Global Thermal Paste for CPUs Market Growth 2025-2031

The global Thermal Paste for CPUs market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.

This report study of Thermal Paste for CPUs, Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually electrically insulating) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. The main role of thermal paste is to eliminate air gaps or spaces (which act as thermal insulation) from the interface area in order to maximize heat transfer and dissipation. Thermal paste is an example of a thermal interface material.

Factory PCs and laptops (though seldom tablets or smartphones) typically incorporate thermal paste between the top of the CPU case and a heat sink for cooling. Thermal paste is sometimes also used between the CPU die and its integrated heat spreader, though solder is sometimes used instead.

United States market for Thermal Paste for CPUs is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for Thermal Paste for CPUs is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for Thermal Paste for CPUs is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key Thermal Paste for CPUs players cover 3M, Henkel, ShinEtsu, Dow Corning, Laird Technologies, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LP Information, Inc. (LPI) ' newest research report, the “Thermal Paste for CPUs Industry Forecast” looks at past sales and reviews total world Thermal Paste for CPUs sales in 2024, providing a comprehensive analysis by region and market sector of projected Thermal Paste for CPUs sales for 2025 through 2031. With Thermal Paste for CPUs sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Thermal Paste for CPUs industry.

This Insight Report provides a comprehensive analysis of the global Thermal Paste for CPUs landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Thermal Paste for CPUs portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Thermal Paste for CPUs market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Thermal Paste for CPUs and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Thermal Paste for CPUs.

This report presents a comprehensive overview, market shares, and growth opportunities of Thermal Paste for CPUs market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:

Silicon Based

Silver Based

Copper Based

Aluminum Based

Carbon Based

Other

Segmentation by Application:

Laptop CPU

Desktop CPU

Mobile Devices CPU

This report also splits the market by region:

Americas

United States

Canada

Mexico

Brazil

APAC

China

Japan

Korea

Southeast Asia

India

Australia

Europe

Germany

France

UK

Italy

Russia

Middle East & Africa

Egypt

South Africa

Israel

Turkey

GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.

3M

Henkel

ShinEtsu

Dow Corning

Laird Technologies

Wacker Chemie

Parker chomerics

Sekisui Chemical

Noctua

Arctic Silver

Thermal Grizzly

Cooler Master

Corsair

AG Termopasty

Key Questions Addressed in this Report

What is the 10-year outlook for the global Thermal Paste for CPUs market?

What factors are driving Thermal Paste for CPUs market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Thermal Paste for CPUs market opportunities vary by end market size?

How does Thermal Paste for CPUs break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.