Global Silicon-on-insulator CMOS Market Growth 2025-2031
Description
The global Silicon-on-insulator CMOS market size is predicted to grow from US$ 1619 million in 2025 to US$ 3857 million in 2031; it is expected to grow at a CAGR of 15.6% from 2025 to 2031.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
Silicon-On-Insulator (SOI) is a semiconductor fabrication technique developed by IBM that uses pure crystal silicon and silicon oxide for integrated circuits (ICs) and microchips. An SOI microchip processing speed is often 30% faster than today"s complementary metal-oxide semiconductor (CMOS)-based chips and power consumption is reduced 80%, which makes them ideal for mobile devices. SOI chips also reduce the soft error rate, which is data corruption caused by cosmic rays and natural radioactive background signals.
Silicon-On-Insulator (SOI) is a new type of starting material for the chip making process. SOI wafers have three layers; a thin surface layer of silicon (from a few hundred Angstrom to several microns thick) where the transistors are formed, an underlying layer of insulating material on a support or "handle" bulk silicon wafer. The insulating layer, usually made of silicon dioxide, is referred to as the "buried oxide" or "BOX", and is usually a few thousand Angstroms thick. Transistors built within the top silicon layer, switch signals faster, run at lower voltages, and are much less vulnerable to signal noise from background cosmic ray particles. Each transistor is isolated from its neighbor by a complete layer of silicon dioxide. These transistors are immune to "latch-up" problems and can be spaced closer together than transistors built on bulk silicon wafers. Building circuits on SOI increases Fab productivity by allowing for more compact circuit designs, yielding more chips per wafer.
SOI enables increased chip functionality without the cost of major Fab process equipment changes. Faster circuit operation and lower operating voltages have produced a powerful surge in the performance of high-speed network servers and new designs for hand-held computing and communication devices with longer battery life. Advanced circuits, using multiple layers of SOI-type device silicon, can lead the way to a coupling of electrical and optical signal processing into a single chip resulting in a dramatic broadening of communication bandwidth and new applications such as global-ranging, direct-link entertainment and communication to hand-held devices.
Global key players of silicon-on-insulator (SOI) include Soitec, Shin-Etsu Chemical, GlobalWafers, SUMCO, NSIG, etc. Global top five manufacturers hold a share over 97%. Europe is the largest producer of silicon-on-insulator (SOI), holds a share over 68%, followed by Asia-Pacific. In terms of product, below 200 mm is the largest segment, with a share over 50%. And in terms of application, the largest application is consumer electronics, with a share over 59%, followed by automotive.
LP Information, Inc. (LPI) ' newest research report, the “Silicon-on-insulator CMOS Industry Forecast” looks at past sales and reviews total world Silicon-on-insulator CMOS sales in 2024, providing a comprehensive analysis by region and market sector of projected Silicon-on-insulator CMOS sales for 2025 through 2031. With Silicon-on-insulator CMOS sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Silicon-on-insulator CMOS industry.
This Insight Report provides a comprehensive analysis of the global Silicon-on-insulator CMOS landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Silicon-on-insulator CMOS portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Silicon-on-insulator CMOS market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Silicon-on-insulator CMOS and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Silicon-on-insulator CMOS.
This report presents a comprehensive overview, market shares, and growth opportunities of Silicon-on-insulator CMOS market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
14nm
7nm
5nm
Others
Segmentation by Application:
Consumer Electronics
Chemicals
Aerospace & Defense
Oil & Gas
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Honeywell
ST Microelectronics
NXP
SOITEC
American Semiconductor
Key Questions Addressed in this Report
What is the 10-year outlook for the global Silicon-on-insulator CMOS market?
What factors are driving Silicon-on-insulator CMOS market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Silicon-on-insulator CMOS market opportunities vary by end market size?
How does Silicon-on-insulator CMOS break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
Silicon-On-Insulator (SOI) is a semiconductor fabrication technique developed by IBM that uses pure crystal silicon and silicon oxide for integrated circuits (ICs) and microchips. An SOI microchip processing speed is often 30% faster than today"s complementary metal-oxide semiconductor (CMOS)-based chips and power consumption is reduced 80%, which makes them ideal for mobile devices. SOI chips also reduce the soft error rate, which is data corruption caused by cosmic rays and natural radioactive background signals.
Silicon-On-Insulator (SOI) is a new type of starting material for the chip making process. SOI wafers have three layers; a thin surface layer of silicon (from a few hundred Angstrom to several microns thick) where the transistors are formed, an underlying layer of insulating material on a support or "handle" bulk silicon wafer. The insulating layer, usually made of silicon dioxide, is referred to as the "buried oxide" or "BOX", and is usually a few thousand Angstroms thick. Transistors built within the top silicon layer, switch signals faster, run at lower voltages, and are much less vulnerable to signal noise from background cosmic ray particles. Each transistor is isolated from its neighbor by a complete layer of silicon dioxide. These transistors are immune to "latch-up" problems and can be spaced closer together than transistors built on bulk silicon wafers. Building circuits on SOI increases Fab productivity by allowing for more compact circuit designs, yielding more chips per wafer.
SOI enables increased chip functionality without the cost of major Fab process equipment changes. Faster circuit operation and lower operating voltages have produced a powerful surge in the performance of high-speed network servers and new designs for hand-held computing and communication devices with longer battery life. Advanced circuits, using multiple layers of SOI-type device silicon, can lead the way to a coupling of electrical and optical signal processing into a single chip resulting in a dramatic broadening of communication bandwidth and new applications such as global-ranging, direct-link entertainment and communication to hand-held devices.
Global key players of silicon-on-insulator (SOI) include Soitec, Shin-Etsu Chemical, GlobalWafers, SUMCO, NSIG, etc. Global top five manufacturers hold a share over 97%. Europe is the largest producer of silicon-on-insulator (SOI), holds a share over 68%, followed by Asia-Pacific. In terms of product, below 200 mm is the largest segment, with a share over 50%. And in terms of application, the largest application is consumer electronics, with a share over 59%, followed by automotive.
LP Information, Inc. (LPI) ' newest research report, the “Silicon-on-insulator CMOS Industry Forecast” looks at past sales and reviews total world Silicon-on-insulator CMOS sales in 2024, providing a comprehensive analysis by region and market sector of projected Silicon-on-insulator CMOS sales for 2025 through 2031. With Silicon-on-insulator CMOS sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Silicon-on-insulator CMOS industry.
This Insight Report provides a comprehensive analysis of the global Silicon-on-insulator CMOS landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Silicon-on-insulator CMOS portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Silicon-on-insulator CMOS market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Silicon-on-insulator CMOS and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Silicon-on-insulator CMOS.
This report presents a comprehensive overview, market shares, and growth opportunities of Silicon-on-insulator CMOS market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
14nm
7nm
5nm
Others
Segmentation by Application:
Consumer Electronics
Chemicals
Aerospace & Defense
Oil & Gas
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Honeywell
ST Microelectronics
NXP
SOITEC
American Semiconductor
Key Questions Addressed in this Report
What is the 10-year outlook for the global Silicon-on-insulator CMOS market?
What factors are driving Silicon-on-insulator CMOS market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Silicon-on-insulator CMOS market opportunities vary by end market size?
How does Silicon-on-insulator CMOS break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
84 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Silicon-on-insulator CMOS by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Silicon-on-insulator CMOS by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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