Global Semiconductor Dicing Equipment Market Growth 2025-2031

The global Semiconductor Dicing Equipment market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.

Semiconductor Dicing Equipment is a processing equipment for the back-end process of semiconductor chips. It is used for micro-processing such as wafer dicing, segmentation or slotting. The quality and efficiency of its cutting directly affect the quality and production cost of the chip. It is mainly used to cut silicon wafers, wafers or other semiconductor materials into small-sized chips or wafers. These devices are very important in the semiconductor industry because they can accurately cut the required chip size, ensuring the accuracy and quality of the product.

According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.

LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Dicing Equipment Industry Forecast” looks at past sales and reviews total world Semiconductor Dicing Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Dicing Equipment sales for 2025 through 2031. With Semiconductor Dicing Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Dicing Equipment industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Dicing Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Dicing Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Dicing Equipment market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Dicing Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Dicing Equipment.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Dicing Equipment market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:

Grinding Wheel Dicing Machine

Laser Dicing Machine

Segmentation by Application:

200 mm Wafer

300 mm Wafer

Others

This report also splits the market by region:

Americas

United States

Canada

Mexico

Brazil

APAC

China

Japan

Korea

Southeast Asia

India

Australia

Europe

Germany

France

UK

Italy

Russia

Middle East & Africa

Egypt

South Africa

Israel

Turkey

GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.

Disco

Tokyo Seimitsu

Genesem

CETC

ASMPT

Synova S.A.

GL Tech Co.,Ltd.

Han's Laser Technology Co

Wuxi Autowell

HGTECH

EO Technics

Shenyang Heyan Technology

Jiangsu Jing ChuangAdvanced electronic technology

Bojiexin

Neon Tech

Key Questions Addressed in this Report

What is the 10-year outlook for the global Semiconductor Dicing Equipment market?

What factors are driving Semiconductor Dicing Equipment market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Semiconductor Dicing Equipment market opportunities vary by end market size?

How does Semiconductor Dicing Equipment break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.