Global Wireless IoT Chip Market Growth 2026-2032
Description
The global Wireless IoT Chip market size is predicted to grow from US$ 14362 million in 2025 to US$ 36835 million in 2032; it is expected to grow at a CAGR of 14.5% from 2026 to 2032.
Wireless IoT chips refer to application-specific integrated circuits (ICs) designed for IoT terminals and edge nodes, with "wireless connectivity" as their core capability. They typically appear as single-chip SoCs, SiP module chips, or key communication chips. Under constraints of power consumption, size, and cost, they integrate wireless transceiver and protocol processing capabilities (RF transceiver, baseband/modulation/demodulation, protocol stack acceleration, etc.) with local control/computing capabilities (MCU/lightweight SoC), storage interfaces, power management, and security capabilities (hardware encryption, key management, secure boot, etc.) at the system level. This enables devices to complete data acquisition, edge processing, and reliable transmission to other devices or the cloud, supporting full lifecycle functions such as remote monitoring, control, and OTA upgrades. The key performance indicators for wireless IoT chips are not simply computing power, but rather system performance under comprehensive constraints such as connectivity coverage, link reliability, power consumption and battery life, RF performance, anti-interference capabilities, certification compliance, and security levels. It supports various wireless standards, including short-range connections (such as Wi-Fi, Bluetooth LE, Zigbee/Thread, UWB, etc.), LPWAN, and cellular IoT (such as LoRa/LoRaWAN, NB-IoT, LTE-M, etc.), to meet the diverse needs of consumer IoT and commercial/industrial IoT in terms of coverage, latency, throughput, cost, and reliability. In 2025, global Wireless IoT chip production reached 5,521.83 million units, with an average price of approximately US$2.66 per unit and a gross profit margin of 20.05%-55.26%. Downstream customers include Apple, Google, Amazon, Xiaomi, Logitech, Lenovo, Skyworth, Changhong, Haier, JBL, Sony, and Narwal.
From a competitive landscape perspective, core wireless IoT chip manufacturers mainly include Qualcomm, Texas Instruments, Semtech Corporation, Nordic Semiconductor, and Renesas Electronics, while also encompassing key players such as Broadcom, MediaTek, Realtek, NXP, Infineon, and STMicroelectronics. In 2024, industry concentration was high, with the top ten manufacturers holding approximately 71.0% of the market share. The leading global manufacturers were primarily Broadcom, Qualcomm, and MediaTek, collectively holding approximately 30.2% of the market share; the second tier included Realtek, NXP, Infineon, and Renesas Electronics, collectively holding approximately 27.0%. As leading manufacturers continue to strengthen their advantages in multi-protocol platform SoCs, ecosystems and channels, and customer certification systems, market share will continue to concentrate on the top players in the short term. However, in high-growth regions like China, structural substitution will accelerate the redistribution of market share.
From a regional perspective, the Chinese market is one of the core variables determining global economic conditions and market share changes. In 2024, the Chinese market size was US$4,770.67 million, accounting for approximately 36.3% of the global market; it is projected to reach US$12,742.03 million by 2031, increasing its global share to 38.8%. Strong consumer demand will further accelerate local supply chain collaboration and the pace of domestic substitution, making the Chinese market one of the most competitive and fastest-evolving regions for products in the coming years.
In terms of product type and technological evolution, Bluetooth and Bluetooth Low Energy (BLE) remain the most prevalent technology (approximately 57.3% share in 2024, projected to reach 52.5% in 2031), with advantages in ultra-low power consumption and a mature ecosystem. Meanwhile, the share of Wi-Fi IoT continues to increase (approximately 21.7% in 2024, projected to reach 23.6% in 2031), primarily benefiting from the growth in direct-connect networks and the demand for higher bandwidth. Multi-protocol interconnectivity, represented by Zigbee/Thread/Matter, is steadily increasing its market share under the trend of "platformization" in smart homes (approximately 9.9% by 2031), while cellular and LPWAN routes are more reflected in structural growth in specific industry scenarios.
