Global eSIM Module Market Growth 2026-2032
Description
The global eSIM Module market size is predicted to grow from US$ 1026 million in 2025 to US$ 1859 million in 2032; it is expected to grow at a CAGR of 9.0% from 2026 to 2032.
eSIM (Embedded SIM) is a user identification technology that embeds the traditional SIM card directly into the device rather than as an independent removable component. The eSIM module is a hardware module that supports eSIM technology, allowing users to use mobile services by downloading and activating operator profiles without a physical SIM card.
Built to GSMA specifications, eSIM Module incorporate secure elements for authentication, encryption, and remote provisioning, allowing users to switch carriers or service plans over the air. Found in smartphones, tablets, wearables, IoT devices, and connected vehicles, ESIM Module supports multiple profiles, enhances device design flexibility, and simplifies global connectivity management. In 2024, the shipment volume of eSIM ICs will be about 500 million pieces, with an average price of US$2 per piece.
The upstream of eSIM Module involves the design and fabrication of secure integrated circuits by semiconductor manufacturers, including the development of embedded SIM hardware, secure elements, operating systems, and cryptographic modules. This stage requires advanced foundry processes, secure IC packaging, and compliance with GSMA standards for remote SIM provisioning. The downstream encompasses device makers—such as smartphone, tablet, wearable, automotive, and IoT manufacturers—who integrate eSIM Module into their products, as well as mobile network operators and connectivity platforms that activate, manage, and remotely provision subscriber profiles. Further downstream, eSIM-enabled devices flow into consumer and industrial sectors where users benefit from flexible carrier switching, enhanced device miniaturization, and improved security. Together, the value chain links semiconductor innovation upstream with global connectivity services and mass-market device deployment downstream.
The eSIM Module market is evolving from a niche convenience feature into a foundational connectivity layer for consumer devices, automotive telematics and massive IoT — driven by demand for remote provisioning, smaller form factors, stronger security, and simplified logistics for device makers and operators. Key growth drivers are automotive OEMs standardizing on embedded UICCs for lifetime connectivity, the explosion of wearables and connected industrial sensors that benefit from zero-touch provisioning, and operators shifting business models toward subscription-based, multi-profile services; likewise, enterprises value the ability to manage fleets centrally (SM-DP+/SM-SR platforms). Obstacles remain: certification and GSMA-compliance overhead, operator commercial resistance in some markets, fragmentation of provisioning ecosystems, and the technical/organizational complexity of integrating eUICC, OTA platforms and lifecycle management. Two important technical trends shape the near future — iSIM (SIM functionality integrated into main SoCs) which pushes further miniaturization and cost down, and tighter convergence of eSIM with secure connectivity stacks and modem vendors (reducing BOM and integration pain). Regionally, adoption is fastest where regulators and operators support remote provisioning and where device segments (automotive, wearables) are concentrated; emerging markets lag where operator models and certification create barriers. For incumbents and new entrants alike the winning strategy is clear: invest in GSMA-compliant security, build strong operator and SM-DP partnerships, offer robust lifecycle management tools, and roadmap iSIM-capable solutions — because once provisioning and business models align, eSIM becomes a default connectivity choice rather than an optional feature.
LP Information, Inc. (LPI) ' newest research report, the “eSIM Module Industry Forecast” looks at past sales and reviews total world eSIM Module sales in 2025, providing a comprehensive analysis by region and market sector of projected eSIM Module sales for 2026 through 2032. With eSIM Module sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world eSIM Module industry.
This Insight Report provides a comprehensive analysis of the global eSIM Module landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on eSIM Module portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global eSIM Module market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for eSIM Module and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global eSIM Module.
This report presents a comprehensive overview, market shares, and growth opportunities of eSIM Module market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
MFF2 Form-factor
WLCSP Form-factor
Others
Segmentation by Speed:
5G
4G/5G Compatible
Segmentation by Market-oriented:
M2M Market
Public Consumer Market
Segmentation by Application:
Consumer Electronics
Internet of Things
Automobile
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
STMicroelectronics
NXP
Infineon
Thales Group
GCT Semiconductor
IDEMIA
Giesecke+Devrient
VALID
GCT Semiconductor
Workz (Trasna)
Unigroup Guoxin Microelectronics
HuaDa Semiconductor
Henghui Technology
Key Questions Addressed in this Report
What is the 10-year outlook for the global eSIM Module market?
