Global Semiconductor Wafer Laser Grooving Equipment Market Growth 2025-2031
Description
The global Semiconductor Wafer Laser Grooving Equipment market size is predicted to grow from US$ 466 million in 2025 to US$ 808 million in 2031; it is expected to grow at a CAGR of 9.6% from 2025 to 2031.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
Semiconductor wafer laser grooving equipment is a special equipment that uses high-energy laser beams to precisely cut or groove semiconductor materials. Its core principle is to locally ablate or vaporize the material through the high energy density of the laser to form the required micron- or nanometer-scale slot structure.
Semiconductor wafer laser grooving equipment plays a vital role in the global semiconductor manufacturing industry, especially driven by advanced processes and advanced packaging technologies, and market demand continues to grow.
The Semiconductor wafer laser grooving equipment market has shown strong growth momentum in recent years, mainly benefiting from the rapid development of the semiconductor industry and the increased demand for precision manufacturing processes. With the increase in chip integration, traditional blade-wheel scribing technology can no longer meet the processing requirements of low-k dielectric wafers. Laser grooving technology, due to its non-contact processing characteristics, can effectively avoid film cracking and shedding, and has become the preferred process in the field of advanced packaging. The Asia-Pacific region occupies a dominant position, accounting for approximately 70% in 2024. Among them, China dominates photovoltaic and consumer electronics demand, while Japan and South Korea focus on high-end chip manufacturing.
At present, the global Semiconductor wafer laser grooving equipment market is mainly dominated by international manufacturers such as DISCO, ASMPT and EO Technics, with a combined market share of more than 71%. With the advancement of localization, domestic manufacturers such as Dr Laser and Huagong Laser have made significant progress in technology research and development and market expansion, gradually narrowing the gap with international leading companies.
Semiconductor wafer laser grooving equipment is widely used in solar cell, integrated circuits and other fields. In the solar industry, it is mainly used for back electrode grooving and heterojunction precision processing of PERC and HJT cells, accounting for about 35% in 2024. This equipment is gradually penetrating into emerging fields such as MEMS sensors, quantum chips and optical communication devices.
In the future, with the further popularization of fields such as 5G, artificial intelligence, and the Internet of Things, the market demand for Semiconductor wafer laser grooving equipment is expected to continue to grow. At the same time, technological progress and innovation will drive the improvement of equipment performance, reduce production costs, and improve production efficiency. In addition, the demand for environmental protection and sustainable development will also prompt companies to develop more energy-saving and environmentally friendly equipment. Overall, the Semiconductor wafer laser grooving equipment market has broad prospects and will usher in more opportunities and challenges in the next few years.
LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Wafer Laser Grooving Equipment Industry Forecast” looks at past sales and reviews total world Semiconductor Wafer Laser Grooving Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Wafer Laser Grooving Equipment sales for 2025 through 2031. With Semiconductor Wafer Laser Grooving Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Wafer Laser Grooving Equipment industry.
This Insight Report provides a comprehensive analysis of the global Semiconductor Wafer Laser Grooving Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Wafer Laser Grooving Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Wafer Laser Grooving Equipment market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Wafer Laser Grooving Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Wafer Laser Grooving Equipment.
This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Wafer Laser Grooving Equipment market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Fully Automatic
Semi-automatic
Segmentation by Application:
Integrated Circuit
Photovoltaic Broad
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
DISCO
ASMPT
EO Technics
Wuhan Dr Laser Technology
Delphi Laser
Synova
Suzhou Maxwell Technologies
Suzhou Lumi Laser Technology
Han's Laser Technology
Wuhan Huagong Laser Engineering
ACCRETECH
Key Questions Addressed in this Report
What is the 10-year outlook for the global Semiconductor Wafer Laser Grooving Equipment market?
What factors are driving Semiconductor Wafer Laser Grooving Equipment market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Semiconductor Wafer Laser Grooving Equipment market opportunities vary by end market size?
