ABF (Ajinomoto Build-up Film) - Global Market Share and Ranking, Overall Sales and Demand Forecast 2026-2032

Ajinomoto Build-up Film™ (ABF) is a film-type thermosetting interlayer insulating dielectric used to build high-density multilayer package substrates (typically FC-BGA / “ABF substrates”); its core product forms in industry practice include (i) dielectric film supplied for lamination in build-up stacks and (ii) adjacent supply formats and intermediates such as varnish-to-film manufacturing chains (varnish applied on carrier film) that underpin volume production and conversion. ABF’s dominant applications are PC and workstation processors, servers/data centers, network equipment, and increasingly AI/HPC platforms—i.e., packages where signal integrity, wiring density, and substrate reliability are critical. The current competitive landscape remains highly concentrated: Ajinomoto discloses >95% global share for insulating films used in high-performance semiconductors, while Ajinomoto Fine-Techno’s ABF page claims near-100% share in major PCs and positions ABF as the incumbent insulation film standard in that ecosystem. At the same time, the market is actively cultivating qualified alternatives in the same functional category (build-up dielectric films); for example, Sekisui markets thermosetting build-up dielectric films for FC-BGA, asserting SAP-line compatibility and adoption by major substrate suppliers (Japan/Taiwan) with OSAT assembly experience—illustrating that “second-source” development is technically and commercially underway even if the incumbent remains dominant.

Industry trends and demand drivers are increasingly defined by AI/HPC-led substrate complexity and throughput rather than legacy PC-only growth. Ajinomoto’s ICT briefing explicitly ties ABF demand to telecommunications and information infrastructure growth (servers, data centers, networks), and quantifies the key structural driver as ABF intensity per substrate rising sharply: a representative comparison shows PC substrates using 6 ABF layers versus HPC substrates using 18 ABF layers, with larger substrate surface area (index 3.5) and an implication of >10× ABF usage per high-performance CPU substrate—a “double effect” of more units plus higher material per unit. On the technology side, the roadmap focuses on lower dielectric loss (Df) for higher-speed signaling, alongside warpage control, crack resistance, and manufacturability for finer line/space in SAP build-up; Sekisui’s development messaging explicitly references lowering Df to meet 224Gb Ethernet switch needs and beyond, reflecting where next-generation electrical requirements are headed. Supply-side responses therefore center on capacity assurance, qualification throughput, and multi-source risk mitigation: the incumbent leverages its de facto standard position (and long qualification history since first commercialization) while expanding and hardening supply chains, and challengers pursue SAP-compatible, low-loss build-up films to win incremental share through customer qualification programs in FC-BGA and adjacent advanced packaging nodes.

The global ABF (Ajinomoto Build-up Film) market size was US$ 514.07 million in 2024 and will reach US$ 1,069.09 million in 2032; it is expected to grow at a CAGR of 10.93% from 2026 to 2032.

The ABF (Ajinomoto Build-up Film) are mainly produced in Japan, about 98.66% ABF films are produced in Japan. In addition to Japan, China Taiwan and China mainland also produce small ABF films. Chiniese is expected to play an important role in the coming years.

Global key manufacturers of ABF (Ajinomoto Build-up Film) include Ajinomoto Fine-Techno, Sekisui Chemical Co., Ltd., WaferChem Technology Corporation, and Taiyo Ink, etc. Ajinomoto Fine-Techno is dominating the global ABF (Ajinomoto Build-up Film) market, with a share about 96.42 percent. In next few years, more companies are expected to enter ABF (Ajinomoto Build-up Film) market. Currently, potential entrants include Zhuhai Hongchang Electronic Materials, Xi'an Tianhe Defense Technology, LOTUS HOLDINGS, and Guangdong Hinnotech New Materials Technology.

In terms of ABF Film sales (consumption), China Taiwan, Japan, South Korea, China mainland and Southeast Asia are the key market, with market shares 41.88%, 27.13%, 10.99%, 13.91%, and 5.71% respectively. The global ABF substrates are mainly produced in these regions. In future, there regions will still dominate the global ABF substrates market. The global key manufacturers of ABF Substrate include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect, AT&S, Semco, Kyocera, and TOPPAN, etc. In 2025, the global top seven players had a share approximately 91.86% in terms of revenue. Key end users are Intel, AMD, Nvidia, Apple, and Samsung, etc. In 2025, the key end users are heating up competition to win more capacity support from suppliers of ABF substrates needed to process their HPC chips through at least 2026. Almost all of ABF substrates manufacturers have plans to expand production capacity in next few years, and there also several companies have planned to enter to produce ABF substrates. The global competitive situation will be totally different after two or five years, filled with uncertainty.

This report aims to provide a comprehensive presentation of the global market for ABF (Ajinomoto Build-up Film), focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of ABF (Ajinomoto Build-up Film) by region & country, by Product, and by Application.

The ABF (Ajinomoto Build-up Film) market size, estimations, and forecasts are provided in terms of sales volume (K square meters) and sales revenue ($ millions), considering 2025 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding ABF (Ajinomoto Build-up Film).

Market Segmentation

By Company

Ajinomoto Fine-Techno

Sekisui Chemical Co., Ltd.

WaferChem Technology Corporation

Taiyo Ink

Wuhan Sanxuan Technology

Shenzhen EPS Technology

Zhejiang Huazheng New Materials

Shenzhen Newfield New Materials Technology

Shengyi Technology

Zhuhai Hongchang Electronic Materials

Xi'an Tianhe Defense Technology

LOTUS HOLDINGS

Guangdong Hinnotech New Materials Technology

Segment by Product

Df: Above 0.01

Df: Below 0.01

Segment by Application

PC

Server/Data Center

HPC/AI CHIP

Communication

Others

Production by Region

Japan

China Taiwan

China Mainland

Sales/Consumption by Region

Japan

China Taiwan

South Korea

China Mainland

Southeast Asia

Others

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of ABF (Ajinomoto Build-up Film) manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Product, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of ABF (Ajinomoto Build-up Film) in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of ABF (Ajinomoto Build-up Film) in country level. It provides sigmate data by Product, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion. Show more