Global Ultra-slim Vapor Chamber Market Growth 2025-2031

The global Ultra-slim Vapor Chamber market size is predicted to grow from US$ 801 million in 2025 to US$ 1418 million in 2031; it is expected to grow at a CAGR of 10.0% from 2025 to 2031.

Ultra-slim Vapor Chamber is a high-performance heat dissipation component mainly used in the heat dissipation scenarios of electronic devices. "VC" stands for Vapor Chamber. It uses the principle of evaporation and condensation cycle of the liquid through the internal capillary structure and coolant for efficient heat conduction. In terms of design, the ultra-thin VC vapor chamber has an extremely thin profile, with its thickness significantly reduced compared to traditional heat dissipation devices. It can achieve efficient heat dissipation without taking up too much space. This feature makes it very suitable for modern electronic devices with strict space requirements, such as thin and light laptops, tablets, and high-end smartphones. When the heating elements of electronic devices generate heat, the heat is conducted to the vapor chamber. The internal coolant absorbs the heat and evaporates into steam. The steam diffuses to the cooler area in the vacuum chamber and then condenses back into a liquid. It flows back to the heating area through the capillary structure. This cycle repeats to quickly and evenly disperse the heat, effectively preventing local overheating and ensuring the stable operation and performance of electronic devices.

United States market for Ultra-slim Vapor Chamber is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for Ultra-slim Vapor Chamber is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for Ultra-slim Vapor Chamber is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key Ultra-slim Vapor Chamber players cover Aavid, Jiangsu Gian Technology, Shenzhen Stoneplus Thermal Management Technologies, Lemtech Precision Material (China), Shenzhen Shunshang Technology, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LP Information, Inc. (LPI) ' newest research report, the “Ultra-slim Vapor Chamber Industry Forecast” looks at past sales and reviews total world Ultra-slim Vapor Chamber sales in 2024, providing a comprehensive analysis by region and market sector of projected Ultra-slim Vapor Chamber sales for 2025 through 2031. With Ultra-slim Vapor Chamber sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Ultra-slim Vapor Chamber industry.

This Insight Report provides a comprehensive analysis of the global Ultra-slim Vapor Chamber landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Ultra-slim Vapor Chamber portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Ultra-slim Vapor Chamber market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Ultra-slim Vapor Chamber and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Ultra-slim Vapor Chamber.

This report presents a comprehensive overview, market shares, and growth opportunities of Ultra-slim Vapor Chamber market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Copper-based
Aluminum-based
Composite Materials

Segmentation by Application:
Smartphone
Tablet
Laptop
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Aavid
Jiangsu Gian Technology
Shenzhen Stoneplus Thermal Management Technologies
Lemtech Precision Material (China)
Shenzhen Shunshang Technology
Dongguan Hongfu Hardware Industry
Forcecon Technology
Taisol Electronics
LINGYI iTECH (GUANGDONG) COMPANY
OFILM Group
Dongji (Dongguan) Heat Dissipation
NIDEC
Delta Electronics
Radian Thermal

Key Questions Addressed in this Report

What is the 10-year outlook for the global Ultra-slim Vapor Chamber market?

What factors are driving Ultra-slim Vapor Chamber market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Ultra-slim Vapor Chamber market opportunities vary by end market size?

How does Ultra-slim Vapor Chamber break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.