Global Vacuum Reflow Soldering Ovens Market Growth 2025-2031
Description
The global Vacuum Reflow Soldering Ovens market size is predicted to grow from US$ 129 million in 2025 to US$ 173 million in 2031; it is expected to grow at a CAGR of 5.0% from 2025 to 2031.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
In the vacuum reflow process, the vacuum stage which removes the pores from the liquid solder follows the actual melting process. In contrast, vacuum reflow oven systems have shown to significantly reduce void levels of all types of electronic components, typically below 5%In the vacuum reflow process, the vacuum stage which removes the pores from the liquid solder follows the actual melting process. In contrast, vacuum reflow oven systems have shown to significantly reduce void levels of all types of electronic components, typically below 5%.Vacuum reflow ovens offer a major advantage in electronics manufacturing by creating a low-pressure environment during the soldering process, which effectively eliminates air pockets and voids in solder joints, resulting in improved mechanical strength, enhanced heat dissipation, and higher electrical reliability—especially crucial for high-density, fine-pitch components, automotive electronics, and power devices where long-term performance and durability are critical.
Global key players of vacuum reflow soldering ovens include Rehm Thermal Systems, Kurtz Ersa, Heller Industries, etc. The top five players hold a share over 65%. Asia-Pacific is the largest market, has a share about 69%, followed by North America and Europe, with share 13% and 12%, separately.
The market drivers for Vacuum Reflow Soldering Ovens include the growing demand for high-reliability electronics in sectors like aerospace, automotive, and medical devices; the trend towards miniaturization of electrical components that requires precise soldering methods; the implementation of advanced manufacturing technologies such as Industry 4.0 in the electronics manufacturing industry; the need to meet stringent quality requirements like IPC-A-610; the increased use of lead-free solder alloys due to environmental concerns; and the expansion of the electronics industry in emerging economies, all of which drive the demand for these ovens to ensure high-quality and dependable solder joints for printed circuit boards.
Power semiconductors such as IGBT, SiC, and MOSFET are widely used in electric vehicles, and these devices have extremely high requirements for soldering quality and thermal conductivity. Vacuum reflow soldering can effectively remove solder joint pores, reduce thermal resistance, and improve reliability. It is an important process equipment for high-power device packaging.
Commercial aerospace (such as satellites, rockets, and payload electronic modules) have extremely high requirements for the reliability and thermal shock resistance of electronic components. The solder joints must be free of pores, cold solder joints, and have high thermal conductivity to ensure stable operation in extreme environments (vacuum, radiation, and drastic temperature differences). Vacuum reflow soldering is the core process to meet this demand. SpaceX, Blue Origin, Starlink and other projects are promoting the transition from military-grade small batches to industrial-grade large batch manufacturing, and welding equipment must also develop from experimental level to batch, automated, and highly reliable. Vacuum reflow soldering is located at the technical intersection of "high reliability + industrialization".
LP Information, Inc. (LPI) ' newest research report, the “Vacuum Reflow Soldering Ovens Industry Forecast” looks at past sales and reviews total world Vacuum Reflow Soldering Ovens sales in 2024, providing a comprehensive analysis by region and market sector of projected Vacuum Reflow Soldering Ovens sales for 2025 through 2031. With Vacuum Reflow Soldering Ovens sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Vacuum Reflow Soldering Ovens industry.
This Insight Report provides a comprehensive analysis of the global Vacuum Reflow Soldering Ovens landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Vacuum Reflow Soldering Ovens portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Vacuum Reflow Soldering Ovens market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Vacuum Reflow Soldering Ovens and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Vacuum Reflow Soldering Ovens.
This report presents a comprehensive overview, market shares, and growth opportunities of Vacuum Reflow Soldering Ovens market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Less than 10 Heating Zones
10-20 Heating Zones
More than 20 Heating Zones
Segmentation by Application:
Telecommunication
Consumer Electronics
Automotive
Aerospace
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Rehm Thermal Systems
Kurtz Ersa
Heller Industries
SMT Wertheim
BTU International
Shenzhen JT Automation
HIRATA Corporation
Senju Metal Industry Co., Ltd
ATV Technologie GmbH
3S Silicon
EIGHTECH TECTRON
Origin Co., Ltd.
Zhongke Comrades Technology Co., Ltd
PINK GmbH
Key Questions Addressed in this Report
What is the 10-year outlook for the global Vacuum Reflow Soldering Ovens market?
What factors are driving Vacuum Reflow Soldering Ovens market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Vacuum Reflow Soldering Ovens market opportunities vary by end market size?
