2026 Global: 5G Printed Circuit Board Market -Competitive Review (2032) report
Description
The 2026 Global: 5G Printed Circuit Board Market -Competitive Review (2031) report features the global market size and projected growth/decline data for the period 2021 through 2032. The report primarily provides an examination of the business strategies for the ten largest global companies in the market and how their strategies differ.
Perry/Hope Partners' reports provide the most accurate industry forecasts based on our proprietary economic models. Our forecasts project the product market size nationally and by regions for 2021 to 2032 using regression analysis in our modeling. and Perry/Hope is the only market research publisher that utilizes both longitudinal (historical) and vertical (from market section to market division to market class) analysis, since we study every manufactured product in the countries we analyze. The report also provides written analysis on the market definition, market segments, and SWOT analysis (market strengths, weaknesses, opportunities, and threats).
The market study aims at estimating the market size and the growth potential of this market. Topics analyzed within the report include a detailed breakdown of the global markets for 5g printed circuit board market by geography and historical trend. The scope of the report extends to sizing of the 5g printed circuit board market market and global market trends with market data for 2024 as the base year, 2025 and 2026 as the estimate years with projection of CAGR from 2027 to 2032.
The report also features a list of the top ten largest global players in the market. A review of each company includes 1) an estimate of the market share, 2) a listing of the products and/or services in the market, and 3) the features of these products and/or services in the market. The report has a chapter on Comparative Business Strategies for the largest four players. An example of the Comparative Business Strategies analysis would be -- How does Netflix's business strategy to expand its market share in the global online streaming compare to Amazon Prime's business strategy through its video products and services?
The ten market players in this report and a brief synopsis of their participation in the market are:
Unimicron, TTM Technologies, Zhen Ding Technology (ZDT), Compeq, Nippon Mektron, Samsung Electro-Mechanics, Flex (Flex Ltd.), Sumitomo Electric, Nan Ya PCB, and Jabil are among the ten major companies shaping the 5G printed circuit board (PCB) market due to their scale, advanced materials capabilities, and focus on high-frequency and high-density interconnect (HDI) technologies. Unimicron is a leading Taiwanese PCB manufacturer with extensive production of HDI, rigid‑flex, RF/microwave and IC‑substrate products used in 5G infrastructure and handsets, partnering with global OEMs to supply high‑layer‑count and high‑speed boards. TTM Technologies (U.S.) supplies RF, microwave and HDI PCBs for telecommunications and 5G applications and maintains a global footprint for high‑performance boards and advanced packaging, positioning it as a primary supplier for 5G infrastructure and network equipment manufacturers. Zhen Ding Technology (ZDT) is a major contract PCB and flexible PCB producer in Greater China with strong capabilities in FPC, rigid‑flex and RF boards that support 5G base stations, small cells and consumer devices through automated, high‑throughput production lines. Compeq (Taiwan) produces multilayer HDI, rigid‑flex and RF boards for smartphones and telecom hardware, enabling miniaturized, high‑frequency interconnects critical to 5G handsets and modules. Nippon Mektron (Japan) is a global leader in flexible printed circuits (FPC), supplying ultra‑thin, high‑reliability interconnects for 5G smartphones and CPE devices and leveraging deep R&D in fine‑pitch and high‑frequency flexible substrates. Samsung Electro‑Mechanics develops advanced FPC, RF and high‑frequency boards integrated into Samsung’s device ecosystem and network equipment, investing in miniaturization and high‑frequency materials for 5G applications. Flex (Flex Ltd.) provides large‑scale electronics manufacturing and integrated PCB solutions—HDI, rigid‑flex and RF boards—combined with system assembly and supply‑chain services for telecom OEMs deploying 5G equipment and consumer devices. Sumitomo Electric brings advanced materials science and conductor/insulation technologies to high‑frequency PCBs and is investing in next‑generation network substrates that address 5G performance and thermal requirements. Nan Ya PCB (part of the Nan Ya/China‑based groups) and related Taiwanese manufacturers produce HDI, multilayer and IC‑substrate boards for mobile devices and telecom infrastructure, supporting high‑speed signaling and impedance‑controlled RF traces used in 5G radios and modules. Jabil offers end‑to‑end electronics manufacturing including HDI and rigid‑flex PCBs, leveraging systems integration and rapid scalability for OEMs rolling out 5G devices and infrastructure equipment. Each company differentiates through one or more strengths—materials/substrates, high‑layer HDI processing, flexible/rigid‑flex expertise, RF/microwave capability, or large‑scale EMS integration—making them principal suppliers in the 5G PCB supply chain.
Perry/Hope Partners' reports provide the most accurate industry forecasts based on our proprietary economic models. Our forecasts project the product market size nationally and by regions for 2021 to 2032 using regression analysis in our modeling. and Perry/Hope is the only market research publisher that utilizes both longitudinal (historical) and vertical (from market section to market division to market class) analysis, since we study every manufactured product in the countries we analyze. The report also provides written analysis on the market definition, market segments, and SWOT analysis (market strengths, weaknesses, opportunities, and threats).
