Global Wafer Thinning and Dicing Film Market Growth 2025-2031
Description
The global Wafer Thinning and Dicing Film market size is predicted to grow from US$ 1089 million in 2025 to US$ 1333 million in 2031; it is expected to grow at a CAGR of 3.4% from 2025 to 2031.
Tapes are mainly used in two major processes of wafer back grinding and wafer dicing in semiconductor applications. Both grinding tape and dicing tape include Non-UV Tape and UV Tape. Non-UV type refers to the general traditional pressure-sensitive adhesive tape. Considering the ease of peeling, its adhesive force is generally lower than that of UV type (before UV exposure), which is about 100~400 gf/25mm. UV tape is a pressure-sensitive tape with high adhesive strength before exposure, and its peel force will be greatly reduced after exposure to UV light. Wafer back grinding tape (BG Tape) mainly refers to the protection and fixation of the front circuit of the wafer when the back grinding is thinned after the wafer is manufactured, and prevents damage to the front circuit of the wafer during the back grinding of the wafer. The dicing tape (Dicing Tape) is mainly used for fixing, dicing, expansion, UV debonding, separation, etc. in the semiconductor wafer and packaging process.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
LP Information, Inc. (LPI) ' newest research report, the “Wafer Thinning and Dicing Film Industry Forecast” looks at past sales and reviews total world Wafer Thinning and Dicing Film sales in 2024, providing a comprehensive analysis by region and market sector of projected Wafer Thinning and Dicing Film sales for 2025 through 2031. With Wafer Thinning and Dicing Film sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer Thinning and Dicing Film industry.
This Insight Report provides a comprehensive analysis of the global Wafer Thinning and Dicing Film landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer Thinning and Dicing Film portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Wafer Thinning and Dicing Film market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer Thinning and Dicing Film and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer Thinning and Dicing Film.
This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Thinning and Dicing Film market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
UV Film
Non-UV Film
Segmentation by Application:
Back Grinding
Wafer Dicing
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Mitsui Chemicals Tohcello
LINTEC
Denka
Nitto
Furukawa Electric
Sumitomo Bakelite
D&X
AI Technology
ULTRON SYSTEM
maxell
NDS
KGK Chemical
NEXTECK
WISE new material
Vistaic
Suzhou BoYan Jingjin Photoelectric
Key Questions Addressed in this Report
What is the 10-year outlook for the global Wafer Thinning and Dicing Film market?
What factors are driving Wafer Thinning and Dicing Film market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Wafer Thinning and Dicing Film market opportunities vary by end market size?
How does Wafer Thinning and Dicing Film break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Tapes are mainly used in two major processes of wafer back grinding and wafer dicing in semiconductor applications. Both grinding tape and dicing tape include Non-UV Tape and UV Tape. Non-UV type refers to the general traditional pressure-sensitive adhesive tape. Considering the ease of peeling, its adhesive force is generally lower than that of UV type (before UV exposure), which is about 100~400 gf/25mm. UV tape is a pressure-sensitive tape with high adhesive strength before exposure, and its peel force will be greatly reduced after exposure to UV light. Wafer back grinding tape (BG Tape) mainly refers to the protection and fixation of the front circuit of the wafer when the back grinding is thinned after the wafer is manufactured, and prevents damage to the front circuit of the wafer during the back grinding of the wafer. The dicing tape (Dicing Tape) is mainly used for fixing, dicing, expansion, UV debonding, separation, etc. in the semiconductor wafer and packaging process.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
LP Information, Inc. (LPI) ' newest research report, the “Wafer Thinning and Dicing Film Industry Forecast” looks at past sales and reviews total world Wafer Thinning and Dicing Film sales in 2024, providing a comprehensive analysis by region and market sector of projected Wafer Thinning and Dicing Film sales for 2025 through 2031. With Wafer Thinning and Dicing Film sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer Thinning and Dicing Film industry.
This Insight Report provides a comprehensive analysis of the global Wafer Thinning and Dicing Film landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer Thinning and Dicing Film portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Wafer Thinning and Dicing Film market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer Thinning and Dicing Film and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer Thinning and Dicing Film.
This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Thinning and Dicing Film market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
UV Film
Non-UV Film
Segmentation by Application:
Back Grinding
Wafer Dicing
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Mitsui Chemicals Tohcello
LINTEC
Denka
Nitto
Furukawa Electric
Sumitomo Bakelite
D&X
AI Technology
ULTRON SYSTEM
maxell
NDS
KGK Chemical
NEXTECK
WISE new material
Vistaic
Suzhou BoYan Jingjin Photoelectric
Key Questions Addressed in this Report
What is the 10-year outlook for the global Wafer Thinning and Dicing Film market?
What factors are driving Wafer Thinning and Dicing Film market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Wafer Thinning and Dicing Film market opportunities vary by end market size?
How does Wafer Thinning and Dicing Film break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
137 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Wafer Thinning and Dicing Film by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Wafer Thinning and Dicing Film by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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