Global Surfacing Veils Market Growth 2025-2031
Description
The global Soft Board FPC market size is predicted to grow from US$ 5135 million in 2025 to US$ 6319 million in 2031; it is expected to grow at a CAGR of 3.5% from 2025 to 2031.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
FPC is a flexible and foldable printed circuit board based on polyimide or polyester film, which has high reliability and excellent flexibility. The advantages of soft board FPC are: small size and light weight, suitable for high-density, miniaturization and lightweight electronic product design. It is highly flexible and can move and expand arbitrarily in three-dimensional space, realizing the integration of component assembly and wire connection. Good heat dissipation performance can reduce the operating temperature of the circuit and improve the stability and life of the circuit. Save space and materials, reduce the number of circuit board layers and connectors, and reduce costs and repair rates.
FPC has the characteristics of small size, light weight, and bendability. It fits the popular trend of lightweight electronic products and is widely used in consumer electronics such as smartphones, tablets, and PCs. Later, with the popularity of emerging products such as new energy vehicles, AR/VR, and wearable devices, the application field of FPC has been further expanded. At the end of the 20th century, affected by the transfer of FPC industries in the United States and other places, the FPC industry in countries or regions such as Japan, South Korea, and Taiwan, China grew rapidly and became the main production base of FPC in the world. Domestic FPC companies have a short development time and are restricted by funds, scale, technology reserves, and upstream and downstream. There is still a certain gap in comprehensive competitiveness with international leading companies. Thanks to the flexibility, lightness, reliability, and excellent electrical performance of FPC, the application scenarios of FPC are constantly expanding, especially the innovative development of consumer electronics, automotive electronics, medical equipment, industrial automation, aerospace, new energy and energy storage, 5G communications, etc., providing possibilities for the in-depth development of FPC. For example, in the field of smartphones, FPC can be applied to modules such as antennas, camera modules, screen connections, fingerprint recognition, battery connections, and wireless charging; in the field of automotive electronics, FPC can be applied to modules such as battery management systems (BMS), sensors, advanced driver assistance systems (ADAS), and in-vehicle entertainment systems; in the medical field, FPC can be applied to modules such as portable medical devices and wearable health monitoring devices; in the industrial field, FPC can be applied to modules such as sensors and actuators, robots, and industrial computers. The diversified development of application scenarios has driven the continued growth of FPC market demand.
Integration and lightweight are the two core advantages of FPC. In terms of integration, FPC can reduce the number of connectors or traditional wiring harnesses, simplify the assembly process, and can also be designed into a multi-layer structure. Metallized holes are formed by drilling and electroplating to achieve conductive connections between different layers, achieve high-density wiring in a limited space, reduce the distance between electronic components and improve overall performance. In terms of lightweight, FPC uses thin substrates such as polyimide (PI) film to reduce the space occupied and weight of equipment. If a car uses FPC flexible flat wiring harness instead of traditional wiring harness, the overall weight of the wiring harness will be reduced by about 50% and the volume will be reduced by about 60%. Therefore, with the advantages of integration and lightweight, the penetration rate of FPC in terminal applications such as smartphones and automotive electronics will continue to increase.
LP Information, Inc. (LPI) ' newest research report, the “Soft Board FPC Industry Forecast” looks at past sales and reviews total world Soft Board FPC sales in 2024, providing a comprehensive analysis by region and market sector of projected Soft Board FPC sales for 2025 through 2031. With Soft Board FPC sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Soft Board FPC industry.
This Insight Report provides a comprehensive analysis of the global Soft Board FPC landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Soft Board FPC portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Soft Board FPC market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Soft Board FPC and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Soft Board FPC.
This report presents a comprehensive overview, market shares, and growth opportunities of Soft Board FPC market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Single Sided FPC
Double Sided FPC
Multi-sided FPC
Segmentation by Application:
Communications Industry
Consumer Electronics Industry
Automobile Industry
Medical Industry
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
BEST FLEXIBLE CIRCUITS
UnitePCB
Nippon Mektron
Flexible Circuits Inc.
SEI
Fujikura
SIFLEX
Bhflex
Interflex
Daeduck Electronics
Topsun
MFS
Zhen Ding Tech
JLC
CMD
Sun&Lynn Circuits
DSBJ
Flexium Interconnect
CAREER TECHNOLOGY (MFG.)
HONFLEX
KINWONG
ichia
AKM Industrial Company
JCD
Key Questions Addressed in this Report
What is the 10-year outlook for the global Soft Board FPC market?