The market study aims at estimating the market size and the growth potential of this market. Topics analyzed within the report include a detailed breakdown of the global markets for 5g printed circuit board market by geography and historical trend. The scope of the report extends to sizing of the 5g printed circuit board market market and global market trends with market data for 2024 as the base year, 2025 and 2026 as the estimate years with projection of CAGR from 2027 to 2032.
The report also features a list of the top ten largest global players in the market. A review of each company includes 1) an estimate of the market share, 2) a listing of the products and/or services in the market, and 3) the features of these products and/or services in the market. The report has a chapter on Comparative Business Strategies for the largest four players. An example of the Comparative Business Strategies analysis would be -- How does Netflix's business strategy to expand its market share in the global online streaming compare to Amazon Prime's business strategy through its video products and services?
The ten market players in this report and a brief synopsis of their participation in the market are:
Unimicron, TTM Technologies, Zhen Ding Technology (ZDT), Compeq, Nippon Mektron, Samsung Electro-Mechanics, Flex (Flex Ltd.), Sumitomo Electric, Nan Ya PCB, and Jabil are among the ten major companies shaping the 5G printed circuit board (PCB) market due to their scale, advanced materials capabilities, and focus on high-frequency and high-density interconnect (HDI) technologies. Unimicron is a leading Taiwanese PCB manufacturer with extensive production of HDI, rigid‑flex, RF/microwave and IC‑substrate products used in 5G infrastructure and handsets, partnering with global OEMs to supply high‑layer‑count and high‑speed boards. TTM Technologies (U.S.) supplies RF, microwave and HDI PCBs for telecommunications and 5G applications and maintains a global footprint for high‑performance boards and advanced packaging, positioning it as a primary supplier for 5G infrastructure and network equipment manufacturers. Zhen Ding Technology (ZDT) is a major contract PCB and flexible PCB producer in Greater China with strong capabilities in FPC, rigid‑flex and RF boards that support 5G base stations, small cells and consumer devices through automated, high‑throughput production lines. Compeq (Taiwan) produces multilayer HDI, rigid‑flex and RF boards for smartphones and telecom hardware, enabling miniaturized, high‑frequency interconnects critical to 5G handsets and modules. Nippon Mektron (Japan) is a global leader in flexible printed circuits (FPC), supplying ultra‑thin, high‑reliability interconnects for 5G smartphones and CPE devices and leveraging deep R&D in fine‑pitch and high‑frequency flexible substrates. Samsung Electro‑Mechanics develops advanced FPC, RF and high‑frequency boards integrated into Samsung’s device ecosystem and network equipment, investing in miniaturization and high‑frequency materials for 5G applications. Flex (Flex Ltd.) provides large‑scale electronics manufacturing and integrated PCB solutions—HDI, rigid‑flex and RF boards—combined with system assembly and supply‑chain services for telecom OEMs deploying 5G equipment and consumer devices. Sumitomo Electric brings advanced materials science and conductor/insulation technologies to high‑frequency PCBs and is investing in next‑generation network substrates that address 5G performance and thermal requirements. Nan Ya PCB (part of the Nan Ya/China‑based groups) and related Taiwanese manufacturers produce HDI, multilayer and IC‑substrate boards for mobile devices and telecom infrastructure, supporting high‑speed signaling and impedance‑controlled RF traces used in 5G radios and modules. Jabil offers end‑to‑end electronics manufacturing including HDI and rigid‑flex PCBs, leveraging systems integration and rapid scalability for OEMs rolling out 5G devices and infrastructure equipment. Each company differentiates through one or more strengths—materials/substrates, high‑layer HDI processing, flexible/rigid‑flex expertise, RF/microwave capability, or large‑scale EMS integration—making them principal suppliers in the 5G PCB supply chain.
Table of Contents
32 Pages
- 1.0 Scope of Report and Methodology
- 2.0 Market SWOT Analysis and Players
- 2.1 Market Definition
- 2.2 Market Segments
- 2.3 Market Strengths
- 2.4 Market Weaknesses
- 2.5 Market Threats
- 2.6 Market Opportunities
- 2.7 Major Players
- 3.0 Competitive Analysis
- 3.1 Market Player 1
- 3.2 Market Player 2
- 3.3 Market Player 3
- 3.4 Market Player 4
- 3.5 Market Player 5
- 3.6 Market Player 6
- 3.7 Market Player 7
- 3.8 Market Player 8
- 3.9 Market Player 9
- 3.10 Market Player 10
- 4.0 Comparative Business Strategies
- 4.1 Comparative Business Strategies of Player 1 and 2
- 4.2 Comparative Business Strategies of Player 1 and 3
- 4.3 Comparative Business Strategies of Player 1 and 4
- 4.4 Comparative Business Strategies of Player 2 and 3
- 4.5 Comparative Business Strategies of Player 2 and 4
- 4.6 Comparative Business Strategies of Player 3 and 4
- 5.0 Appendix
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