Global Semiconductor Laser Annealing Machine Market Growth 2025-2031

The global Semiconductor Laser Annealing Machine market size is predicted to grow from US$ 965 million in 2025 to US$ 1811 million in 2031; it is expected to grow at a CAGR of 11.1% from 2025 to 2031.

In the manufacturing process of semiconductor devices, in order to form specific doping in silicon wafers, multiple ion implantation processes are required during the manufacturing process. During the ion input process, the bombardment of impurity ions will cause a certain degree of lattice damage to the silicon atoms in the wafer, resulting in the impurity ions not being able to be located in the correct lattice position and not having the proper electrical activity. Therefore, the wafer needs to be heat treated to repair the lattice and activate the electrical activity of the impurity ions. This heat treatment process is called annealing.

Semiconductor laser annealing machine refers to special equipment that uses high-energy laser beams for automated annealing processes. Its main function is to project a beam spot of a specific shape and uniform energy distribution onto a semiconductor wafer to anneal, scan and process the wafer. Compared with traditional furnace annealing and rapid annealing technology, laser annealing has the advantages of high instantaneous temperature, short action time, low thermal budget, and optional area processing, which can better meet the process requirements of thin-film processing and efficient activation. At present, laser annealing equipment has been widely used in the field of cutting-edge logic chip manufacturing.

Semiconductor Laser Annealing Machine can be divided into power laser annealing equipment and IC front-end laser annealing equipment. Power laser annealing equipment accounts for more than half, and IC front-end laser annealing equipment has the fastest growth rate. In 2023, the power annealing market share is about 55%. IGBT has become one of the fastest-growing power devices with its excellent performance. With the maturity of wafer thinning technology, thin-film high-voltage IGBT will become a future development trend; in addition, as the research and development of the third-generation wide bandgap semiconductor material SiC becomes more mature, the demand for SiC devices will gradually increase. Laser annealing technology is suitable for thin-film high-voltage IGBT and SiC products, and will continue to be one of the mainstream technologies in the future.

The development of the semiconductor laser annealing machine market is mainly driven by the downstream power device market and the advanced process chip market. In the field of power devices, power devices can be divided into traditional silicon-based devices and wide bandgap material devices according to material type. At present, silicon-based devices with a wide application base will still be the mainstream products for a long time in the future, such as IGBT. Benefiting from the development of industrial control, frequency conversion, and new energy industries, my country's power device industry will maintain steady growth. In addition, as the world's largest IGBT market, China has a large space for import substitution, and the acceleration of the localization process will benefit domestic equipment manufacturers.

The major semiconductor laser annealing machine manufacturers in the global market include Mitsui Group (JSW), Sumitomo Heavy Industries, SCREEN Semiconductor Solutions, Applied Materials and Veeco, etc. The top five companies in the world account for nearly 87% of the market. The overall market concentration is high, and most of the high-end market is monopolized by foreign companies. It is expected that industry competition will become more intense in the next few years, especially in the Chinese market.

LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Laser Annealing Machine Industry Forecast” looks at past sales and reviews total world Semiconductor Laser Annealing Machine sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Laser Annealing Machine sales for 2025 through 2031. With Semiconductor Laser Annealing Machine sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Laser Annealing Machine industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Laser Annealing Machine landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Laser Annealing Machine portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Laser Annealing Machine market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Laser Annealing Machine and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Laser Annealing Machine.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Laser Annealing Machine market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Power Laser Annealing Machine
IC Front-end Laser Annealing Machine

Segmentation by Application:
Power Semiconductor
Advanced Process Chip

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Mitsui Group (JSW)
Sumitomo Heavy Industries
SCREEN Semiconductor Solutions
Veeco
Applied Materials
Hitachi
YAC BEAM
Shanghai Micro Electronics Equipment
EO Technics
Beijing U-PRECISION Tech
Chengdu Laipu Technology
Hans DSI
ETA Semitech

Key Questions Addressed in this Report

What is the 10-year outlook for the global Semiconductor Laser Annealing Machine market?

What factors are driving Semiconductor Laser Annealing Machine market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Semiconductor Laser Annealing Machine market opportunities vary by end market size?

How does Semiconductor Laser Annealing Machine break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.


*This is a tentative TOC and the final deliverable is subject to change.*
1 Scope of the Report
2 Executive Summary
3 Global by Company
4 World Historic Review for Semiconductor Laser Annealing Machine by Geographic Region
5 Americas
6 APAC
7 Europe
8 Middle East & Africa
9 Market Drivers, Challenges and Trends
10 Manufacturing Cost Structure Analysis
11 Marketing, Distributors and Customer
12 World Forecast Review for Semiconductor Laser Annealing Machine by Geographic Region
13 Key Players Analysis
14 Research Findings and Conclusion

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