Global Semiconductor Ball Mounting Market Growth 2025-2031
Description
The global Semiconductor Ball Mounting market size is predicted to grow from US$ 217 million in 2025 to US$ 369 million in 2031; it is expected to grow at a CAGR of 9.3% from 2025 to 2031.
Semiconductor Ball Mounting is a piece of equipment in semiconductor manufacturing, mainly used to permanently connect wafers of different materials. As part of the back-end engineering of semiconductor production, bonding metal wires and ceramic riving knives are used to perform ball bonding on the electrodes in the chip before wafer cutting, and the wire tails are cut to form protruding electrodes (threads). pillar bump) process. After the ball is planted, the protruding electrodes of the chip are connected through the key flip chip process to form an electronic circuit.
According to the SEMI, global sales of semiconductor equipment was US$ 109 billion in 2022, a year-on-year increase of 5.6%. Mainland China is the largest semiconductor equipment market in the world. For the third consecutive year, China remained the largest semiconductor equipment market in 2022 despite a 5% slowdown in the pace of investments in the region year over year, accounting for $28.3 billion in billings. China Taiwan, the second-largest destination for equipment spending, recorded an increase of 8% to $26.8 billion, marking the fourth straight year of growth for the region. Equipment sales to Korea contracted 14% to $21.5 billion. Annual semiconductor equipment investments in Europe surged 93%, while North America logged a 38% increase. Sales to the Rest of World and Japan increased 34% and 7% year over year, respectively.
LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Ball Mounting Industry Forecast” looks at past sales and reviews total world Semiconductor Ball Mounting sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Ball Mounting sales for 2025 through 2031. With Semiconductor Ball Mounting sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Ball Mounting industry.
This Insight Report provides a comprehensive analysis of the global Semiconductor Ball Mounting landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Ball Mounting portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Ball Mounting market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Ball Mounting and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Ball Mounting.
This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Ball Mounting market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Fully Automatic
Semi-automatic
Segmentation by Application:
BAG
CSP
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Pac Tech
Minami
Ueno Seiki Co Ltd
Seiko Epson Corporation
SHIBUYA
K&S
Rokkko Group
Shenzhen TEC-PHO Co., Ltd.
Shanghai Techsense Co.,Ltd
Dezhengzn
GKG Precision Machine Co., Ltd.
Athlete FA
Shanghai Micson Industrial Automation Co., Ltd.
Beijing Horizon Robotics Technology R&D Co., Ltd
Key Questions Addressed in this Report
What is the 10-year outlook for the global Semiconductor Ball Mounting market?
What factors are driving Semiconductor Ball Mounting market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Semiconductor Ball Mounting market opportunities vary by end market size?
How does Semiconductor Ball Mounting break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Semiconductor Ball Mounting is a piece of equipment in semiconductor manufacturing, mainly used to permanently connect wafers of different materials. As part of the back-end engineering of semiconductor production, bonding metal wires and ceramic riving knives are used to perform ball bonding on the electrodes in the chip before wafer cutting, and the wire tails are cut to form protruding electrodes (threads). pillar bump) process. After the ball is planted, the protruding electrodes of the chip are connected through the key flip chip process to form an electronic circuit.
According to the SEMI, global sales of semiconductor equipment was US$ 109 billion in 2022, a year-on-year increase of 5.6%. Mainland China is the largest semiconductor equipment market in the world. For the third consecutive year, China remained the largest semiconductor equipment market in 2022 despite a 5% slowdown in the pace of investments in the region year over year, accounting for $28.3 billion in billings. China Taiwan, the second-largest destination for equipment spending, recorded an increase of 8% to $26.8 billion, marking the fourth straight year of growth for the region. Equipment sales to Korea contracted 14% to $21.5 billion. Annual semiconductor equipment investments in Europe surged 93%, while North America logged a 38% increase. Sales to the Rest of World and Japan increased 34% and 7% year over year, respectively.
LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Ball Mounting Industry Forecast” looks at past sales and reviews total world Semiconductor Ball Mounting sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Ball Mounting sales for 2025 through 2031. With Semiconductor Ball Mounting sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Ball Mounting industry.
This Insight Report provides a comprehensive analysis of the global Semiconductor Ball Mounting landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Ball Mounting portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Ball Mounting market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Ball Mounting and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Ball Mounting.
This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Ball Mounting market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Fully Automatic
Semi-automatic
Segmentation by Application:
BAG
CSP
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Pac Tech
Minami
Ueno Seiki Co Ltd
Seiko Epson Corporation
SHIBUYA
K&S
Rokkko Group
Shenzhen TEC-PHO Co., Ltd.
Shanghai Techsense Co.,Ltd
Dezhengzn
GKG Precision Machine Co., Ltd.
Athlete FA
Shanghai Micson Industrial Automation Co., Ltd.
Beijing Horizon Robotics Technology R&D Co., Ltd
Key Questions Addressed in this Report
What is the 10-year outlook for the global Semiconductor Ball Mounting market?
What factors are driving Semiconductor Ball Mounting market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Semiconductor Ball Mounting market opportunities vary by end market size?
How does Semiconductor Ball Mounting break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
107 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Semiconductor Ball Mounting by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Semiconductor Ball Mounting by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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