Global Underfill Epoxies Market Growth 2025-2031
Description
The global Underfill Epoxies market size is predicted to grow from US$ 303 million in 2025 to US$ 394 million in 2031; it is expected to grow at a CAGR of 4.5% from 2025 to 2031.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
Underfill epoxies are high-performance adhesive materials used in semiconductor packaging to fill the narrow gap between microchips (such as flip chips or ball grid arrays) and their substrates or printed circuit boards. Designed to enhance the mechanical strength and thermal stability of solder joints, underfill epoxies mitigate stress caused by differences in thermal expansion between components during temperature cycling. These materials are typically dispensed in liquid form to flow under the chip by capillary action and then cured to form a rigid, protective layer. Key characteristics include low viscosity, high adhesion, low coefficient of thermal expansion (CTE), and resistance to moisture, vibration, and thermal fatigue, making them essential for ensuring long-term reliability in electronic assemblies.
Underfill epoxies are characterized by several key performance parameters that determine their suitability for specific microelectronic applications. Typical viscosity ranges from 50 to 5,000 cP, enabling effective capillary flow under components. They cure at temperatures between 120°C and 180°C, with cure times from 30 seconds to 30 minutes depending on the formulation. A high glass transition temperature (Tg) of 100°C to 180°C ensures thermal stability, while a low coefficient of thermal expansion (CTE), typically 20 to 70 ppm/°C, minimizes stress between materials. Thermal conductivity varies from 0.2 to 2.0 W/m·K for standard and thermally conductive grades. Moisture absorption is kept low, usually below 0.5%, to enhance reliability in humid environments. High adhesion strength (often exceeding 30 MPa) and tailored filler content (20%–80% by weight) contribute to mechanical robustness, and some variants offer reworkability for repairable systems.
LP Information, Inc. (LPI) ' newest research report, the “Underfill Epoxies Industry Forecast” looks at past sales and reviews total world Underfill Epoxies sales in 2024, providing a comprehensive analysis by region and market sector of projected Underfill Epoxies sales for 2025 through 2031. With Underfill Epoxies sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Underfill Epoxies industry.
This Insight Report provides a comprehensive analysis of the global Underfill Epoxies landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Underfill Epoxies portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Underfill Epoxies market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Underfill Epoxies and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Underfill Epoxies.
This report presents a comprehensive overview, market shares, and growth opportunities of Underfill Epoxies market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Capillary Flow Underfill (CUF)
No-Flow Underfill (NUF)
Molded Underfill (MUF)
Others
Segmentation by Application:
Semiconductor
Consumer Electronics
Automotive
Medical Devices
Industrial
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Henkel
H.B. Fuller
Nagase ChemteX
NAMICS
Dexerials
Shin-Etsu
Panacol-Elosol
Dow
3M Company
Zymet
Master Bond
Parker Hannifin
Hitachi Chemical
EPOXY Technology
Kaken Tech
Sanyu Rec
Permabond
MG Chemicals
Key Questions Addressed in this Report
What is the 10-year outlook for the global Underfill Epoxies market?
What factors are driving Underfill Epoxies market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Underfill Epoxies market opportunities vary by end market size?
How does Underfill Epoxies break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
Underfill epoxies are high-performance adhesive materials used in semiconductor packaging to fill the narrow gap between microchips (such as flip chips or ball grid arrays) and their substrates or printed circuit boards. Designed to enhance the mechanical strength and thermal stability of solder joints, underfill epoxies mitigate stress caused by differences in thermal expansion between components during temperature cycling. These materials are typically dispensed in liquid form to flow under the chip by capillary action and then cured to form a rigid, protective layer. Key characteristics include low viscosity, high adhesion, low coefficient of thermal expansion (CTE), and resistance to moisture, vibration, and thermal fatigue, making them essential for ensuring long-term reliability in electronic assemblies.
Underfill epoxies are characterized by several key performance parameters that determine their suitability for specific microelectronic applications. Typical viscosity ranges from 50 to 5,000 cP, enabling effective capillary flow under components. They cure at temperatures between 120°C and 180°C, with cure times from 30 seconds to 30 minutes depending on the formulation. A high glass transition temperature (Tg) of 100°C to 180°C ensures thermal stability, while a low coefficient of thermal expansion (CTE), typically 20 to 70 ppm/°C, minimizes stress between materials. Thermal conductivity varies from 0.2 to 2.0 W/m·K for standard and thermally conductive grades. Moisture absorption is kept low, usually below 0.5%, to enhance reliability in humid environments. High adhesion strength (often exceeding 30 MPa) and tailored filler content (20%–80% by weight) contribute to mechanical robustness, and some variants offer reworkability for repairable systems.
LP Information, Inc. (LPI) ' newest research report, the “Underfill Epoxies Industry Forecast” looks at past sales and reviews total world Underfill Epoxies sales in 2024, providing a comprehensive analysis by region and market sector of projected Underfill Epoxies sales for 2025 through 2031. With Underfill Epoxies sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Underfill Epoxies industry.
This Insight Report provides a comprehensive analysis of the global Underfill Epoxies landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Underfill Epoxies portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Underfill Epoxies market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Underfill Epoxies and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Underfill Epoxies.
This report presents a comprehensive overview, market shares, and growth opportunities of Underfill Epoxies market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Capillary Flow Underfill (CUF)
No-Flow Underfill (NUF)
Molded Underfill (MUF)
Others
Segmentation by Application:
Semiconductor
Consumer Electronics
Automotive
Medical Devices
Industrial
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Henkel
H.B. Fuller
Nagase ChemteX
NAMICS
Dexerials
Shin-Etsu
Panacol-Elosol
Dow
3M Company
Zymet
Master Bond
Parker Hannifin
Hitachi Chemical
EPOXY Technology
Kaken Tech
Sanyu Rec
Permabond
MG Chemicals
Key Questions Addressed in this Report
What is the 10-year outlook for the global Underfill Epoxies market?
What factors are driving Underfill Epoxies market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Underfill Epoxies market opportunities vary by end market size?
How does Underfill Epoxies break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
145 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Right Angle Speed Reducers by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Right Angle Speed Reducers by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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