Global Wafer UV Film and Non-UV Film (Blue Film) Market Growth 2025-2031
Description
The global Wafer UV Film and Non-UV Film (Blue Film) market size is predicted to grow from US$ 673 million in 2025 to US$ 917 million in 2031; it is expected to grow at a CAGR of 5.3% from 2025 to 2031.
In the semiconductor process, the UV film and non-UV film used in wafers are also called UV tape and non-UV tape. Among them, non-UV tape is usually called blue film, which is mainly used in semiconductor grinding and cutting processes. Whether it is grinding tape or cutting tape, it includes non-UV tape (Non-UV Tape) and UV tape (UV Tape). Non-UV type is a general traditional pressure-sensitive tape. Considering the easy peeling, its adhesion is generally lower than that of UV type (before UV exposure), about 100~400 gf/25mm; UV tape is a pressure-sensitive tape with high adhesion strength before exposure. After exposure to UV light, its peeling force will be greatly reduced. It not only has strong fixation to the adherend, but also has the advantage of easy peeling after the process purpose is achieved. Wafer back grinding tape (BG Tape) mainly refers to the protection and fixation of the front circuit of the wafer during the back grinding and thinning after the wafer is completed, and prevents the damage of the front circuit of the wafer during the back grinding of the wafer. Dicing Tape is mainly used for fixing, cutting, expanding, UV debonding, and separation in semiconductor wafer and packaging processes.DAF film is used to bond chips and substrates during semiconductor packaging.
Functional film materials can be divided into "product component films" and "product process films" according to their applications. UV and non-UV tapes for semiconductors are one type of product process films. With the continuous development of the semiconductor industry and the iteration and update of technology, a large number of new high-performance functional film materials have been generated, which has put forward higher requirements for manufacturers in many aspects such as polymer material structure design and formula design. The expansion of the semiconductor industry has driven the strong growth of demand for semiconductor tapes.
The upstream materials of functional films are mainly monopolized by well-known foreign companies such as LINTEC Corporation, Nitto Denko, Furukawa Electric, Mitsui Chemicals Tohcello, Resonac, and Henkel Adhesives. These companies entered the industry early, accumulated rich industry experience, and mastered the core technologies of UV and non-UV film material product research and development and production. At the same time, relying on a complete product system and a global sales network, they have established a good brand image in the industry and occupied a large market share. In contrast, my country started late in the UV and non-UV film industry, and its technical strength is relatively weak, with a certain gap between it and the leading level abroad. In addition, there are a large number of small and medium-sized enterprises in the industry, and the business scale is generally small, which leads to a significant gap in technical strength between China and foreign companies.
From the perspective of the global competition landscape, the global semiconductor materials industry is still dominated by countries such as Japan, the United States, and South Korea. Although the sales scale of China's semiconductor materials continues to increase, from the perspective of overall technical level and scale, there is still a large gap between Chinese semiconductor materials companies and global industry leaders.
LP Information, Inc. (LPI) ' newest research report, the “Wafer UV Film and Non-UV Film (Blue Film) Industry Forecast” looks at past sales and reviews total world Wafer UV Film and Non-UV Film (Blue Film) sales in 2024, providing a comprehensive analysis by region and market sector of projected Wafer UV Film and Non-UV Film (Blue Film) sales for 2025 through 2031. With Wafer UV Film and Non-UV Film (Blue Film) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer UV Film and Non-UV Film (Blue Film) industry.
This Insight Report provides a comprehensive analysis of the global Wafer UV Film and Non-UV Film (Blue Film) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer UV Film and Non-UV Film (Blue Film) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Wafer UV Film and Non-UV Film (Blue Film) market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer UV Film and Non-UV Film (Blue Film) and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer UV Film and Non-UV Film (Blue Film).
This report presents a comprehensive overview, market shares, and growth opportunities of Wafer UV Film and Non-UV Film (Blue Film) market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
UV Film
Non-UV Film
Segmentation by Application:
Back Grinding
Wafer Dicing
Semiconductor packaging (DAF)
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Mitsui Chemicals Tohcello
LINTEC
Denka
Nitto Denko
Furukawa Electric
Sumitomo Bakelite
D&X
AI Technology
ULTRON SYSTEM
Maxell
Resonac
Henkel Adhesives
LG Chem
Suzhou BoYan Jingjin Photoelectric
WISE new material
Vistaic
NDS
KGK Chemical
NEXTECK
Key Questions Addressed in this Report
What is the 10-year outlook for the global Wafer UV Film and Non-UV Film (Blue Film) market?
What factors are driving Wafer UV Film and Non-UV Film (Blue Film) market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Wafer UV Film and Non-UV Film (Blue Film) market opportunities vary by end market size?
