Global Wafer Thinning Protective Tape Market Growth 2025-2031
Description
The global Wafer Thinning Protective Tape market size is predicted to grow from US$ 409 million in 2025 to US$ 709 million in 2031; it is expected to grow at a CAGR of 9.6% from 2025 to 2031.
Wafer thinning protective tape, also known as wafer backgrinding tape, is a specialized tape used in the semiconductor industry. It is applied to the backside of a semiconductor wafer before the process of thinning or grinding the wafer to reduce its thickness.
This report studies wafer backgrinding tapes, include the UV and Non-UV tapes used in wafer back-grinding process.
In terms of consumption side, China Taiwan is currently the world's largest consumer market, accounting for 34.0% of the market share in 2023, followed by mainland China and North America, accounting for 27.4% and 9.27% respectively. Southeast Asia is expected to grow fastest in the next few years, with a CAGR of approximately 10.6% during 2024-2030.
From the production side, Japan is the largest production area, and the key manufacturers are mainly headquartered in Japan. In 2023, Japan accounted for approximately 83% of the production share. It is expected that in the next few years, the production of wafer tape in the Chinese market will maintain the fastest growth rate, and the share is expected to reach 9.41% in 2030.
In terms of product type, UV wafer tape has a higher proportion, with a share of 62.5% in 2023 and an estimated share of 64% in 2030.
From the perspective of manufacturers, the key manufacturers of semiconductor wafer tapes worldwide mainly include Mitsui Chemicals, LINTEC Corporation, Furukawa Electric, Denka, Nitto Denko Corporation, Maxell Sliontec and Sekisui Chemical. In 2023, the top five manufacturers in the world accounted for about 82.5% of the market share. Chinese local manufacturers of wafer tapes are currently mainly in the verification and small batch stages. Representative companies include Shanghai Guke Adhesive Tape Technology, Plusco Tech, Taicang Zhanxin Adhesive Material, Cybrid Technologies, ZZSM, BYE POLYMER MATERIAL, ZHONGSHAN CROWN ADHESIVE PRODUCTS, Yantai Darbond Technology and Sunliky New Material Technology. It is expected that in the next few years, Chinese local companies will gradually grow and occupy a higher share in the Chinese market.
LP Information, Inc. (LPI) ' newest research report, the “Wafer Thinning Protective Tape Industry Forecast” looks at past sales and reviews total world Wafer Thinning Protective Tape sales in 2024, providing a comprehensive analysis by region and market sector of projected Wafer Thinning Protective Tape sales for 2025 through 2031. With Wafer Thinning Protective Tape sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer Thinning Protective Tape industry.
This Insight Report provides a comprehensive analysis of the global Wafer Thinning Protective Tape landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer Thinning Protective Tape portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Wafer Thinning Protective Tape market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer Thinning Protective Tape and breaks down the forecast by Peel-off Method, by Base Film, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer Thinning Protective Tape.
This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Thinning Protective Tape market by product type, application, key manufacturers and key regions and countries.
Segmentation by Peel-off Method:
UV BG Process Tape
Non-UV BG Process Tape
Segmentation by Base Film:
PO BG Process Tape
PVC BG Process Tape
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Mitsui Chemicals
LINTEC Corporation
Denka
Nitto Denko Corporation
Furukawa Electric
Sekisui Chemical
Maxell Sliontec
D&X Co., Ltd
KGK Chemical Corporation
AI Technology, Inc. (AIT)
Daehyun ST
Solar Plus Company
Alliance Material Co., Ltd (AMC)
Shanghai Guke Adhesive Tape Technology
Plusco Tech
Taicang Zhanxin Adhesive Material
Cybrid Technologies
ZZSM
ZHONGSHAN CROWN ADHESIVE PRODUCTS
Yantai Darbond Technology
GTA Material
Key Questions Addressed in this Report
What is the 10-year outlook for the global Wafer Thinning Protective Tape market?
What factors are driving Wafer Thinning Protective Tape market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Wafer Thinning Protective Tape market opportunities vary by end market size?
How does Wafer Thinning Protective Tape break out by Peel-off Method, by Base Film?
