2026 Global: Automotive Power Modules Market-Competitive Review (2032) report
Description
The 2026 Global: Automotive Power Modules Market-Competitive Review (2031) report features the global market size and projected growth/decline data for the period 2021 through 2032. The report primarily provides an examination of the business strategies for the ten largest global companies in the market and how their strategies differ.
Perry/Hope Partners' reports provide the most accurate industry forecasts based on our proprietary economic models. Our forecasts project the product market size nationally and by regions for 2021 to 2032 using regression analysis in our modeling. and Perry/Hope is the only market research publisher that utilizes both longitudinal (historical) and vertical (from market section to market division to market class) analysis, since we study every manufactured product in the countries we analyze. The report also provides written analysis on the market definition, market segments, and SWOT analysis (market strengths, weaknesses, opportunities, and threats).
The market study aims at estimating the market size and the growth potential of this market. Topics analyzed within the report include a detailed breakdown of the global markets for automotive power modules market by geography and historical trend. The scope of the report extends to sizing of the automotive power modules market market and global market trends with market data for 2024 as the base year, 2025 and 2026 as the estimate years with projection of CAGR from 2027 to 2032.
The report also features a list of the top ten largest global players in the market. A review of each company includes 1) an estimate of the market share, 2) a listing of the products and/or services in the market, and 3) the features of these products and/or services in the market. The report has a chapter on Comparative Business Strategies for the largest four players. An example of the Comparative Business Strategies analysis would be -- How does Netflix's business strategy to expand its market share in the global online streaming compare to Amazon Prime's business strategy through its video products and services?
The ten market players in this report and a brief synopsis of their participation in the market are:
Infineon Technologies, Mitsubishi Electric, STMicroelectronics, ON Semiconductor, and ROHM are among the ten major companies shaping the Automotive Power Modules market with portfolios that span IGBT, MOSFET, and silicon‑carbide (SiC) based modules for traction inverters, onboard chargers and DC–DC converters; Infineon is widely cited as a market leader with significant SiC module adoption and broad OEM relationships while Mitsubishi Electric and STMicroelectronics are recognized for high‑volume automotive-qualified modules and ongoing SiC development. Hitachi (including Hitachi Power Semiconductor Device) and Semikron (now part of the Semikron‑Danfoss group) are prominent for their power semiconductor stacks and scalable module platforms—Hitachi leveraging deep automotive system integration expertise and Semikron‑Danfoss offering compact, high‑power eMPack SiC solutions targeted at EV inverters. Fuji Electric and ROHM supply robust, high‑reliability modules often used in heavy‑duty, industrial and automotive applications, with expanding SiC and hybrid SiC/Si offerings that address higher efficiency and thermal challenges in modern powertrains.
Continental, Robert Bosch, and Denso (along with Valeo and other vehicle‑tier integrators) appear frequently in market reports as major automotive systems suppliers that either incorporate third‑party power modules into complete power electronics assemblies or develop integrated power distribution and inverter modules for OEMs; these companies emphasize system integration, thermal management, and automotive certifications to meet stringent reliability requirements. Several pure‑play semiconductor firms and newer SiC specialists—Wolfspeed, BYD (module and vertical integration), and a number of regional players—are also influencing the competitive landscape by pushing SiC performance and ramping manufacturing capacity, which is accelerating OEM migration from IGBT to SiC MOSFET solutions for higher efficiency and faster charging. Market analyses consistently describe the market as concentrated, with a few large semiconductor vendors and automotive suppliers holding the majority of high‑voltage traction module share while smaller, specialized suppliers compete in niche and low‑voltage segments.
Across the top ten and adjacent players the strategic focus is clear: scale SiC production, qualify automotive AEC‑grade modules, and deepen OEM partnerships to secure multi‑year supply agreements and design wins for next‑generation EV platforms; recent industry moves include capacity expansions, collaborations between module suppliers and automakers, and the emergence of integrated module platforms (e.g., compact SiC eMPack variants) intended to reduce inverter size and improve thermal performance. Regional dynamics favor Asia‑Pacific for rapid capacity growth and vehicle electrification, while Europe and North America remain pivotal for advanced R&D and high‑volume OEM programs, making supply chain diversification and long‑term wafer-to‑module roadmaps central competitive factors for the leading companies identified above.
Perry/Hope Partners' reports provide the most accurate industry forecasts based on our proprietary economic models. Our forecasts project the product market size nationally and by regions for 2021 to 2032 using regression analysis in our modeling. and Perry/Hope is the only market research publisher that utilizes both longitudinal (historical) and vertical (from market section to market division to market class) analysis, since we study every manufactured product in the countries we analyze. The report also provides written analysis on the market definition, market segments, and SWOT analysis (market strengths, weaknesses, opportunities, and threats).
