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Global Solder Industry Trends Analysis Report 2025, Forecast to 2033 (Broken Down by Type, End User, Regional Analysis, and Competitive Landscape)

Publisher Maia Research
Published Aug 21, 2025
Length 115 Pages
SKU # MAIR20322019

Description

The Global Solder Market size is projected at USD 5081.94 Million in 2025 and is expected to reach USD 6825.94 Million in 2033, growing at a CAGR of 3.76% from 2025 to 2033.

This global Solder market research report provides a comprehensive overview by conducting both qualitative and quantitative analysis of the market, sharing concrete numbers and thorough insights from different market segments. The quantitative analysis includes both historical and forecast data of various market segments, while the qualitative analysis of market dynamics including growth drivers, challenges, constraints, etc. provides in-depth insight into the market situation and prospects.

Besides, the study maps the leading as well as the fastest-growing regional markets. It further enables stakeholders to identify the key country-level markets within each region.

As a crucial part of the Solder market, we provide competitive landscape analysis which incorporates the market ranking of the major players, along with new service/product launches, business expansions, acquisitions, and performance in the past five years. That allows stakeholders to understand their competitive environment and provides insight into the current positions of key players in the market.

The readers of this report will understand how the Solder market status has changed across the globe under the Russia-Ukraine War and inflation.

Key players in the global Solder market are covered in Chapter 4 and Chapter 8:

Yik Shing Tat Industrial
Hybrid Metals
DKL Metals
Shenmao Technology
Persang Alloy Industries
Senju Metal Industry
Shengdao Tin
Hangzhou Youbang
Shaoxing Tianlong Tin Materials
Nihon Handa
Zhejiang Asia-welding
Henkel
Nihon Superior
Qiandao
Yunnan Tin
Heraeus
KOKI
AIM Metals & Alloys
Anson Solder
Koki Products
Tamura Corp
Tongfang Tech
Indium Corporation
Nihon Almit
Alpha Assembly Solutions
Huachuang
QLG
Balver Zinn
Kester
Qualitek International

In Chapter 6 and Chapter 9.1, on the basis of types, the Solder market from 2020 to 2033 is primarily split into:

Solder Paste
Preformed Solder
Solder Wires
Solder Bars
Others

In Chapter 7 and Chapter 9.2, on the basis of End Users, the Solder market from 2020 to 2033 covers:

In-car Application
Consumer Electronics Application
Industrial Application
Others

Geographically, the detailed analysis of consumption, revenue, market share and growth rate, historical and forecast (2020-2033) of the following regions are covered in Chapter 5 and Chapter 10:

North America
United States
Canada
Europe
Germany
France
United Kingdom
Spain
Russia
Poland
Others
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Others
Latin America
Mexico
Brazil
Others
Middle East and Africa
GCC
South Africa
Others

Outline:


This report consists of 11 chapters. Below is a brief guideline to help you quickly grasp the main contents of each chapter:
Chapter 1 mainly defines the market scope and introduces the Solder industry, with an executive summary of different market segments (by type, end user, region, etc.), and general regulatory environment analysis.
Chapter 2 is the analysis of the whole market industry chain, covering key raw materials and suppliers, business mode and production process, cost structure analysis, and alternative product, also providing information on major distributors, and downstream customers.
Chapter 3 provides a qualitative analysis of the market dynamics, including market drivers, constraints and challenges, emerging market trends, PESTEL analysis, consumer insights, and the impact of the Russia and Ukraine war.
Chapter 4 analyzes the current competitive situation of the market by providing data regarding the players, including their revenue and sales volume with corresponding market shares, and prices. In addition, information about market concentration rates, key product launch news, mergers & acquisitions, expansion plans will also be covered.
Chapter 5 focuses on the regional market, presenting detailed historical data (i.e. sales volume, revenue) of the most representative regions and countries in the world.
Chapters 6-7 analyze the historical market sales volume, revenue, share, and price by breaking data on the basis of different product types, as well as the downstream end-user market, with the aim of helping readers understand the market more deeply.
Chapter 8 shares a profile of the key players in the market, together with their corporation information, product portfolio and specification, market performance (i.e. sales volume, price, revenue, gross margin), business and markets served, recent developments/updates, etc.
Chapters 9-10 provide an analysis of the development trends over the next few years in terms of product type, end-users, major regions and countries.
Chapter 11 concludes with an explanation of the data sources and research methods. Analysis and verification are conducted through preliminary research to obtain final quantitative and qualitative data.

Years considered for this report:

Historical Years: 2020-2024
Base Year: 2024
Estimated Year: 2025
Forecast Period: 2025-2033

Table of Contents

115 Pages
Chapter 1 Market Overview
Chapter 2 Industry Chain Analysis
Chapter 3 Market Dynamics
Chapter 4 Market Competitive Landscape
Chapter 5 Global Solder Market Historical Development by Geographic Region (2020-2025)
Chapter 6 Global Solder Market Historical Development by Product Type (2020-2025)
Chapter 7 Global Solder Market Historical Development by End User (2020-2025)
Chapter 8 Leading Companies Profiles
Chapter 9 Global Solder Market Forecast by Product Type and End User (2025-2033)
Chapter 10 Global Solder Market Forecast by Geographic Region (2025-2033)
Chapter 11 Appendix
List of Tables and Figures
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