Time Clock (RTC) Chip: Automotive Application Scenarios (2)
- Application of RTC in Intelligent Cockpit
- Application of RTC in BMS
- Manufacturers and Product Selection of Automotive-grade RTC Chips (1)
- Manufacturers and Product Selection of Automotive-grade RTC Chips (2)
- Manufacturers and Product Selection of Automotive-grade RTC Chips (3)
- Domestic Automotive-grade Clock Chips (1)
- Domestic Automotive-grade Clock Chips (2)
- Application Schemes of Clock Chips in Automobiles (1)
- Application Schemes of Clock Chips in Automobiles (2)
- Market Size of Clock Oscillators in China's Passenger Car Market (2022-2030E)
- Market Size of RTC Chips in China's Passenger Car Market (2022-2030E)
- 4 Domestic Automotive Analog Chip Vendors
- 4.1 Novosense Microelectronics
- Product Layout of Automotive Analog Chips
- Summary of Automotive-grade Power Management Chip Products (1)
- Summary of Automotive-grade Power Management Chip Products (2)
- Summary of Automotive-grade Power Management Chip Products (3)
- New Automotive-grade Power Management Chip Products (1)
- New Automotive-grade Power Management Chip Products (4)
- Integrated Solutions for Automotive-grade Driver Chips (1)
- Integrated Solutions for Automotive-grade Driver Chips (2)
- Automotive Headlight Lighting Solutions (1)
- Automotive Headlight Lighting Solutions (2)
- One-Stop Solution for Automotive LDO (1)
- One-Stop Solution for Automotive LDO (2)
- Summary of Automotive-grade Signal Chain Chip Products (1)
- Summary of Automotive-grade Signal Chain Chip Products (2)
- New Automotive-grade Signal Chain Chip Products
- 4.2 SGMICRO
- Product Layout of Automotive Analog Chips
- Supply Chain System
- Summary of Automotive-grade Power Management Chip Products (1)
- Summary of Automotive-grade Power Management Chip Products (2)
- New Automotive-grade Power Management Chip Products (1)
- New Automotive-grade Power Management Chip Products (4)
- Product Planning Path for Automotive-grade High-Side Driver Chips
- Product Planning Path for Automotive-grade Low-Side Driver Chips
- Key Technologies for High-Side Driver/e-Fuse (1)
- Key Technologies for High-Side Driver/e-Fuse (2)
- Summary of Automotive-grade Signal Chain Chip Products (1)
- Summary of Automotive-grade Signal Chain Chip Products (2)
- New Automotive-grade Signal Chain Chip Products (1)
- New Automotive-grade Signal Chain Chip Products (2)
- 4.3 Shanghai Belling
- Product Layout of Automotive Analog Chips
- Application Scenarios and Product Selection of Automotive Analog Chips (1)
- Application Scenarios and Product Selection of Automotive Analog Chips (2)
- Summary of Automotive-grade Power Management Chip Products (1)
- Summary of Automotive-grade Power Management Chip Products (2)
- Automotive Lamp Driver Solutions (1)
- Automotive Lamp Driver Solutions (2)
- Summary of Automotive-grade Signal Chain Chip Products (1)
- Summary of Automotive-grade Signal Chain Chip Products (2)
- 4.4 LEN Technology
- Product Layout of Automotive Analog Chips
- Summary of Automotive-grade Power Management Chip Products (1)
- Summary of Automotive-grade Power Management Chip Products (2)
- New Automotive-grade Power Management Chip Products (1)
- New Automotive-grade Power Management Chip Products (4)
- 4.5 Halo Microelectronics
- Product Layout of Automotive Analog Chips
- Supply Chain System and Automotive Customer Situation
- Summary of Automotive-grade Power Management Chip Products (1)
- Summary of Automotive-grade Power Management Chip Products (2)
- New Automotive-grade Power Management Chip Products (1)
- New Automotive-grade Power Management Chip Products (2)
- New Automotive-grade Power Management Chip Products (3)
- New Automotive-grade Power Management Chip Products (4)
- Power Management Solution for In-Vehicle Infotainment System
- Application Solutions for Automotive-grade High/Low-Side Switches (1)
- Application Solutions for Automotive-grade High/Low-Side Switches (2)
- 4.6 BYD Semiconductor
- Product Layout of Automotive Analog Chips
- Summary of Automotive-grade Power Management Chip Products
- Typical Automotive-grade Power Management Chip Products (1)
- Typical Automotive-grade Power Management Chip Products (2)
- BMS Chip Roadmap
- Summary of Automotive-grade Signal Chain Chip Products
- Typical BYD Automotive-grade Signal Chain Chip Products
- First-Generation Automotive BMS Chip Solution
- 4.7 YCT Electronics
- Product Layout of Automotive Analog Chips
- Latest R&D Progress of Various Automotive Electronics Product Lines in 2024
- Summary of Automotive-grade Power Management Chip Products (1)
- Summary of Automotive-grade Power Management Chip Products (2)
- Summary of Automotive-grade Power Management Chip Products (3)
- New Automotive-grade Power Management Chip Products (1)
- New Automotive-grade Power Management Chip Products (2)
- New Automotive-grade Power Management Chip Products (3)
- Power Management Solution for Automotive Seat Control Module (1)
- Power Management Solution for Automotive Seat Control Module (2)
- Power Management Solution for ADB Adaptive Headlights (1)
- Power Management Solution for ADB Adaptive Headlights (2)
- Summary of Automotive-grade Signal Chain Chip Products
- New Automotive-grade Signal Chain Chip Products
- 4.8 Silergy
- Product Layout of Automotive Analog Chips
- Summary of Automotive-grade Power Management Chip Products (1)
- Summary of Automotive-grade Power Management Chip Products (2)
- Summary of Automotive-grade Power Management Chip Products (3)
- New Automotive-grade Power Management Chip Products (1)
- New Automotive-grade Power Management Chip Products (2)
- One-Stop Solution for 12-1500V Automotive BMS (1)
- One-Stop Solution for 12-1500V Automotive BMS (2)
- Automotive Taillight System Solution
- Summary of Automotive-grade Signal Chain Chip Products
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