How does Semiconductor Wafer Laser Grooving Equipment break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
Semiconductor wafer laser grooving equipment is a special equipment that uses high-energy laser beams to precisely cut or groove semiconductor materials. Its core principle is to locally ablate or vaporize the material through the high energy density of the laser to form the required micron- or nanometer-scale slot structure.
Semiconductor wafer laser grooving equipment plays a vital role in the global semiconductor manufacturing industry, especially driven by advanced processes and advanced packaging technologies, and market demand continues to grow.
The Semiconductor wafer laser grooving equipment market has shown strong growth momentum in recent years, mainly benefiting from the rapid development of the semiconductor industry and the increased demand for precision manufacturing processes. With the increase in chip integration, traditional blade-wheel scribing technology can no longer meet the processing requirements of low-k dielectric wafers. Laser grooving technology, due to its non-contact processing characteristics, can effectively avoid film cracking and shedding, and has become the preferred process in the field of advanced packaging. The Asia-Pacific region occupies a dominant position, accounting for approximately 70% in 2024. Among them, China dominates photovoltaic and consumer electronics demand, while Japan and South Korea focus on high-end chip manufacturing.
At present, the global Semiconductor wafer laser grooving equipment market is mainly dominated by international manufacturers such as DISCO, ASMPT and EO Technics, with a combined market share of more than 71%. With the advancement of localization, domestic manufacturers such as Dr Laser and Huagong Laser have made significant progress in technology research and development and market expansion, gradually narrowing the gap with international leading companies.
Semiconductor wafer laser grooving equipment is widely used in solar cell, integrated circuits and other fields. In the solar industry, it is mainly used for back electrode grooving and heterojunction precision processing of PERC and HJT cells, accounting for about 35% in 2024. This equipment is gradually penetrating into emerging fields such as MEMS sensors, quantum chips and optical communication devices.
In the future, with the further popularization of fields such as 5G, artificial intelligence, and the Internet of Things, the market demand for Semiconductor wafer laser grooving equipment is expected to continue to grow. At the same time, technological progress and innovation will drive the improvement of equipment performance, reduce production costs, and improve production efficiency. In addition, the demand for environmental protection and sustainable development will also prompt companies to develop more energy-saving and environmentally friendly equipment. Overall, the Semiconductor wafer laser grooving equipment market has broad prospects and will usher in more opportunities and challenges in the next few years.
LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Wafer Laser Grooving Equipment Industry Forecast” looks at past sales and reviews total world Semiconductor Wafer Laser Grooving Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Wafer Laser Grooving Equipment sales for 2025 through 2031. With Semiconductor Wafer Laser Grooving Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Wafer Laser Grooving Equipment industry.
This Insight Report provides a comprehensive analysis of the global Semiconductor Wafer Laser Grooving Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Wafer Laser Grooving Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Wafer Laser Grooving Equipment market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Wafer Laser Grooving Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Wafer Laser Grooving Equipment.
This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Wafer Laser Grooving Equipment market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Fully Automatic
Semi-automatic
Segmentation by Application:
Integrated Circuit
Photovoltaic Broad
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
DISCO
ASMPT
EO Technics
Wuhan Dr Laser Technology
Delphi Laser
Synova
Suzhou Maxwell Technologies
Suzhou Lumi Laser Technology
Han's Laser Technology
Wuhan Huagong Laser Engineering
ACCRETECH
Key Questions Addressed in this Report
What is the 10-year outlook for the global Semiconductor Wafer Laser Grooving Equipment market?
What factors are driving Semiconductor Wafer Laser Grooving Equipment market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Semiconductor Wafer Laser Grooving Equipment market opportunities vary by end market size?
How does Semiconductor Wafer Laser Grooving Equipment break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
112 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Semiconductor Wafer Laser Grooving Equipment by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Semiconductor Wafer Laser Grooving Equipment by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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