Global Wafer Backgrinding Tape Market Growth 2025-2031
Description
The global Wafer Backgrinding Tape market size is predicted to grow from US$ 269 million in 2025 to US$ 358 million in 2031; it is expected to grow at a CAGR of 4.9% from 2025 to 2031.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
Wafer backgrinding tapes are mainly used in processing semiconductor wafers made from materials such as silicon or glass. Its powerful adhesive strength keeps wafers in place when grinding and cutting.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
LP Information, Inc. (LPI) ' newest research report, the “Wafer Backgrinding Tape Industry Forecast” looks at past sales and reviews total world Wafer Backgrinding Tape sales in 2024, providing a comprehensive analysis by region and market sector of projected Wafer Backgrinding Tape sales for 2025 through 2031. With Wafer Backgrinding Tape sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer Backgrinding Tape industry.
This Insight Report provides a comprehensive analysis of the global Wafer Backgrinding Tape landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer Backgrinding Tape portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Wafer Backgrinding Tape market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer Backgrinding Tape and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer Backgrinding Tape.
This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Backgrinding Tape market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Polyolefin (PO)
Polyvinyl Chloride (PVC)
Polyethylene Terephthalate (PET)
Other
Segmentation by Application:
IDMs
OSAT
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Furukawa
Nitto Denko
Mitsui Corporation
Lintec Corporation
Sumitomo Bakelite
Denka Company
Pantech Tape
Ultron Systems
NEPTCO
Nippon Pulse Motor
Loadpoint Limited
AI Technology
Minitron Electronic
Key Questions Addressed in this Report
What is the 10-year outlook for the global Wafer Backgrinding Tape market?
What factors are driving Wafer Backgrinding Tape market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Wafer Backgrinding Tape market opportunities vary by end market size?
How does Wafer Backgrinding Tape break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
Wafer backgrinding tapes are mainly used in processing semiconductor wafers made from materials such as silicon or glass. Its powerful adhesive strength keeps wafers in place when grinding and cutting.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
LP Information, Inc. (LPI) ' newest research report, the “Wafer Backgrinding Tape Industry Forecast” looks at past sales and reviews total world Wafer Backgrinding Tape sales in 2024, providing a comprehensive analysis by region and market sector of projected Wafer Backgrinding Tape sales for 2025 through 2031. With Wafer Backgrinding Tape sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer Backgrinding Tape industry.
This Insight Report provides a comprehensive analysis of the global Wafer Backgrinding Tape landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer Backgrinding Tape portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Wafer Backgrinding Tape market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer Backgrinding Tape and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer Backgrinding Tape.
This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Backgrinding Tape market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Polyolefin (PO)
Polyvinyl Chloride (PVC)
Polyethylene Terephthalate (PET)
Other
Segmentation by Application:
IDMs
OSAT
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Furukawa
Nitto Denko
Mitsui Corporation
Lintec Corporation
Sumitomo Bakelite
Denka Company
Pantech Tape
Ultron Systems
NEPTCO
Nippon Pulse Motor
Loadpoint Limited
AI Technology
Minitron Electronic
Key Questions Addressed in this Report
What is the 10-year outlook for the global Wafer Backgrinding Tape market?
What factors are driving Wafer Backgrinding Tape market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Wafer Backgrinding Tape market opportunities vary by end market size?
How does Wafer Backgrinding Tape break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
116 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Wafer Backgrinding Tape by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Wafer Backgrinding Tape by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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