Global Solar Cell Copper-plating Equipment Market Growth 2025-2031
Description
The global Solar Cell Copper-plating Equipment market size is predicted to grow from US$ 1875 million in 2025 to US$ 6570 million in 2031; it is expected to grow at a CAGR of 23.2% from 2025 to 2031.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
Photovoltaic copper electroplating technology uses metallic copper to completely replace silver paste as the gate electrode, which has the advantages of low cost and high efficiency. It can be used in a variety of technical paths such as TopCon, HJT, BC, etc. Among them, the amount of HJT silver paste is relatively large, and the demand for the use of copper electroplating technology is more urgent. The advantage of copper electroplating is low cost. Compared with HJT traditional screen printing technology, it is estimated that the cost reduction of 0.04 yuan/W can be achieved at present. As copper electroplating equipment gradually matures, there is considerable room for subsequent cost reduction. Compared with traditional screen printing technology, copper electroplating can achieve a 0.3%-0.5% increase in photoelectric conversion efficiency. The copper electroplating process is mainly divided into four steps: 1) Seed layer preparation: In order to improve the contact and adhesion characteristics between the metal and the transparent conductive film, a seed layer is introduced to increase the adhesion performance between the electroplated metal and the TCO; 2) Graphics: The electrode design pattern is selectively obtained through graphic transfer technology. The specific processes include masking, exposure, and development; 3) Metallization: Inserting the battery cell into the electrolytic cell to reduce the copper ions in the solution to copper metal and complete the precipitation of copper, which is part of the metallization; 4) Post-processing: It is mainly to remove the photosensitive material and seed layer to ensure that the TCO layer can be exposed. In copper electroplating equipment, exposure and electroplating equipment are the two core equipment. Among them, the main technical paths of metallization electroplating equipment are vertical electroplating, horizontal electroplating, and insert electroplating. Vertical electroplating is widely used in PCB copper electroplating process. The clamp clamps the cathode and hangs it vertically in the electroplating tank for copper electroplating. Horizontal electroplating is similar to vertical electroplating in method and principle. Both must have positive and negative electrodes. After power is applied, an electrode reaction is generated to ionize the main components of the electrolyte, causing the charged positive ions to move to the negative phase of the electrode reaction zone; the charged negative ions move to the positive phase of the electrode reaction zone, thus producing a metal deposition coating and releasing gas. Insertion electroplating is to set the battery cell on the cathode conductive support and insert it downward so that a conductive support unit is located between adjacent anode plate components. Mainstream manufacturers include Robotech, Eastway Technology, Jedbo, and Sunwell.
United States market for Solar Cell Copper-plating Equipment is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
China market for Solar Cell Copper-plating Equipment is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Europe market for Solar Cell Copper-plating Equipment is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Global key Solar Cell Copper-plating Equipment players cover Jiangsu Boamax Technologies Group Co., Ltd., SUZHOU JBAO TECHNOLOGY LTD., Kunshan Dongwei Technology Co., Ltd., Sunwell, GS-Solar, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.
LP Information, Inc. (LPI) ' newest research report, the “Solar Cell Copper-plating Equipment Industry Forecast” looks at past sales and reviews total world Solar Cell Copper-plating Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Solar Cell Copper-plating Equipment sales for 2025 through 2031. With Solar Cell Copper-plating Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Solar Cell Copper-plating Equipment industry.
This Insight Report provides a comprehensive analysis of the global Solar Cell Copper-plating Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Solar Cell Copper-plating Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Solar Cell Copper-plating Equipment market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Solar Cell Copper-plating Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Solar Cell Copper-plating Equipment.
This report presents a comprehensive overview, market shares, and growth opportunities of Solar Cell Copper-plating Equipment market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Vertical Plating
Horizontal Plating
Plug-in Plating
Flexible Contact Plating
Light-induced Plating
Segmentation by Application:
HJT Battery
PERC Battery
TOPCon Battery
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Jiangsu Boamax Technologies Group Co., Ltd.
SUZHOU JBAO TECHNOLOGY LTD.
Kunshan Dongwei Technology Co., Ltd.
Sunwell
GS-Solar
Robotechnik Intelligent Technology Co.,ltd.
Shanghai Aiko Solar Energy Co., Ltd.
Key Questions Addressed in this Report
What is the 10-year outlook for the global Solar Cell Copper-plating Equipment market?
What factors are driving Solar Cell Copper-plating Equipment market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Solar Cell Copper-plating Equipment market opportunities vary by end market size?