Please note: The report will take approximately 2 business days to prepare and deliver.
Wafer thinning protective tape, also known as wafer backgrinding tape, is a specialized tape used in the semiconductor industry. It is applied to the backside of a semiconductor wafer before the process of thinning or grinding the wafer to reduce its thickness.
This report studies wafer backgrinding tapes, include the UV and Non-UV tapes used in wafer back-grinding process.
In terms of consumption side, China Taiwan is currently the world's largest consumer market, accounting for 34.0% of the market share in 2023, followed by mainland China and North America, accounting for 27.4% and 9.27% respectively. Southeast Asia is expected to grow fastest in the next few years, with a CAGR of approximately 10.6% during 2024-2030.
From the production side, Japan is the largest production area, and the key manufacturers are mainly headquartered in Japan. In 2023, Japan accounted for approximately 83% of the production share. It is expected that in the next few years, the production of wafer tape in the Chinese market will maintain the fastest growth rate, and the share is expected to reach 9.41% in 2030.
In terms of product type, UV wafer tape has a higher proportion, with a share of 62.5% in 2023 and an estimated share of 64% in 2030.
From the perspective of manufacturers, the key manufacturers of semiconductor wafer tapes worldwide mainly include Mitsui Chemicals, LINTEC Corporation, Furukawa Electric, Denka, Nitto Denko Corporation, Maxell Sliontec and Sekisui Chemical. In 2023, the top five manufacturers in the world accounted for about 82.5% of the market share. Chinese local manufacturers of wafer tapes are currently mainly in the verification and small batch stages. Representative companies include Shanghai Guke Adhesive Tape Technology, Plusco Tech, Taicang Zhanxin Adhesive Material, Cybrid Technologies, ZZSM, BYE POLYMER MATERIAL, ZHONGSHAN CROWN ADHESIVE PRODUCTS, Yantai Darbond Technology and Sunliky New Material Technology. It is expected that in the next few years, Chinese local companies will gradually grow and occupy a higher share in the Chinese market.
LP Information, Inc. (LPI) ' newest research report, the “Wafer Thinning Protective Tape Industry Forecast” looks at past sales and reviews total world Wafer Thinning Protective Tape sales in 2024, providing a comprehensive analysis by region and market sector of projected Wafer Thinning Protective Tape sales for 2025 through 2031. With Wafer Thinning Protective Tape sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer Thinning Protective Tape industry.
This Insight Report provides a comprehensive analysis of the global Wafer Thinning Protective Tape landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer Thinning Protective Tape portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Wafer Thinning Protective Tape market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer Thinning Protective Tape and breaks down the forecast by Peel-off Method, by Base Film, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer Thinning Protective Tape.
This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Thinning Protective Tape market by product type, application, key manufacturers and key regions and countries.
Segmentation by Peel-off Method:
UV BG Process Tape
Non-UV BG Process Tape
Segmentation by Base Film:
PO BG Process Tape
PVC BG Process Tape
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Mitsui Chemicals
LINTEC Corporation
Denka
Nitto Denko Corporation
Furukawa Electric
Sekisui Chemical
Maxell Sliontec
D&X Co., Ltd
KGK Chemical Corporation
AI Technology, Inc. (AIT)
Daehyun ST
Solar Plus Company
Alliance Material Co., Ltd (AMC)
Shanghai Guke Adhesive Tape Technology
Plusco Tech
Taicang Zhanxin Adhesive Material
Cybrid Technologies
ZZSM
ZHONGSHAN CROWN ADHESIVE PRODUCTS
Yantai Darbond Technology
GTA Material
Key Questions Addressed in this Report
What is the 10-year outlook for the global Wafer Thinning Protective Tape market?
What factors are driving Wafer Thinning Protective Tape market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Wafer Thinning Protective Tape market opportunities vary by end market size?
How does Wafer Thinning Protective Tape break out by Peel-off Method, by Base Film?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
165 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Wafer Thinning Protective Tape by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Wafer Thinning Protective Tape by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
Pricing
Currency Rates
Questions or Comments?
Our team has the ability to search within reports to verify it suits your needs. We can also help maximize your budget by finding sections of reports you can purchase.