The market study aims at estimating the market size and the growth potential of this market. Topics analyzed within the report include a detailed breakdown of the global markets for automotive power modules market by geography and historical trend. The scope of the report extends to sizing of the automotive power modules market market and global market trends with market data for 2024 as the base year, 2025 and 2026 as the estimate years with projection of CAGR from 2027 to 2032.
The report also features a list of the top ten largest global players in the market. A review of each company includes 1) an estimate of the market share, 2) a listing of the products and/or services in the market, and 3) the features of these products and/or services in the market. The report has a chapter on Comparative Business Strategies for the largest four players. An example of the Comparative Business Strategies analysis would be -- How does Netflix's business strategy to expand its market share in the global online streaming compare to Amazon Prime's business strategy through its video products and services?
The ten market players in this report and a brief synopsis of their participation in the market are:
Infineon Technologies, Mitsubishi Electric, STMicroelectronics, ON Semiconductor, and ROHM are among the ten major companies shaping the Automotive Power Modules market with portfolios that span IGBT, MOSFET, and silicon‑carbide (SiC) based modules for traction inverters, onboard chargers and DC–DC converters; Infineon is widely cited as a market leader with significant SiC module adoption and broad OEM relationships while Mitsubishi Electric and STMicroelectronics are recognized for high‑volume automotive-qualified modules and ongoing SiC development. Hitachi (including Hitachi Power Semiconductor Device) and Semikron (now part of the Semikron‑Danfoss group) are prominent for their power semiconductor stacks and scalable module platforms—Hitachi leveraging deep automotive system integration expertise and Semikron‑Danfoss offering compact, high‑power eMPack SiC solutions targeted at EV inverters. Fuji Electric and ROHM supply robust, high‑reliability modules often used in heavy‑duty, industrial and automotive applications, with expanding SiC and hybrid SiC/Si offerings that address higher efficiency and thermal challenges in modern powertrains.
Continental, Robert Bosch, and Denso (along with Valeo and other vehicle‑tier integrators) appear frequently in market reports as major automotive systems suppliers that either incorporate third‑party power modules into complete power electronics assemblies or develop integrated power distribution and inverter modules for OEMs; these companies emphasize system integration, thermal management, and automotive certifications to meet stringent reliability requirements. Several pure‑play semiconductor firms and newer SiC specialists—Wolfspeed, BYD (module and vertical integration), and a number of regional players—are also influencing the competitive landscape by pushing SiC performance and ramping manufacturing capacity, which is accelerating OEM migration from IGBT to SiC MOSFET solutions for higher efficiency and faster charging. Market analyses consistently describe the market as concentrated, with a few large semiconductor vendors and automotive suppliers holding the majority of high‑voltage traction module share while smaller, specialized suppliers compete in niche and low‑voltage segments.
Across the top ten and adjacent players the strategic focus is clear: scale SiC production, qualify automotive AEC‑grade modules, and deepen OEM partnerships to secure multi‑year supply agreements and design wins for next‑generation EV platforms; recent industry moves include capacity expansions, collaborations between module suppliers and automakers, and the emergence of integrated module platforms (e.g., compact SiC eMPack variants) intended to reduce inverter size and improve thermal performance. Regional dynamics favor Asia‑Pacific for rapid capacity growth and vehicle electrification, while Europe and North America remain pivotal for advanced R&D and high‑volume OEM programs, making supply chain diversification and long‑term wafer-to‑module roadmaps central competitive factors for the leading companies identified above.
Table of Contents
32 Pages
- 1.0 Scope of Report and Methodology
- 2.0 Market SWOT Analysis and Players
- 2.1 Market Definition
- 2.2 Market Segments
- 2.3 Market Strengths
- 2.4 Market Weaknesses
- 2.5 Market Threats
- 2.6 Market Opportunities
- 2.7 Major Players
- 3.0 Competitive Analysis
- 3.1 Market Player 1
- 3.2 Market Player 2
- 3.3 Market Player 3
- 3.4 Market Player 4
- 3.5 Market Player 5
- 3.6 Market Player 6
- 3.7 Market Player 7
- 3.8 Market Player 8
- 3.9 Market Player 9
- 3.10 Market Player 10
- 4.0 Comparative Business Strategies
- 4.1 Comparative Business Strategies of Player 1 and 2
- 4.2 Comparative Business Strategies of Player 1 and 3
- 4.3 Comparative Business Strategies of Player 1 and 4
- 4.4 Comparative Business Strategies of Player 2 and 3
- 4.5 Comparative Business Strategies of Player 2 and 4
- 4.6 Comparative Business Strategies of Player 3 and 4
- 5.0 Appendix
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