Global Semiconductor Compression Molding Equipment Market Growth 2025-2031
Description
The global Semiconductor Compression Molding Equipment market size is predicted to grow from US$ 1551 million in 2025 to US$ 2301 million in 2031; it is expected to grow at a CAGR of 6.8% from 2025 to 2031.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
Semiconductor compression molding equipment is a key equipment dedicated to the chip packaging stage. It is mainly used to mold packaging materials such as thermosetting epoxy resin under high temperature and high pressure to package semiconductor components such as chips, power modules, and sensors. Its working principle is to accurately inject resin into the chip cavity through the mold system under heating, and solidify it in a vacuum environment or under the protection of inert gas to achieve sealed protection of the chip. The equipment is suitable for a variety of packaging forms, including QFN, BGA, SOP, DIP, etc., and has the characteristics of high packaging accuracy, high efficiency, and strong adaptability.
Market Trends
As the global semiconductor industry continues to develop towards high integration, miniaturization and high performance, compression molding packaging, as a packaging technology with high reliability, high production capacity and low cost advantages, is being adopted by more and more chip manufacturers, especially in power devices, automotive-grade ICs, MEMS devices and advanced packaging (such as SiP, 3D packaging). At the same time, the development of smart manufacturing and digital factories has also accelerated the upgrading of equipment towards intelligent, remote monitoring and data tracking systems.
Market Disadvantages
The technical barriers of equipment are high. Key links such as core control systems, precision mold manufacturing technology, temperature control and heat equalization technology are mainly controlled by a few equipment giants such as Japan, the United States and South Korea. The technical accumulation of domestic equipment manufacturers is still weak. Packaging customers have extremely high requirements for equipment stability and packaging consistency. The trial and error cost is high and the verification cycle is long. It is difficult for new brand equipment to quickly replace existing mature models.
Market Outlook
Against the background of rapid development in new energy vehicles, 5G communications, the Internet of Things and high-performance computing, the surge in demand for high thermal stability and high mechanical strength packaging solutions will further create market space for high-end compression molding equipment. Equipment technology will evolve towards high-precision mold control, rapid mold change, multi-cavity synchronization, high automation and AI control systems, while promoting collaborative innovation in materials, processes and equipment.
LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Compression Molding Equipment Industry Forecast” looks at past sales and reviews total world Semiconductor Compression Molding Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Compression Molding Equipment sales for 2025 through 2031. With Semiconductor Compression Molding Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Compression Molding Equipment industry.
This Insight Report provides a comprehensive analysis of the global Semiconductor Compression Molding Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Compression Molding Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Compression Molding Equipment market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Compression Molding Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Compression Molding Equipment.
This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Compression Molding Equipment market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Semi-automatic Type
Fully Automatic Type
Segmentation by Application:
Traditional Packaging
Advanced Packaging
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
TOWA Corporation
Yamaha Motor Robotics Holdings
Takara Tool & Die
I-PEX
Besi
Shanghai Xinsheng Semiconductor Technology
Key Questions Addressed in this Report
What is the 10-year outlook for the global Semiconductor Compression Molding Equipment market?
What factors are driving Semiconductor Compression Molding Equipment market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Semiconductor Compression Molding Equipment market opportunities vary by end market size?
How does Semiconductor Compression Molding Equipment break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
Semiconductor compression molding equipment is a key equipment dedicated to the chip packaging stage. It is mainly used to mold packaging materials such as thermosetting epoxy resin under high temperature and high pressure to package semiconductor components such as chips, power modules, and sensors. Its working principle is to accurately inject resin into the chip cavity through the mold system under heating, and solidify it in a vacuum environment or under the protection of inert gas to achieve sealed protection of the chip. The equipment is suitable for a variety of packaging forms, including QFN, BGA, SOP, DIP, etc., and has the characteristics of high packaging accuracy, high efficiency, and strong adaptability.
Market Trends
As the global semiconductor industry continues to develop towards high integration, miniaturization and high performance, compression molding packaging, as a packaging technology with high reliability, high production capacity and low cost advantages, is being adopted by more and more chip manufacturers, especially in power devices, automotive-grade ICs, MEMS devices and advanced packaging (such as SiP, 3D packaging). At the same time, the development of smart manufacturing and digital factories has also accelerated the upgrading of equipment towards intelligent, remote monitoring and data tracking systems.
Market Disadvantages
The technical barriers of equipment are high. Key links such as core control systems, precision mold manufacturing technology, temperature control and heat equalization technology are mainly controlled by a few equipment giants such as Japan, the United States and South Korea. The technical accumulation of domestic equipment manufacturers is still weak. Packaging customers have extremely high requirements for equipment stability and packaging consistency. The trial and error cost is high and the verification cycle is long. It is difficult for new brand equipment to quickly replace existing mature models.
Market Outlook
Against the background of rapid development in new energy vehicles, 5G communications, the Internet of Things and high-performance computing, the surge in demand for high thermal stability and high mechanical strength packaging solutions will further create market space for high-end compression molding equipment. Equipment technology will evolve towards high-precision mold control, rapid mold change, multi-cavity synchronization, high automation and AI control systems, while promoting collaborative innovation in materials, processes and equipment.
LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Compression Molding Equipment Industry Forecast” looks at past sales and reviews total world Semiconductor Compression Molding Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Compression Molding Equipment sales for 2025 through 2031. With Semiconductor Compression Molding Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Compression Molding Equipment industry.
This Insight Report provides a comprehensive analysis of the global Semiconductor Compression Molding Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Compression Molding Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Compression Molding Equipment market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Compression Molding Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Compression Molding Equipment.
This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Compression Molding Equipment market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Semi-automatic Type
Fully Automatic Type
Segmentation by Application:
Traditional Packaging
Advanced Packaging
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
TOWA Corporation
Yamaha Motor Robotics Holdings
Takara Tool & Die
I-PEX
Besi
Shanghai Xinsheng Semiconductor Technology
Key Questions Addressed in this Report
What is the 10-year outlook for the global Semiconductor Compression Molding Equipment market?
What factors are driving Semiconductor Compression Molding Equipment market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Semiconductor Compression Molding Equipment market opportunities vary by end market size?
How does Semiconductor Compression Molding Equipment break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
88 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Semiconductor Compression Molding Equipment by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Semiconductor Compression Molding Equipment by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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