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Global Wafer Level Package Market Growth (Status and Outlook) 2024-2030

Publisher LP Information, Inc.
Published Aug 26, 2024
Length 81 Pages
SKU # LPI19112437

Description

Global Wafer Level Package Market Growth (Status and Outlook) 2024-2030


According to this study, the global Wafer Level Package market size will reach US$ 32390 million by 2030.

Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.

This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Level Package market by product type, application, key players and key regions and countries.

Segmentation by product type:
3D Wire Bonding
3D TSV
Others

Segmentation by Application:
Consumer Electronics
Industrial
Automotive & Transport
IT & Telecommunication
Others

This report also splits the market by region:
United States
China
Europe
Other regions:
Japan
South Korea
Southeast Asia
Rest of world

The report also presents the market competition landscape and a corresponding detailed analysis of the major players in the market. The key players covered in this report:
lASE
Amkor
Intel
Samsung
AT&S
Toshiba
JCET
Qualcomm
IBM
SK Hynix
UTAC
TSMC
China Wafer Level CSP
Interconnect Systems

Please note: The report will take approximately 2 business days to prepare and deliver.

Table of Contents

81 Pages
*This is a tentative TOC and the final deliverable is subject to change.*
1 Scope of the Report
2 Executive Summary
3 Wafer Level Package Key Players
4 Wafer Level Package by Regions
5 United States
6 Europe
7 China
8 Rest of World
9 Market Drivers, Challenges and Trends
10 Key Investors in Wafer Level Package
11 Key Players Analysis
12 Research Findings and Conclusion

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