Global Semiconductor Equipment Machined Parts Market Growth (Status and Outlook) 2025-2031

According to this study, the global Semiconductor Equipment Machined Parts market size will reach US$ 31970 million by 2031.

Semiconductor equipment components are the individual parts required during the fabrication of semiconductor tools, designed to meet stringent requirements for materials, structural integrity, process compatibility, precision, reliability, and stability. Mechanical components in particular establish the overall framework and basic structure of the equipment, maintain the controlled wafer reaction environment, and enable specialized functions—thereby ensuring high process yields and extending equipment lifetime. These mechanical parts are further classified into metal parts (the largest share), quartz parts, and ceramic parts. Typical metal mechanical components include reaction chambers, transfer chambers, transition chambers, chamber liners, gas distribution plates, wafer susceptors or trays, cooling plates, machine bases, and cast-steel platforms.

The market for metal mechanical components in semiconductor equipment is highly fragmented, with most suppliers focusing on specific process technologies or part families. For example, Jingjiang Pioneer specializes in precision metal fabrications; Torrance Precision Machines focuses on aluminum-alloy and stainless-steel chambers and shaft components; Jiangfeng Electronics supplies components for PVD, CVD, CMP, and wafer cleaning tools; and Xianfeng Precision concentrates on metal parts for etch and thin-film deposition tools. This segmentation reflects the diversity of component types and the specialized expertise required for each process step, leading to a landscape of niche suppliers rather than a few dominant players.

According to Semiconductor Industry Association (SIA), global semiconductor chip sales hit $627.6 billion in 2024, an increase of 19.1% compared to the 2023 total of $526.8 billion. The global semiconductor market experienced its highest-ever sales year in 2024, topping $600 billion in annual sales for the first time, and double-digit market growth is projected for 2025. Semiconductors enable virtually all modern technologies – including medical devices, communications, defense applications, AI, advanced transportation, and countless others – and the long-term industry outlook is incredibly strong. Regionally, yearly sales were up in the Americas (44.8%), China (18.3%), and Asia Pacific/All Others (12.5%), but down in Japan (-0.4%), and Europe (-8.1%).

Several semiconductor product segments stood out in 2024. Sales of logic products totaled $212.6 billion in 2024, making it the largest product category by sales. Memory products were second in terms of sales, increasing by 78.9% in 2024 to a total of $165.1 billion. DRAM products, a subset of memory, recorded an 82.6% sales increase, the largest percentage growth of any product category in 2024.

The development of Semiconductor Equipment Machined Parts is closely intertwined with the overall trends in semiconductor equipment. As Moore's Law continues to evolve, the precision and efficiency requirements for chip manufacturing have been consistently escalating, driving continuous advancements in semiconductor equipment technology. This technological progress subsequently enables sustained improvements in chip performance and cost reductions, meeting the growing demand for chip products in the digital economy era. In recent years, despite intensified global trade fluctuations, emerging market demands from artificial intelligence, new energy vehicles, and low-altitude economy sectors have maintained strong global demand for wafer fabrication plant construction. It is anticipated that in the coming years, the global semiconductor equipment industry will continue to experience rapid development, which will further propel the advancement of Semiconductor Equipment Machined Parts.

LPI (LP Information)' newest research report, the “Semiconductor Equipment Machined Parts Industry Forecast” looks at past sales and reviews total world Semiconductor Equipment Machined Parts sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Equipment Machined Parts sales for 2025 through 2031. With Semiconductor Equipment Machined Parts sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Equipment Machined Parts industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Equipment Machined Parts landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Semiconductor Equipment Machined Parts portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Equipment Machined Parts market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Equipment Machined Parts and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Equipment Machined Parts.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Equipment Machined Parts market by product type, application, key players and key regions and countries.

Segmentation by Type:
Semiconductor Equipment Metal Parts
Semiconductor Equipment Ceramic Parts
Semiconductor Equipment Parts

Segmentation by Application:
Semiconductor Deposition Equipment
Semiconductor Etch Equipment
Lithography Machines
Ion Implant Equipment
Heat Treatment Equipment
CMP Equipment
Wafer Handling
Assembly Equipment
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Fiti Group
VACGEN
N2TECH CO., LTD
Calitech
Marumae Co., Ltd
KSM Co., Ltd
Technetics Semi
EKK Eagle Semicon Components, Inc
VALQUA, LTD.
Bellows Technology
AK Tech Co
Senior Flexonics
Shiny Precision CO., LTD
VAT Group AG
Hy-Lok USA, Inc.
Metal-Flex® Welded Bellows, Inc
Ohno Bellows Industry
IRIE KOKEN CO., LTD.
NABELL Corporation
BELLOWS KUZE CO.,LTD.
ANZ Corporation
GST CO.,LTD.
Everfit Technology Co.,Ltd
Sanyue ST co., Ltd
Liaoning SEALTECH Technology
Sprint Precision Technologies Co., Ltd
KFMI
Shenyang Fortune Precision Equipment Co., Ltd
Tolerance Technology (Shanghai)
Duratek Technology Co., Ltd.
IRIE KOKEN
BoBoo
InSource
GNB-KL Group
Kaiser Aluminum (Imperial Machine & Tool)
LACO Technologies

Please note: The report will take approximately 2 business days to prepare and deliver. Show more