Global Wafer Stripping Equipment Market Growth 2025-2031
Description
The global Wafer Stripping Equipment market size is predicted to grow from US$ 924 million in 2025 to US$ 1390 million in 2031; it is expected to grow at a CAGR of 7.1% from 2025 to 2031.
Wafer stripping equipment is used in semiconductor manufacturing for the process of removing or "stripping" photoresist or other films from the surface of silicon wafers after lithography or etching processes. This step is critical in ensuring the wafer is clean and free from any unwanted materials before proceeding to the next stages of production, such as deposition, doping, or further etching.
United States market for Wafer Stripping Equipment is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
China market for Wafer Stripping Equipment is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Europe market for Wafer Stripping Equipment is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Global key Wafer Stripping Equipment players cover PSK, Hitachi High-Tech, Lam Research, TES, ULVAC, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.
LP Information, Inc. (LPI) ' newest research report, the “Wafer Stripping Equipment Industry Forecast” looks at past sales and reviews total world Wafer Stripping Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Wafer Stripping Equipment sales for 2025 through 2031. With Wafer Stripping Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer Stripping Equipment industry.
This Insight Report provides a comprehensive analysis of the global Wafer Stripping Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer Stripping Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Wafer Stripping Equipment market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer Stripping Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer Stripping Equipment.
This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Stripping Equipment market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Dry Method
Wet Method
Segmentation by Application:
Semiconductors
Display Panels
MEMS
Optoelectronic Devices
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
PSK
Hitachi High-Tech
Lam Research
TES
ULVAC
NSC Engineering
Ultra T Equipment
RENA Technologies
Kedsemi
NAURA Technology
ACM Research
Beijing E-Town Semiconductor Technology
Xinda Semiconductor Equipment
Key Questions Addressed in this Report
What is the 10-year outlook for the global Wafer Stripping Equipment market?
What factors are driving Wafer Stripping Equipment market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Wafer Stripping Equipment market opportunities vary by end market size?
How does Wafer Stripping Equipment break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Wafer stripping equipment is used in semiconductor manufacturing for the process of removing or "stripping" photoresist or other films from the surface of silicon wafers after lithography or etching processes. This step is critical in ensuring the wafer is clean and free from any unwanted materials before proceeding to the next stages of production, such as deposition, doping, or further etching.
United States market for Wafer Stripping Equipment is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
China market for Wafer Stripping Equipment is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Europe market for Wafer Stripping Equipment is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Global key Wafer Stripping Equipment players cover PSK, Hitachi High-Tech, Lam Research, TES, ULVAC, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.
LP Information, Inc. (LPI) ' newest research report, the “Wafer Stripping Equipment Industry Forecast” looks at past sales and reviews total world Wafer Stripping Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Wafer Stripping Equipment sales for 2025 through 2031. With Wafer Stripping Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer Stripping Equipment industry.
This Insight Report provides a comprehensive analysis of the global Wafer Stripping Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer Stripping Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Wafer Stripping Equipment market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer Stripping Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer Stripping Equipment.
This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Stripping Equipment market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Dry Method
Wet Method
Segmentation by Application:
Semiconductors
Display Panels
MEMS
Optoelectronic Devices
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
PSK
Hitachi High-Tech
Lam Research
TES
ULVAC
NSC Engineering
Ultra T Equipment
RENA Technologies
Kedsemi
NAURA Technology
ACM Research
Beijing E-Town Semiconductor Technology
Xinda Semiconductor Equipment
Key Questions Addressed in this Report
What is the 10-year outlook for the global Wafer Stripping Equipment market?
What factors are driving Wafer Stripping Equipment market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Wafer Stripping Equipment market opportunities vary by end market size?
How does Wafer Stripping Equipment break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
119 Pages
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Wafer Stripping Equipment by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Wafer Stripping Equipment by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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