From the application perspective, smart homes remain the core scenario for large-scale deployment, with a stable market share of approximately 34.1% in 2024. Revenue is projected to grow at a CAGR of approximately 14.2% from 2025 to 2031, continuing to benefit from home network upgrades, increased demand for cross-brand interconnectivity, and the penetration of multi-protocol integrated SoCs. Overall, industry competition will intensify in the coming years, especially in the Chinese market, where price, delivery, and ecosystem integration will jointly determine market share changes. Long-term winners will primarily depend on low power consumption and RF performance, protocol stacks and software ecosystems, platform-based product iteration efficiency, and the ability to replicate success at scale with leading customers and channel systems.
LP Information, Inc. (LPI) ' newest research report, the “Wireless IoT Chip Industry Forecast” looks at past sales and reviews total world Wireless IoT Chip sales in 2025, providing a comprehensive analysis by region and market sector of projected Wireless IoT Chip sales for 2026 through 2032. With Wireless IoT Chip sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wireless IoT Chip industry.
This Insight Report provides a comprehensive analysis of the global Wireless IoT Chip landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wireless IoT Chip portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Wireless IoT Chip market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wireless IoT Chip and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wireless IoT Chip.
This report presents a comprehensive overview, market shares, and growth opportunities of Wireless IoT Chip market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
BLE
Wi-Fi IoT
Zigbee/Thread/Matter
Cellular IoT
LoRaWAN IoT
Others
Segmentation by Area:
Consumer IoT
Commercial IoT
Segmentation by Process:
22nm
40nm
55nm
Others
Segmentation by Application:
Smart Home
Smart Healthcare
Retail Logistics
Consumer Electronics
Automotive Electronics
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Broadcomm
Qualcomm
Texas Instruments
Semtech Corporation
Nordic Semiconductor
Renesas Electronics (Dialog Semiconductor)
Silicon Labs
NXP Semiconductors
STMicroelectronics
Realtek Semiconductor Corporation
Infineon
Microchip Technology
Toshiba
Sequans
Onsemi
MediaTek
Qorvo
UNISOC
Telink Semiconductor (shanghai)co.,ltd.
Shenzhen HiSilicon Technologies
ASR Microelectronics Co., Ltd.
Zhuhai All Winner Technology
Espressif Systems
Beken Corporation
Key Questions Addressed in this Report
What is the 10-year outlook for the global Wireless IoT Chip market?
What factors are driving Wireless IoT Chip market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Wireless IoT Chip market opportunities vary by end market size?
How does Wireless IoT Chip break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Wireless IoT chips refer to application-specific integrated circuits (ICs) designed for IoT terminals and edge nodes, with "wireless connectivity" as their core capability. They typically appear as single-chip SoCs, SiP module chips, or key communication chips. Under constraints of power consumption, size, and cost, they integrate wireless transceiver and protocol processing capabilities (RF transceiver, baseband/modulation/demodulation, protocol stack acceleration, etc.) with local control/computing capabilities (MCU/lightweight SoC), storage interfaces, power management, and security capabilities (hardware encryption, key management, secure boot, etc.) at the system level. This enables devices to complete data acquisition, edge processing, and reliable transmission to other devices or the cloud, supporting full lifecycle functions such as remote monitoring, control, and OTA upgrades. The key performance indicators for wireless IoT chips are not simply computing power, but rather system performance under comprehensive constraints such as connectivity coverage, link reliability, power consumption and battery life, RF performance, anti-interference capabilities, certification compliance, and security levels. It supports various wireless standards, including short-range connections (such as Wi-Fi, Bluetooth LE, Zigbee/Thread, UWB, etc.), LPWAN, and cellular IoT (such as LoRa/LoRaWAN, NB-IoT, LTE-M, etc.), to meet the diverse needs of consumer IoT and commercial/industrial IoT in terms of coverage, latency, throughput, cost, and reliability. In 2025, global Wireless IoT chip production reached 5,521.83 million units, with an average price of approximately US$2.66 per unit and a gross profit margin of 20.05%-55.26%. Downstream customers include Apple, Google, Amazon, Xiaomi, Logitech, Lenovo, Skyworth, Changhong, Haier, JBL, Sony, and Narwal.