How does Wafer UV Film and Non-UV Film (Blue Film) break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
In the semiconductor process, the UV film and non-UV film used in wafers are also called UV tape and non-UV tape. Among them, non-UV tape is usually called blue film, which is mainly used in semiconductor grinding and cutting processes. Whether it is grinding tape or cutting tape, it includes non-UV tape (Non-UV Tape) and UV tape (UV Tape). Non-UV type is a general traditional pressure-sensitive tape. Considering the easy peeling, its adhesion is generally lower than that of UV type (before UV exposure), about 100~400 gf/25mm; UV tape is a pressure-sensitive tape with high adhesion strength before exposure. After exposure to UV light, its peeling force will be greatly reduced. It not only has strong fixation to the adherend, but also has the advantage of easy peeling after the process purpose is achieved. Wafer back grinding tape (BG Tape) mainly refers to the protection and fixation of the front circuit of the wafer during the back grinding and thinning after the wafer is completed, and prevents the damage of the front circuit of the wafer during the back grinding of the wafer. Dicing Tape is mainly used for fixing, cutting, expanding, UV debonding, and separation in semiconductor wafer and packaging processes.DAF film is used to bond chips and substrates during semiconductor packaging.
Functional film materials can be divided into "product component films" and "product process films" according to their applications. UV and non-UV tapes for semiconductors are one type of product process films. With the continuous development of the semiconductor industry and the iteration and update of technology, a large number of new high-performance functional film materials have been generated, which has put forward higher requirements for manufacturers in many aspects such as polymer material structure design and formula design. The expansion of the semiconductor industry has driven the strong growth of demand for semiconductor tapes.
The upstream materials of functional films are mainly monopolized by well-known foreign companies such as LINTEC Corporation, Nitto Denko, Furukawa Electric, Mitsui Chemicals Tohcello, Resonac, and Henkel Adhesives. These companies entered the industry early, accumulated rich industry experience, and mastered the core technologies of UV and non-UV film material product research and development and production. At the same time, relying on a complete product system and a global sales network, they have established a good brand image in the industry and occupied a large market share. In contrast, my country started late in the UV and non-UV film industry, and its technical strength is relatively weak, with a certain gap between it and the leading level abroad. In addition, there are a large number of small and medium-sized enterprises in the industry, and the business scale is generally small, which leads to a significant gap in technical strength between China and foreign companies.
From the perspective of the global competition landscape, the global semiconductor materials industry is still dominated by countries such as Japan, the United States, and South Korea. Although the sales scale of China's semiconductor materials continues to increase, from the perspective of overall technical level and scale, there is still a large gap between Chinese semiconductor materials companies and global industry leaders.
LP Information, Inc. (LPI) ' newest research report, the “Wafer UV Film and Non-UV Film (Blue Film) Industry Forecast” looks at past sales and reviews total world Wafer UV Film and Non-UV Film (Blue Film) sales in 2024, providing a comprehensive analysis by region and market sector of projected Wafer UV Film and Non-UV Film (Blue Film) sales for 2025 through 2031. With Wafer UV Film and Non-UV Film (Blue Film) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer UV Film and Non-UV Film (Blue Film) industry.
This Insight Report provides a comprehensive analysis of the global Wafer UV Film and Non-UV Film (Blue Film) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer UV Film and Non-UV Film (Blue Film) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Wafer UV Film and Non-UV Film (Blue Film) market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer UV Film and Non-UV Film (Blue Film) and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer UV Film and Non-UV Film (Blue Film).
This report presents a comprehensive overview, market shares, and growth opportunities of Wafer UV Film and Non-UV Film (Blue Film) market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
UV Film
Non-UV Film
Segmentation by Application:
Back Grinding
Wafer Dicing
Semiconductor packaging (DAF)
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Mitsui Chemicals Tohcello
LINTEC
Denka
Nitto Denko
Furukawa Electric
Sumitomo Bakelite
D&X
AI Technology
ULTRON SYSTEM
Maxell
Resonac
Henkel Adhesives
LG Chem
Suzhou BoYan Jingjin Photoelectric
WISE new material
Vistaic
NDS
KGK Chemical
NEXTECK
Key Questions Addressed in this Report
What is the 10-year outlook for the global Wafer UV Film and Non-UV Film (Blue Film) market?
What factors are driving Wafer UV Film and Non-UV Film (Blue Film) market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Wafer UV Film and Non-UV Film (Blue Film) market opportunities vary by end market size?
How does Wafer UV Film and Non-UV Film (Blue Film) break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
133 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Wafer UV Film and Non-UV Film (Blue Film) by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Wafer UV Film and Non-UV Film (Blue Film) by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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