How does Vacuum Reflow Soldering Ovens break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
In the vacuum reflow process, the vacuum stage which removes the pores from the liquid solder follows the actual melting process. In contrast, vacuum reflow oven systems have shown to significantly reduce void levels of all types of electronic components, typically below 5%In the vacuum reflow process, the vacuum stage which removes the pores from the liquid solder follows the actual melting process. In contrast, vacuum reflow oven systems have shown to significantly reduce void levels of all types of electronic components, typically below 5%.Vacuum reflow ovens offer a major advantage in electronics manufacturing by creating a low-pressure environment during the soldering process, which effectively eliminates air pockets and voids in solder joints, resulting in improved mechanical strength, enhanced heat dissipation, and higher electrical reliability—especially crucial for high-density, fine-pitch components, automotive electronics, and power devices where long-term performance and durability are critical.
Global key players of vacuum reflow soldering ovens include Rehm Thermal Systems, Kurtz Ersa, Heller Industries, etc. The top five players hold a share over 65%. Asia-Pacific is the largest market, has a share about 69%, followed by North America and Europe, with share 13% and 12%, separately.
The market drivers for Vacuum Reflow Soldering Ovens include the growing demand for high-reliability electronics in sectors like aerospace, automotive, and medical devices; the trend towards miniaturization of electrical components that requires precise soldering methods; the implementation of advanced manufacturing technologies such as Industry 4.0 in the electronics manufacturing industry; the need to meet stringent quality requirements like IPC-A-610; the increased use of lead-free solder alloys due to environmental concerns; and the expansion of the electronics industry in emerging economies, all of which drive the demand for these ovens to ensure high-quality and dependable solder joints for printed circuit boards.
Power semiconductors such as IGBT, SiC, and MOSFET are widely used in electric vehicles, and these devices have extremely high requirements for soldering quality and thermal conductivity. Vacuum reflow soldering can effectively remove solder joint pores, reduce thermal resistance, and improve reliability. It is an important process equipment for high-power device packaging.
Commercial aerospace (such as satellites, rockets, and payload electronic modules) have extremely high requirements for the reliability and thermal shock resistance of electronic components. The solder joints must be free of pores, cold solder joints, and have high thermal conductivity to ensure stable operation in extreme environments (vacuum, radiation, and drastic temperature differences). Vacuum reflow soldering is the core process to meet this demand. SpaceX, Blue Origin, Starlink and other projects are promoting the transition from military-grade small batches to industrial-grade large batch manufacturing, and welding equipment must also develop from experimental level to batch, automated, and highly reliable. Vacuum reflow soldering is located at the technical intersection of "high reliability + industrialization".
LP Information, Inc. (LPI) ' newest research report, the “Vacuum Reflow Soldering Ovens Industry Forecast” looks at past sales and reviews total world Vacuum Reflow Soldering Ovens sales in 2024, providing a comprehensive analysis by region and market sector of projected Vacuum Reflow Soldering Ovens sales for 2025 through 2031. With Vacuum Reflow Soldering Ovens sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Vacuum Reflow Soldering Ovens industry.
This Insight Report provides a comprehensive analysis of the global Vacuum Reflow Soldering Ovens landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Vacuum Reflow Soldering Ovens portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Vacuum Reflow Soldering Ovens market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Vacuum Reflow Soldering Ovens and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Vacuum Reflow Soldering Ovens.
This report presents a comprehensive overview, market shares, and growth opportunities of Vacuum Reflow Soldering Ovens market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Less than 10 Heating Zones
10-20 Heating Zones
More than 20 Heating Zones
Segmentation by Application:
Telecommunication
Consumer Electronics
Automotive
Aerospace
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Rehm Thermal Systems
Kurtz Ersa
Heller Industries
SMT Wertheim
BTU International
Shenzhen JT Automation
HIRATA Corporation
Senju Metal Industry Co., Ltd
ATV Technologie GmbH
3S Silicon
EIGHTECH TECTRON
Origin Co., Ltd.
Zhongke Comrades Technology Co., Ltd
PINK GmbH
Key Questions Addressed in this Report
What is the 10-year outlook for the global Vacuum Reflow Soldering Ovens market?
What factors are driving Vacuum Reflow Soldering Ovens market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Vacuum Reflow Soldering Ovens market opportunities vary by end market size?
How does Vacuum Reflow Soldering Ovens break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
114 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
Pricing
Currency Rates
Questions or Comments?
Our team has the ability to search within reports to verify it suits your needs. We can also help maximize your budget by finding sections of reports you can purchase.