From a competitive landscape perspective, core wireless IoT chip manufacturers mainly include Qualcomm, Texas Instruments, Semtech Corporation, Nordic Semiconductor, and Renesas Electronics, while also encompassing key players such as Broadcom, MediaTek, Realtek, NXP, Infineon, and STMicroelectronics. In 2024, industry concentration was high, with the top ten manufacturers holding approximately 71.0% of the market share. The leading global manufacturers were primarily Broadcom, Qualcomm, and MediaTek, collectively holding approximately 30.2% of the market share; the second tier included Realtek, NXP, Infineon, and Renesas Electronics, collectively holding approximately 27.0%. As leading manufacturers continue to strengthen their advantages in multi-protocol platform SoCs, ecosystems and channels, and customer certification systems, market share will continue to concentrate on the top players in the short term. However, in high-growth regions like China, structural substitution will accelerate the redistribution of market share.
From a regional perspective, the Chinese market is one of the core variables determining global economic conditions and market share changes. In 2024, the Chinese market size was US$4,770.67 million, accounting for approximately 36.3% of the global market; it is projected to reach US$12,742.03 million by 2031, increasing its global share to 38.8%. Strong consumer demand will further accelerate local supply chain collaboration and the pace of domestic substitution, making the Chinese market one of the most competitive and fastest-evolving regions for products in the coming years.
In terms of product type and technological evolution, Bluetooth and Bluetooth Low Energy (BLE) remain the most prevalent technology (approximately 57.3% share in 2024, projected to reach 52.5% in 2031), with advantages in ultra-low power consumption and a mature ecosystem. Meanwhile, the share of Wi-Fi IoT continues to increase (approximately 21.7% in 2024, projected to reach 23.6% in 2031), primarily benefiting from the growth in direct-connect networks and the demand for higher bandwidth. Multi-protocol interconnectivity, represented by Zigbee/Thread/Matter, is steadily increasing its market share under the trend of "platformization" in smart homes (approximately 9.9% by 2031), while cellular and LPWAN routes are more reflected in structural growth in specific industry scenarios.
From the application perspective, smart homes remain the core scenario for large-scale deployment, with a stable market share of approximately 34.1% in 2024. Revenue is projected to grow at a CAGR of approximately 14.2% from 2025 to 2031, continuing to benefit from home network upgrades, increased demand for cross-brand interconnectivity, and the penetration of multi-protocol integrated SoCs. Overall, industry competition will intensify in the coming years, especially in the Chinese market, where price, delivery, and ecosystem integration will jointly determine market share changes. Long-term winners will primarily depend on low power consumption and RF performance, protocol stacks and software ecosystems, platform-based product iteration efficiency, and the ability to replicate success at scale with leading customers and channel systems.
LP Information, Inc. (LPI) ' newest research report, the “Wireless IoT Chip Industry Forecast” looks at past sales and reviews total world Wireless IoT Chip sales in 2025, providing a comprehensive analysis by region and market sector of projected Wireless IoT Chip sales for 2026 through 2032. With Wireless IoT Chip sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wireless IoT Chip industry.
This Insight Report provides a comprehensive analysis of the global Wireless IoT Chip landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wireless IoT Chip portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Wireless IoT Chip market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wireless IoT Chip and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wireless IoT Chip.
This report presents a comprehensive overview, market shares, and growth opportunities of Wireless IoT Chip market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
BLE
Wi-Fi IoT
Zigbee/Thread/Matter
Cellular IoT
LoRaWAN IoT
Others
Segmentation by Area:
Consumer IoT
Commercial IoT
Segmentation by Process:
22nm
40nm
55nm
Others
Segmentation by Application:
Smart Home
Smart Healthcare
Retail Logistics
Consumer Electronics
Automotive Electronics
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Broadcomm
Qualcomm
Texas Instruments
Semtech Corporation
Nordic Semiconductor
Renesas Electronics (Dialog Semiconductor)
Silicon Labs
NXP Semiconductors
STMicroelectronics
Realtek Semiconductor Corporation
Infineon
Microchip Technology
Toshiba
Sequans
Onsemi
MediaTek
Qorvo
UNISOC
Telink Semiconductor (shanghai)co.,ltd.
Shenzhen HiSilicon Technologies
ASR Microelectronics Co., Ltd.
Zhuhai All Winner Technology
Espressif Systems
Beken Corporation
Key Questions Addressed in this Report
What is the 10-year outlook for the global Wireless IoT Chip market?
What factors are driving Wireless IoT Chip market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Wireless IoT Chip market opportunities vary by end market size?
How does Wireless IoT Chip break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
161 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Wireless IoT Chip by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Wireless IoT Chip by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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