Global Wafer Dicing Saws Market Growth 2025-2031
Description
The global Wafer Dicing Saws market size is predicted to grow from US$ 759 million in 2025 to US$ 894 million in 2031; it is expected to grow at a CAGR of 2.8% from 2025 to 2031.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) or laser cutting.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
LP Information, Inc. (LPI) ' newest research report, the “Wafer Dicing Saws Industry Forecast” looks at past sales and reviews total world Wafer Dicing Saws sales in 2024, providing a comprehensive analysis by region and market sector of projected Wafer Dicing Saws sales for 2025 through 2031. With Wafer Dicing Saws sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer Dicing Saws industry.
This Insight Report provides a comprehensive analysis of the global Wafer Dicing Saws landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer Dicing Saws portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Wafer Dicing Saws market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer Dicing Saws and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer Dicing Saws.
This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Dicing Saws market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
BGA
QFN
LTCC
Segmentation by Application:
Integrated Equipment Manufacturers
Pureplay Foundries
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
DISCO Corporation
TOKYO SEIMITSU
Dynatex International
Loadpoint
Micross Components
Advanced Dicing Technologies Ltd. (ADT)
Accretech
Key Questions Addressed in this Report
What is the 10-year outlook for the global Wafer Dicing Saws market?
What factors are driving Wafer Dicing Saws market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Wafer Dicing Saws market opportunities vary by end market size?
How does Wafer Dicing Saws break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) or laser cutting.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
LP Information, Inc. (LPI) ' newest research report, the “Wafer Dicing Saws Industry Forecast” looks at past sales and reviews total world Wafer Dicing Saws sales in 2024, providing a comprehensive analysis by region and market sector of projected Wafer Dicing Saws sales for 2025 through 2031. With Wafer Dicing Saws sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer Dicing Saws industry.
This Insight Report provides a comprehensive analysis of the global Wafer Dicing Saws landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer Dicing Saws portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Wafer Dicing Saws market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer Dicing Saws and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer Dicing Saws.
This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Dicing Saws market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
BGA
QFN
LTCC
Segmentation by Application:
Integrated Equipment Manufacturers
Pureplay Foundries
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
DISCO Corporation
TOKYO SEIMITSU
Dynatex International
Loadpoint
Micross Components
Advanced Dicing Technologies Ltd. (ADT)
Accretech
Key Questions Addressed in this Report
What is the 10-year outlook for the global Wafer Dicing Saws market?
What factors are driving Wafer Dicing Saws market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Wafer Dicing Saws market opportunities vary by end market size?
How does Wafer Dicing Saws break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
95 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Wafer Dicing Saws by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Wafer Dicing Saws by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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