Global Semiconductor Die Attach Materials Market Growth 2025-2031
Description
The global Semiconductor Die Attach Materials market size is predicted to grow from US$ 543 million in 2025 to US$ 736 million in 2031; it is expected to grow at a CAGR of 5.2% from 2025 to 2031.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
Typical die-attach materials are PbSn, PbSnAg or PbInAg alloys. These alloys wet conventional substrates and die metallizations due to the formation of intermetallic compounds, which build an adhesion layer between substrate or die metallization and bulk solder. To achieve the best wetting and lowest void rate, the solder material should contain the lowest possible oxide content. The die-attach layer has two main functions: mechanical fixation of the die on its substrate, and dissipation of heat generated in the die. Especially in power and high-power applications, generated heat density is high. Therefore, conventional die-attach adhesives or eutectic solder alloys are not suitable as die-attach materials. For these applications, high-melting solder alloys are used, which contain more than 85% lead by weight, and do not satisfy the requirements of RoHS. Since there is no established lead-free substitute on the market, high-lead alloys are included on the exemption list of RoHS for these applications. However, die-attach materials that satisfy the requirements of RoHS do exist.
Tip: It should be noted that the solder paste and tin wire used in the PCB of the electronics industry are not included in the statistical scope of the report because this part of the product is mainly used for the soldering of electronic components rather than the soldering of chips. According to QYR"s investigation, with the increase of SMT equipment, die-attach wires used for die-attach materials are becoming less and less, and die-attach wires are mainly used in the electronics manufacturing industry instead of chip bonding.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Die Attach Materials Industry Forecast” looks at past sales and reviews total world Semiconductor Die Attach Materials sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Die Attach Materials sales for 2025 through 2031. With Semiconductor Die Attach Materials sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Die Attach Materials industry.
This Insight Report provides a comprehensive analysis of the global Semiconductor Die Attach Materials landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Die Attach Materials portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Die Attach Materials market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Die Attach Materials and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Die Attach Materials.
This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Die Attach Materials market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Die Attach Paste
Die Attach Wire
Others
Segmentation by Application:
Consumer Electronics
Automotive
Medical
Telecommunications
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
SMIC
Henkel
Shenzhen Vital New Material
Indium
Alpha Assembly Solutions
TONGFANG TECH
Umicore
Heraeu
AIM
TAMURA RADIO
Kyocera
Shanghai Jinji
Palomar Technologies
Nordson EFD
DuPont
Key Questions Addressed in this Report
What is the 10-year outlook for the global Semiconductor Die Attach Materials market?
What factors are driving Semiconductor Die Attach Materials market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Semiconductor Die Attach Materials market opportunities vary by end market size?
How does Semiconductor Die Attach Materials break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
Typical die-attach materials are PbSn, PbSnAg or PbInAg alloys. These alloys wet conventional substrates and die metallizations due to the formation of intermetallic compounds, which build an adhesion layer between substrate or die metallization and bulk solder. To achieve the best wetting and lowest void rate, the solder material should contain the lowest possible oxide content. The die-attach layer has two main functions: mechanical fixation of the die on its substrate, and dissipation of heat generated in the die. Especially in power and high-power applications, generated heat density is high. Therefore, conventional die-attach adhesives or eutectic solder alloys are not suitable as die-attach materials. For these applications, high-melting solder alloys are used, which contain more than 85% lead by weight, and do not satisfy the requirements of RoHS. Since there is no established lead-free substitute on the market, high-lead alloys are included on the exemption list of RoHS for these applications. However, die-attach materials that satisfy the requirements of RoHS do exist.
Tip: It should be noted that the solder paste and tin wire used in the PCB of the electronics industry are not included in the statistical scope of the report because this part of the product is mainly used for the soldering of electronic components rather than the soldering of chips. According to QYR"s investigation, with the increase of SMT equipment, die-attach wires used for die-attach materials are becoming less and less, and die-attach wires are mainly used in the electronics manufacturing industry instead of chip bonding.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Die Attach Materials Industry Forecast” looks at past sales and reviews total world Semiconductor Die Attach Materials sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Die Attach Materials sales for 2025 through 2031. With Semiconductor Die Attach Materials sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Die Attach Materials industry.
This Insight Report provides a comprehensive analysis of the global Semiconductor Die Attach Materials landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Die Attach Materials portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Die Attach Materials market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Die Attach Materials and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Die Attach Materials.
This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Die Attach Materials market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Die Attach Paste
Die Attach Wire
Others
Segmentation by Application:
Consumer Electronics
Automotive
Medical
Telecommunications
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
SMIC
Henkel
Shenzhen Vital New Material
Indium
Alpha Assembly Solutions
TONGFANG TECH
Umicore
Heraeu
AIM
TAMURA RADIO
Kyocera
Shanghai Jinji
Palomar Technologies
Nordson EFD
DuPont
Key Questions Addressed in this Report
What is the 10-year outlook for the global Semiconductor Die Attach Materials market?
What factors are driving Semiconductor Die Attach Materials market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Semiconductor Die Attach Materials market opportunities vary by end market size?
How does Semiconductor Die Attach Materials break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
121 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Semiconductor Die Attach Materials by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Semiconductor Die Attach Materials by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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