Global Semiconductor Back-End Test Equipment Market Growth 2025-2031

The global Semiconductor Back-End Test Equipment market size is predicted to grow from US$ 7456 million in 2025 to US$ 13180 million in 2031; it is expected to grow at a CAGR of 10.0% from 2025 to 2031.

Semiconductor equipment is mainly divided into front-end equipment and back-end packaging and testing equipment. Front-end equipment is mainly wafer manufacturing equipment, while back-end packaging and testing equipment includes testers (ATE), handlers, probe stations, thinning machines, dicing machines, etc.

This article's statistics on semiconductor back-end test equipment (integrated circuit test equipment) mainly include three types of equipment: testers (ATE), handlers, and probe stations.

Testers, also known as automated test systems (ATE), are mainly used to conduct comprehensive testing of the functions and performance parameters of wafers and chips. This includes testing of semiconductor discrete devices (such as power semiconductor discrete devices and small signal discrete devices), as well as testing of analog and mixed-signal integrated circuits. This equipment plays an important role in the semiconductor industry chain and is widely used in the main links from chip design verification, testing during wafer manufacturing, to finished product testing after packaging is completed.

Handler is mainly used in the finished product inspection link of the design verification stage and the packaging test stage of integrated circuits. Its core function is to automatically transport the chip to be tested to the test area (that is, the location where the chip is connected to the test equipment and tested). In the test area, the pins of the chip are connected to the functional units of the test equipment through specific wiring. After the test equipment completes the test, it feeds the results back to the Handler, and the Handler identifies, classifies and collects the tested chips based on these test results.

The test machine (ATE) is a special equipment for testing the function and performance of the chip. The Handler and the probe station are special equipment for connecting the tested chips and wafers to the functional modules of the test machine and realizing batch automated testing.

In the wafer inspection stage, the main test equipment used is the probe station and the test machine, while in the chip design verification and finished product testing stages, the main test equipment used is the handler and the test machine.

Semiconductor back-end test equipment is a branch of the entire semiconductor equipment. From the perspective of the distribution of global semiconductor equipment sales regions, the market is mainly concentrated in mainland China and Taiwan, China, and the market share of the two regions will exceed 60% in 2024. However, from the perspective of equipment self-sufficiency, the level of localization in China is still relatively low. High-end semiconductor back-end test equipment manufacturers mainly come from Japan and other countries. In recent years, with the support of national policies, China's semiconductor industry has developed rapidly, and the sales scale of semiconductor back-end test equipment in mainland China has continued to grow. Chinese local companies such as Hangzhou Changchuan, Beijing Huafeng Test & Control Technology, PowerTECH Co., Ltd, and JHT Design Co., Ltd have occupied a certain share in the global back-end test equipment market.

From the perspective of the downstream of the industrial chain, the customer base of semiconductor back-end test equipment presents diversified characteristics, covering four core areas of OSAT, IDM and scientific research institutions, among which packaging and testing companies are the main ones. The differences in the needs of different customers reflect the trend of division of labor refinement and technology upgrading in the semiconductor industry. With the popularization of advanced packaging technologies (such as 3D packaging and system-level packaging), the development trends of test product technology mainly include a large number of tests, fast test speed, multi-functional modules, and high test accuracy. Packaging and testing companies need to use high-precision testing equipment to cope with the testing challenges of complex chips, and rely on big data analysis capabilities to optimize the test process and reduce costs. At the same time, the coexistence and development of equipment of multiple technical levels has also become one of the core development trends of semiconductor equipment.

The growth of the scale of semiconductor back-end test equipment depends on the expansion of the scale of the integrated circuit packaging market. From a technical perspective, the continuous breakthroughs in packaging technology directly push up the threshold of testing technology. Taking 3D packaging as an example, the vertical interconnection structure of through silicon vias (TSVs) needs to be tested at the micron level through a probe station, while the heterogeneous integration of multiple chips in the system-level packaging (SiP) requires ATE equipment to have parallel testing, protocol compatibility, and extreme condition simulation capabilities. From the perspective of industrial chain division of labor, the independent operation of the packaging and testing links strengthens the stickiness of equipment demand. In order to serve global customers, OSAT needs to configure highly flexible handlers and modular ATE systems to adapt to cross-domain orders from consumer electronics to automotive electronics. Terminal application upgrades inject continuous momentum into the equipment market, such as 5G and new energy vehicles.

LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Back-End Test Equipment Industry Forecast” looks at past sales and reviews total world Semiconductor Back-End Test Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Back-End Test Equipment sales for 2025 through 2031. With Semiconductor Back-End Test Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Back-End Test Equipment industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Back-End Test Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Back-End Test Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Back-End Test Equipment market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Back-End Test Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Back-End Test Equipment.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Back-End Test Equipment market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
ATE
Handler
Probe Station

Segmentation by Application:
IDM
OSAT
Scientific Research

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Accretech
TEL
Semics
Fittech
Sidea Semiconductor
FormFactor
Advantest
Teradyne
Cohu
Hangzhou Changchuan Technology
YC Corp
Beijing Huafeng Test & Control Technology
Chroma ATE Inc
Hon Precision
SPEA
Shibasoku
Macrotest
PowerTECH
HON PRECISION, INC
JHT Design Co.,Ltd
Boston Semi Equipment
SESSCO Technologies
SYNAX
Microtec Handling Systems GmbH
Tesec Inc
Techwing
Kanematsu
UENO SEIKI NAGANO
Shanghai Cascol
Shenzhen Semishare
MPI Corporation
Micronics Japan
ASM Pacific Technology
Everbeing
MarTek
Micromanipulator
Signatone Corporation
HiSOL, Inc
KeyFactor Systems
Wentworth Laboratories
APOLLOWAVE
SemiProbe
MicroXact
KeithLink Technology
Ecopia
Shenzhen Cindbest Technology
ESDEMC Technology
Lake Shore Cryotronics
Wuhan Jingce Electronic Technology
Exatron
SEMES
Mirae Corporation
ATECO
Pentamaster
CETC45
Shenzhen Hi-Test Semiconductor Equipment Co., Ltd
Shenzhen Biaopu Semiconductor Technology
Shanghai YOUNG SOUL

Key Questions Addressed in this Report

What is the 10-year outlook for the global Semiconductor Back-End Test Equipment market?

What factors are driving Semiconductor Back-End Test Equipment market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Semiconductor Back-End Test Equipment market opportunities vary by end market size?

How does Semiconductor Back-End Test Equipment break out by Type, by Application?

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