What factors are driving eSIM Module market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do eSIM Module market opportunities vary by end market size?
How does eSIM Module break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
eSIM (Embedded SIM) is a user identification technology that embeds the traditional SIM card directly into the device rather than as an independent removable component. The eSIM module is a hardware module that supports eSIM technology, allowing users to use mobile services by downloading and activating operator profiles without a physical SIM card.
Built to GSMA specifications, eSIM Module incorporate secure elements for authentication, encryption, and remote provisioning, allowing users to switch carriers or service plans over the air. Found in smartphones, tablets, wearables, IoT devices, and connected vehicles, ESIM Module supports multiple profiles, enhances device design flexibility, and simplifies global connectivity management. In 2024, the shipment volume of eSIM ICs will be about 500 million pieces, with an average price of US$2 per piece.
The upstream of eSIM Module involves the design and fabrication of secure integrated circuits by semiconductor manufacturers, including the development of embedded SIM hardware, secure elements, operating systems, and cryptographic modules. This stage requires advanced foundry processes, secure IC packaging, and compliance with GSMA standards for remote SIM provisioning. The downstream encompasses device makers—such as smartphone, tablet, wearable, automotive, and IoT manufacturers—who integrate eSIM Module into their products, as well as mobile network operators and connectivity platforms that activate, manage, and remotely provision subscriber profiles. Further downstream, eSIM-enabled devices flow into consumer and industrial sectors where users benefit from flexible carrier switching, enhanced device miniaturization, and improved security. Together, the value chain links semiconductor innovation upstream with global connectivity services and mass-market device deployment downstream.
The eSIM Module market is evolving from a niche convenience feature into a foundational connectivity layer for consumer devices, automotive telematics and massive IoT — driven by demand for remote provisioning, smaller form factors, stronger security, and simplified logistics for device makers and operators. Key growth drivers are automotive OEMs standardizing on embedded UICCs for lifetime connectivity, the explosion of wearables and connected industrial sensors that benefit from zero-touch provisioning, and operators shifting business models toward subscription-based, multi-profile services; likewise, enterprises value the ability to manage fleets centrally (SM-DP+/SM-SR platforms). Obstacles remain: certification and GSMA-compliance overhead, operator commercial resistance in some markets, fragmentation of provisioning ecosystems, and the technical/organizational complexity of integrating eUICC, OTA platforms and lifecycle management. Two important technical trends shape the near future — iSIM (SIM functionality integrated into main SoCs) which pushes further miniaturization and cost down, and tighter convergence of eSIM with secure connectivity stacks and modem vendors (reducing BOM and integration pain). Regionally, adoption is fastest where regulators and operators support remote provisioning and where device segments (automotive, wearables) are concentrated; emerging markets lag where operator models and certification create barriers. For incumbents and new entrants alike the winning strategy is clear: invest in GSMA-compliant security, build strong operator and SM-DP partnerships, offer robust lifecycle management tools, and roadmap iSIM-capable solutions — because once provisioning and business models align, eSIM becomes a default connectivity choice rather than an optional feature.
LP Information, Inc. (LPI) ' newest research report, the “eSIM Module Industry Forecast” looks at past sales and reviews total world eSIM Module sales in 2025, providing a comprehensive analysis by region and market sector of projected eSIM Module sales for 2026 through 2032. With eSIM Module sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world eSIM Module industry.
This Insight Report provides a comprehensive analysis of the global eSIM Module landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on eSIM Module portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global eSIM Module market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for eSIM Module and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global eSIM Module.
This report presents a comprehensive overview, market shares, and growth opportunities of eSIM Module market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
MFF2 Form-factor
WLCSP Form-factor
Others
Segmentation by Speed:
5G
4G/5G Compatible
Segmentation by Market-oriented:
M2M Market
Public Consumer Market
Segmentation by Application:
Consumer Electronics
Internet of Things
Automobile
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
STMicroelectronics
NXP
Infineon
Thales Group
GCT Semiconductor
IDEMIA
Giesecke+Devrient
VALID
GCT Semiconductor
Workz (Trasna)
Unigroup Guoxin Microelectronics
HuaDa Semiconductor
Henghui Technology
Key Questions Addressed in this Report
What is the 10-year outlook for the global eSIM Module market?
What factors are driving eSIM Module market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do eSIM Module market opportunities vary by end market size?
How does eSIM Module break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
117 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for eSIM Module by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for eSIM Module by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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