How does Solar Cell Copper-plating Equipment break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
Photovoltaic copper electroplating technology uses metallic copper to completely replace silver paste as the gate electrode, which has the advantages of low cost and high efficiency. It can be used in a variety of technical paths such as TopCon, HJT, BC, etc. Among them, the amount of HJT silver paste is relatively large, and the demand for the use of copper electroplating technology is more urgent. The advantage of copper electroplating is low cost. Compared with HJT traditional screen printing technology, it is estimated that the cost reduction of 0.04 yuan/W can be achieved at present. As copper electroplating equipment gradually matures, there is considerable room for subsequent cost reduction. Compared with traditional screen printing technology, copper electroplating can achieve a 0.3%-0.5% increase in photoelectric conversion efficiency. The copper electroplating process is mainly divided into four steps: 1) Seed layer preparation: In order to improve the contact and adhesion characteristics between the metal and the transparent conductive film, a seed layer is introduced to increase the adhesion performance between the electroplated metal and the TCO; 2) Graphics: The electrode design pattern is selectively obtained through graphic transfer technology. The specific processes include masking, exposure, and development; 3) Metallization: Inserting the battery cell into the electrolytic cell to reduce the copper ions in the solution to copper metal and complete the precipitation of copper, which is part of the metallization; 4) Post-processing: It is mainly to remove the photosensitive material and seed layer to ensure that the TCO layer can be exposed. In copper electroplating equipment, exposure and electroplating equipment are the two core equipment. Among them, the main technical paths of metallization electroplating equipment are vertical electroplating, horizontal electroplating, and insert electroplating. Vertical electroplating is widely used in PCB copper electroplating process. The clamp clamps the cathode and hangs it vertically in the electroplating tank for copper electroplating. Horizontal electroplating is similar to vertical electroplating in method and principle. Both must have positive and negative electrodes. After power is applied, an electrode reaction is generated to ionize the main components of the electrolyte, causing the charged positive ions to move to the negative phase of the electrode reaction zone; the charged negative ions move to the positive phase of the electrode reaction zone, thus producing a metal deposition coating and releasing gas. Insertion electroplating is to set the battery cell on the cathode conductive support and insert it downward so that a conductive support unit is located between adjacent anode plate components. Mainstream manufacturers include Robotech, Eastway Technology, Jedbo, and Sunwell.
United States market for Solar Cell Copper-plating Equipment is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
China market for Solar Cell Copper-plating Equipment is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Europe market for Solar Cell Copper-plating Equipment is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Global key Solar Cell Copper-plating Equipment players cover Jiangsu Boamax Technologies Group Co., Ltd., SUZHOU JBAO TECHNOLOGY LTD., Kunshan Dongwei Technology Co., Ltd., Sunwell, GS-Solar, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.
LP Information, Inc. (LPI) ' newest research report, the “Solar Cell Copper-plating Equipment Industry Forecast” looks at past sales and reviews total world Solar Cell Copper-plating Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Solar Cell Copper-plating Equipment sales for 2025 through 2031. With Solar Cell Copper-plating Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Solar Cell Copper-plating Equipment industry.
This Insight Report provides a comprehensive analysis of the global Solar Cell Copper-plating Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Solar Cell Copper-plating Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Solar Cell Copper-plating Equipment market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Solar Cell Copper-plating Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Solar Cell Copper-plating Equipment.
This report presents a comprehensive overview, market shares, and growth opportunities of Solar Cell Copper-plating Equipment market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Vertical Plating
Horizontal Plating
Plug-in Plating
Flexible Contact Plating
Light-induced Plating
Segmentation by Application:
HJT Battery
PERC Battery
TOPCon Battery
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Jiangsu Boamax Technologies Group Co., Ltd.
SUZHOU JBAO TECHNOLOGY LTD.
Kunshan Dongwei Technology Co., Ltd.
Sunwell
GS-Solar
Robotechnik Intelligent Technology Co.,ltd.
Shanghai Aiko Solar Energy Co., Ltd.
Key Questions Addressed in this Report
What is the 10-year outlook for the global Solar Cell Copper-plating Equipment market?
What factors are driving Solar Cell Copper-plating Equipment market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Solar Cell Copper-plating Equipment market opportunities vary by end market size?
How does Solar Cell Copper-plating Equipment break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
105 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Solar Cell Copper-plating Equipment by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Solar Cell Copper-plating Equipment by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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