Conductive Die Attach Film - Global Industry Market Analysis Report 2020-2031

Conductive Die Attach Film (CDAF) is a high-performance adhesive material used in semiconductor packaging. It is usually in the form of a film and is used to firmly attach the chip (die) to the substrate or lead frame through a hot pressing or curing process. It is made of an organic resin (such as epoxy resin, acrylic resin or silicone) and a conductive filler (such as silver, gold or copper particles). It has excellent electrical and thermal conductivity and can achieve electrical connection and heat transfer at the same time. This material is widely used in microelectronics, such as integrated circuits (ICs), power devices and LED packaging, because it can effectively improve device performance and reliability.

The main advantages of conductive die attach film are its process controllability and performance stability. Compared with traditional conductive pastes, it can provide a uniform bonding layer thickness (usually between 10-40 microns), avoiding the common problems of overflow, tilting or uneven thickness when applying the paste. This feature is particularly important in high-density packaging and miniaturization designs, such as in stacked chips or multi-chip modules (MCMs), where CDAF can ensure precise chip positioning and stable electrical and thermal connections. In addition, conductive die attach film is often used in combination with dicing tape to form dicing die attach film (DDAF), which simplifies the process from wafer dicing to chip mounting and improves production efficiency. For example, silver-filled CDAF is particularly suitable for applications that require efficient heat dissipation and electromagnetic shielding due to its high thermal conductivity (about 6 W/m·K) and low resistivity (5×10⁻³ to 5×10⁻⁴ ohm-cm).

However, conductive die attach film also has some limitations. Its production process involves precise coating and lamination technology, and the production cost is high, especially when precious metal fillers such as gold or silver are used, the price rises further. In addition, the applicability of the film in high temperature or high pressure processes needs to match the equipment, such as electron beam evaporation or specific hot pressing conditions, which may constitute a technical threshold for small and medium-sized enterprises. At the same time, its flexibility is not as good as liquid adhesives, which may be limited in the mounting of some ultra-thin or complex-shaped chips. Nevertheless, as the semiconductor industry's demand for high-performance packaging increases, CDAF research and development continues to advance, such as by optimizing filler ratios or developing low-temperature curing formulas, and its application range and cost-effectiveness are improving.

From the perspective of industry applications, conductive die film plays a key role in power electronics and 5G-related devices. For example, in power modules, it can effectively manage thermal stress in high-temperature working environments to ensure the stability of long-term operation of devices; in RF devices, its conductivity supports high-speed signal transmission while reducing signal loss. In addition, some new CDAFs have integrated antistatic or high temperature resistance properties to meet the stringent requirements of aerospace and automotive electronics. Overall, conductive die film represents the trend of semiconductor packaging technology towards high precision and high reliability. With breakthroughs in material science and manufacturing processes, its potential in the future smart devices and new energy fields will be further released.

Report Scope

This report aims to deliver a thorough analysis of the global market for Conductive Die Attach Film, offering both quantitative and qualitative insights to assist readers in formulating business growth strategies, evaluating the competitive landscape, understanding their current market position, and making well-informed decisions regarding Conductive Die Attach Film.

The report is enriched with qualitative evaluations, including market drivers, challenges, Porter's Five Forces, regulatory frameworks, consumer preferences, and ESG (Environmental, Social, and Governance) factors.

The report provides detailed classification of Conductive Die Attach Film, such as type, etc.; detailed examples of Conductive Die Attach Film applications, such as application one, etc., and provides comprehensive historical (2020-2025) and forecast (2026-2031) market size data.

The report provides detailed classification of Conductive Die Attach Film, such as 8 Inch, 12 Inch, Others, etc.; detailed examples of Conductive Die Attach Film applications, such as Discrete Devices, Large Scale Integrated Devices, Others, etc., and provides comprehensive historical (2020-2025) and forecast (2026-2031) market size data.

The report covers key global regions-North America, Europe, Asia-Pacific, Latin America, and the Middle East & Africa-providing granular, country-specific insights for major markets such as the United States, China, Germany, and Brazil.

The report deeply explores the competitive landscape of Conductive Die Attach Film products, details the sales, revenue, and regional layout of some of the world's leading manufacturers, and provides in-depth company profiles and contact details.

The report contains a comprehensive industry chain analysis covering raw materials, downstream customers and sales channels.

Core Chapters

Chapter One: Introduces the study scope of this report, market status, market drivers, challenges, porters five forces analysis, regulatory policy, consumer preference, market attractiveness and ESG analysis.
Chapter Two: market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Conductive Die Attach Film market sales and revenue in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter Four: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Five: Detailed analysis of Conductive Die Attach Film manufacturers competitive landscape, price, sales, revenue, market share, footprint, merger, and acquisition information, etc.
Chapter Six: Provides profiles of leading manufacturers, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction.
Chapter Seven: Analysis of industrial chain, key raw materials, customers and sales channel.
Chapter Eight: Key Takeaways and Final Conclusions
Chapter Nine: Methodology and Sources.