Global SiC Wafer Thinning Equipment Market Growth 2025-2031

The global SiC Wafer Thinning Equipment market size is predicted to grow from US$ 128 million in 2025 to US$ 342 million in 2031; it is expected to grow at a CAGR of 17.7% from 2025 to 2031.

Wafer Grinder uses a centrally located robot to move a wafer from an input station to a measuring station. Thereafter, the wafer is moved into a grind station and a wash station sequentially. The robot is able to move a wafer from the wash station to either the measuring station for after-grinding measurements or directly to an output station. During grinding of one wafer, a second wafer may be held between the measuring station and the grind station while a ground wafer is moved from the wash station to the measuring station for after-grinding measurements.

This report only studies Silicon Carbide Wafer Thinning Equipment.

The global SiC Wafer Thinning Equipment market is witnessing significant growth, driven by the increasing demand for semiconductors in various industries such as consumer electronics, automotive, and telecommunications. The Asia-Pacific region remains the largest consumer market, accounting for over 60% of the global market share. This trend is expected to continue due to the region's strong semiconductor industry, technological advancements, and growing demand for energy-efficient power devices.

The global key manufacturers of SiC Wafer Thinning Equipment include Disco, TSD, etc. In 2023, the global top five players had a share approximately 81% in terms of revenue.

Among different types of SiC wafer thinning equipment, fully automated systems dominate the market, capturing approximately 77% of the total share in 2024. This reflects the industry's growing demand for precision, scalability, and high-efficiency production processes. Fully automated equipment provides improved throughput and minimizes the risk of human error, making it the preferred choice for manufacturers aiming to scale their operations and ensure high-quality output.

Interms of applications, wafers sized 6 inches and below are the primary demand drivers. These smaller wafers make up approximately 70% of the market in 2024. The widespread use of smaller wafers in power electronics and semiconductor devices, particularly in electric vehicles and renewable energy applications, supports this demand. As SiC continues to gain traction in the power semiconductor sector, the demand for wafer thinning equipment for smaller wafer sizes is expected to increase.

Market Driving Factors

Expansion of the Electric Vehicle (EV) Market: SiC materials are particularly suitable for use in power modules for electric vehicles (EVs) due to their superior thermal conductivity and high voltage tolerance. With the rapid growth of the electric vehicle market, the demand for SiC wafers is increasing, which in turn drives the demand for wafer thinning equipment.

Advances in Energy Conversion and Storage Technologies: In high-efficiency energy conversion and storage fields, such as solar inverters and battery management systems, the use of SiC materials can significantly improve efficiency. The market's demand for high-performance components has driven the production and thinning of SiC wafers.

Demand for 5G and High-Frequency Electronics: The demand for SiC materials is rising in 5G networks and other high-frequency electronic devices due to SiC's excellent performance in high-frequency and high-power applications. This has led to an increase in the demand for SiC wafer production and processing equipment.

Market Restraints

Process Complexity: The wafer thinning process for SiC wafers involves high-precision techniques and is technically challenging. The instability of the process may lead to quality issues, affecting market confidence.

Intensifying Competition: As the SiC market rapidly develops, more companies are entering the field, and market competition is becoming increasingly intense. This may lead to price wars and margin compression.

Technological Iteration: With the fast pace of technological updates, the introduction of new technologies and equipment may quickly render existing equipment obsolete. Companies need to continue investing in research and development to maintain competitiveness.

LP Information, Inc. (LPI) ' newest research report, the “SiC Wafer Thinning Equipment Industry Forecast” looks at past sales and reviews total world SiC Wafer Thinning Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected SiC Wafer Thinning Equipment sales for 2025 through 2031. With SiC Wafer Thinning Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world SiC Wafer Thinning Equipment industry.

This Insight Report provides a comprehensive analysis of the global SiC Wafer Thinning Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on SiC Wafer Thinning Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global SiC Wafer Thinning Equipment market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for SiC Wafer Thinning Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global SiC Wafer Thinning Equipment.

This report presents a comprehensive overview, market shares, and growth opportunities of SiC Wafer Thinning Equipment market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Full-Automatic
Semi-Automatic

Segmentation by Application:
6 Inch and Below
8 Inch and Above

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Disco
TSD
TOKYO SEIMITSU
Engis Corporation
Okamoto Semiconductor Equipment Division
Revasum
Koyo Machinery
G&N

Key Questions Addressed in this Report

What is the 10-year outlook for the global SiC Wafer Thinning Equipment market?

What factors are driving SiC Wafer Thinning Equipment market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do SiC Wafer Thinning Equipment market opportunities vary by end market size?

How does SiC Wafer Thinning Equipment break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.