Global Semiconductor Transfer Molding Equipment Market Growth 2025-2031
Description
The global Semiconductor Transfer Molding Equipment market size is predicted to grow from US$ 1802 million in 2025 to US$ 2669 million in 2031; it is expected to grow at a CAGR of 6.8% from 2025 to 2031.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
Semiconductor transfer molding equipment is a key equipment dedicated to packaging integrated circuit chips. It is mainly used to achieve the uniform injection of thermosetting plastic packaging materials into the mold under high temperature and high pressure, thereby completing the chip packaging process. This type of equipment is widely used in various packaging forms such as discrete devices, power modules, BGA, QFN, SOP, etc., with significant advantages such as high packaging efficiency, high molding accuracy, and high material utilization. Transfer molding technology, with its excellent sealing and thermal conductivity, can effectively protect chips from external moisture, mechanical shock and chemical corrosion, extend chip life and improve product reliability.
Market Trends
In applications such as power devices, automotive electronics, 5G communication chips, and industrial control chips that require extremely high packaging reliability, transfer molding has become an irreplaceable key process with its excellent packaging consistency and excellent mechanical and electrical protection performance. The market demand for miniaturized, high-density, and high-power packaging has driven the demand for high-precision and high-efficiency transfer molding equipment. At the same time, the continuous evolution of packaging forms, such as multi-chip packaging (MCM) and system-level packaging (SiP), is also driving the equipment from a single function to multi-cavity, high automation and intelligence.
Market Disadvantages
The core technology of high-end equipment is mainly in the hands of a few equipment manufacturers in Japan, South Korea, Europe and the United States. The core links involved, such as mold precision processing, temperature control system, and injection precision control, have high technical barriers, and domestic manufacturers are still in the catching-up stage. Due to the complex structure and high degree of automation of the equipment, customers tend to choose equipment brands with mature cases and long-term stable operation records when purchasing, which forms a market access barrier for new entrants.
Market Outlook
Emerging fields such as smart terminals, electric vehicles, and the Internet of Things continue to generate huge demand for high-reliability packaging, thereby driving molding equipment to develop in the direction of higher precision, stronger stability, and higher integration. In the future, equipment will place more emphasis on the combination of automation and informatization, such as the introduction of AI detection, remote operation and maintenance, and real-time data analysis to improve packaging quality control and production efficiency. In addition, with the continuous transfer of global semiconductor manufacturing capabilities to the Asia-Pacific region and the strong support of the "domestic substitution" policy, local equipment companies are expected to usher in the dual opportunities of technological breakthroughs and increased market share.
LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Transfer Molding Equipment Industry Forecast” looks at past sales and reviews total world Semiconductor Transfer Molding Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Transfer Molding Equipment sales for 2025 through 2031. With Semiconductor Transfer Molding Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Transfer Molding Equipment industry.
This Insight Report provides a comprehensive analysis of the global Semiconductor Transfer Molding Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Transfer Molding Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Transfer Molding Equipment market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Transfer Molding Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Transfer Molding Equipment.
This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Transfer Molding Equipment market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Automatic
Semi-automatic
Manual
Segmentation by Application:
BGA
QFN
QFP
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
TOWA Corporation
ASMPT
Yamaha Motor Robotics Holdings
I-PEX
Besi
Takara Tool & Die
Boschman
FUSEI MENIX
Shanghai Xinsheng Semiconductor Technology
Guangdong Taijin Semiconductor Technology
Key Questions Addressed in this Report
What is the 10-year outlook for the global Semiconductor Transfer Molding Equipment market?
What factors are driving Semiconductor Transfer Molding Equipment market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Semiconductor Transfer Molding Equipment market opportunities vary by end market size?
How does Semiconductor Transfer Molding Equipment break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
Semiconductor transfer molding equipment is a key equipment dedicated to packaging integrated circuit chips. It is mainly used to achieve the uniform injection of thermosetting plastic packaging materials into the mold under high temperature and high pressure, thereby completing the chip packaging process. This type of equipment is widely used in various packaging forms such as discrete devices, power modules, BGA, QFN, SOP, etc., with significant advantages such as high packaging efficiency, high molding accuracy, and high material utilization. Transfer molding technology, with its excellent sealing and thermal conductivity, can effectively protect chips from external moisture, mechanical shock and chemical corrosion, extend chip life and improve product reliability.
Market Trends
In applications such as power devices, automotive electronics, 5G communication chips, and industrial control chips that require extremely high packaging reliability, transfer molding has become an irreplaceable key process with its excellent packaging consistency and excellent mechanical and electrical protection performance. The market demand for miniaturized, high-density, and high-power packaging has driven the demand for high-precision and high-efficiency transfer molding equipment. At the same time, the continuous evolution of packaging forms, such as multi-chip packaging (MCM) and system-level packaging (SiP), is also driving the equipment from a single function to multi-cavity, high automation and intelligence.
Market Disadvantages
The core technology of high-end equipment is mainly in the hands of a few equipment manufacturers in Japan, South Korea, Europe and the United States. The core links involved, such as mold precision processing, temperature control system, and injection precision control, have high technical barriers, and domestic manufacturers are still in the catching-up stage. Due to the complex structure and high degree of automation of the equipment, customers tend to choose equipment brands with mature cases and long-term stable operation records when purchasing, which forms a market access barrier for new entrants.
Market Outlook
Emerging fields such as smart terminals, electric vehicles, and the Internet of Things continue to generate huge demand for high-reliability packaging, thereby driving molding equipment to develop in the direction of higher precision, stronger stability, and higher integration. In the future, equipment will place more emphasis on the combination of automation and informatization, such as the introduction of AI detection, remote operation and maintenance, and real-time data analysis to improve packaging quality control and production efficiency. In addition, with the continuous transfer of global semiconductor manufacturing capabilities to the Asia-Pacific region and the strong support of the "domestic substitution" policy, local equipment companies are expected to usher in the dual opportunities of technological breakthroughs and increased market share.
LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Transfer Molding Equipment Industry Forecast” looks at past sales and reviews total world Semiconductor Transfer Molding Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Transfer Molding Equipment sales for 2025 through 2031. With Semiconductor Transfer Molding Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Transfer Molding Equipment industry.
This Insight Report provides a comprehensive analysis of the global Semiconductor Transfer Molding Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Transfer Molding Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Transfer Molding Equipment market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Transfer Molding Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Transfer Molding Equipment.
This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Transfer Molding Equipment market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Automatic
Semi-automatic
Manual
Segmentation by Application:
BGA
QFN
QFP
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
TOWA Corporation
ASMPT
Yamaha Motor Robotics Holdings
I-PEX
Besi
Takara Tool & Die
Boschman
FUSEI MENIX
Shanghai Xinsheng Semiconductor Technology
Guangdong Taijin Semiconductor Technology
Key Questions Addressed in this Report
What is the 10-year outlook for the global Semiconductor Transfer Molding Equipment market?
What factors are driving Semiconductor Transfer Molding Equipment market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Semiconductor Transfer Molding Equipment market opportunities vary by end market size?
How does Semiconductor Transfer Molding Equipment break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
102 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Semiconductor Transfer Molding Equipment by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Semiconductor Transfer Molding Equipment by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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