What factors are driving Soft Board FPC market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Soft Board FPC market opportunities vary by end market size?
How does Soft Board FPC break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
FPC is a flexible and foldable printed circuit board based on polyimide or polyester film, which has high reliability and excellent flexibility. The advantages of soft board FPC are: small size and light weight, suitable for high-density, miniaturization and lightweight electronic product design. It is highly flexible and can move and expand arbitrarily in three-dimensional space, realizing the integration of component assembly and wire connection. Good heat dissipation performance can reduce the operating temperature of the circuit and improve the stability and life of the circuit. Save space and materials, reduce the number of circuit board layers and connectors, and reduce costs and repair rates.
FPC has the characteristics of small size, light weight, and bendability. It fits the popular trend of lightweight electronic products and is widely used in consumer electronics such as smartphones, tablets, and PCs. Later, with the popularity of emerging products such as new energy vehicles, AR/VR, and wearable devices, the application field of FPC has been further expanded. At the end of the 20th century, affected by the transfer of FPC industries in the United States and other places, the FPC industry in countries or regions such as Japan, South Korea, and Taiwan, China grew rapidly and became the main production base of FPC in the world. Domestic FPC companies have a short development time and are restricted by funds, scale, technology reserves, and upstream and downstream. There is still a certain gap in comprehensive competitiveness with international leading companies. Thanks to the flexibility, lightness, reliability, and excellent electrical performance of FPC, the application scenarios of FPC are constantly expanding, especially the innovative development of consumer electronics, automotive electronics, medical equipment, industrial automation, aerospace, new energy and energy storage, 5G communications, etc., providing possibilities for the in-depth development of FPC. For example, in the field of smartphones, FPC can be applied to modules such as antennas, camera modules, screen connections, fingerprint recognition, battery connections, and wireless charging; in the field of automotive electronics, FPC can be applied to modules such as battery management systems (BMS), sensors, advanced driver assistance systems (ADAS), and in-vehicle entertainment systems; in the medical field, FPC can be applied to modules such as portable medical devices and wearable health monitoring devices; in the industrial field, FPC can be applied to modules such as sensors and actuators, robots, and industrial computers. The diversified development of application scenarios has driven the continued growth of FPC market demand.
Integration and lightweight are the two core advantages of FPC. In terms of integration, FPC can reduce the number of connectors or traditional wiring harnesses, simplify the assembly process, and can also be designed into a multi-layer structure. Metallized holes are formed by drilling and electroplating to achieve conductive connections between different layers, achieve high-density wiring in a limited space, reduce the distance between electronic components and improve overall performance. In terms of lightweight, FPC uses thin substrates such as polyimide (PI) film to reduce the space occupied and weight of equipment. If a car uses FPC flexible flat wiring harness instead of traditional wiring harness, the overall weight of the wiring harness will be reduced by about 50% and the volume will be reduced by about 60%. Therefore, with the advantages of integration and lightweight, the penetration rate of FPC in terminal applications such as smartphones and automotive electronics will continue to increase.
LP Information, Inc. (LPI) ' newest research report, the “Soft Board FPC Industry Forecast” looks at past sales and reviews total world Soft Board FPC sales in 2024, providing a comprehensive analysis by region and market sector of projected Soft Board FPC sales for 2025 through 2031. With Soft Board FPC sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Soft Board FPC industry.
This Insight Report provides a comprehensive analysis of the global Soft Board FPC landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Soft Board FPC portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Soft Board FPC market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Soft Board FPC and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Soft Board FPC.
This report presents a comprehensive overview, market shares, and growth opportunities of Soft Board FPC market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Single Sided FPC
Double Sided FPC
Multi-sided FPC
Segmentation by Application:
Communications Industry
Consumer Electronics Industry
Automobile Industry
Medical Industry
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
BEST FLEXIBLE CIRCUITS
UnitePCB
Nippon Mektron
Flexible Circuits Inc.
SEI
Fujikura
SIFLEX
Bhflex
Interflex
Daeduck Electronics
Topsun
MFS
Zhen Ding Tech
JLC
CMD
Sun&Lynn Circuits
DSBJ
Flexium Interconnect
CAREER TECHNOLOGY (MFG.)
HONFLEX
KINWONG
ichia
AKM Industrial Company
JCD
Key Questions Addressed in this Report
What is the 10-year outlook for the global Soft Board FPC market?
What factors are driving Soft Board FPC market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Soft Board FPC market opportunities vary by end market size?
How does Soft Board FPC break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
161 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Surfacing Veils by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Surfacing Veils by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
Pricing
Currency Rates
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