Global Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems Market Growth 2026-2032
Description
The global Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems market size is predicted to grow from US$ 3712 million in 2025 to US$ 5371 million in 2032; it is expected to grow at a CAGR of 5.4% from 2026 to 2032.
PECVD is a deposition technology to deposit thin films using plasma technology. Compared to other deposition technologies such as PVD and Thermal CVD which are widely used for semiconductor device fabrication, PECVD can deposit thin films with high uniformity over the wafers at relatively low temperature (less than 350°C). Furthermore, this plasma deposition technology offers excellent material property control (refractive index, hardness and more) of thin films such as SiO2, SiNx, a-Si, SiON and DLC. In 2025, the global shipment volume of PECVD systems is expected to be approximately 13,000 units, with an average product price of approximately US$350,000 per unit.
The PECVD systems market is primarily driven by sustained demand for high-performance thin-film deposition capabilities within the electronics and photovoltaic sectors. In semiconductor manufacturing, as technology nodes shrink and packaging complexity increases, there is a growing reliance on low-temperature, high-uniformity film deposition processes for passivation, barrier, and dielectric layers, reinforcing the need for advanced plasma-enhanced deposition equipment. In the photovoltaic industry, production capacity for advanced cell technologies such as high-efficiency heterojunction (HJT) and passivated emitter rear contact (PERC) cells stimulates PECVD adoption due to their requirements for high-quality thin films. Growth in displays, sensors, and MEMS devices also expands the range of thin-film applications necessitating PECVD technology. Additionally, the global shift toward higher-value manufacturing and the push for automation and equipment reliability further encourage investment in high-throughput, stable PECVD systems, contributing to market growth.
The key players are Applied Materials, ASM International, Lam Research, Wonik IPS, Meyer Burger, Centrotherm, Tempress, Plasma-Therm, S.C New Energy Technology, Jusung Engineering, KLA-Tencor (Orbotech), ULVAC, Inc, Beijing NAURA, Shenyang Piotech, Oxford Instruments, SAMCO, CVD Equipment Corporation, Trion Technology, SENTECH Instruments, NANO-MASTER and so on. Some of the leading manufacturers such as Applied Materials, ASM International, Lam Research, Wonik IPS accounted for a market share of about 75% in 2025 due to high demand from end users and advancements in R&D. Asia Pacific dominated the industry. Based on type, the market has been further segregated into Parallel Plate Type PECVD Systems and Tube Type PECVD Systems. The Tube Type Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems segment accounted for the largest market share in 2025. The Semiconductor Industry and Solar Industry segment dominated the market in 2025.
LP Information, Inc. (LPI) ' newest research report, the “Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems Industry Forecast” looks at past sales and reviews total world Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems sales in 2025, providing a comprehensive analysis by region and market sector of projected Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems sales for 2026 through 2032. With Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems industry.
This Insight Report provides a comprehensive analysis of the global Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems.
This report presents a comprehensive overview, market shares, and growth opportunities of Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Parallel Plate Type PECVD Systems
Tube Type PECVD Systems
Segmentation by Chamber Configuration:
Single-Chamber Systems
Multi-Chamber Cluster Systems
In-Line Systems
Roll-to-Roll Systems
Segmentation by Film Type:
Dielectric Film Deposition Systems
Passivation Film Deposition Systems
Barrier Film Deposition Systems
Functional and Optical Film Deposition Systems
Segmentation by Application:
Semiconductor Industry
Solar Industry
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Applied Materials
ASM International
Lam Research
Wonik IPS
Meyer Burger
Centrotherm
Tempress
Plasma-Therm
S.C New Energy Technology
Jusung Engineering
KLA-Tencor (Orbotech)
ULVAC, Inc
Beijing NAURA
Shenyang Piotech
Oxford Instruments
SAMCO
CVD Equipment Corporation
Trion Technology
SENTECH Instruments
NANO-MASTER
Key Questions Addressed in this Report
What is the 10-year outlook for the global Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems market?
What factors are driving Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems market opportunities vary by end market size?
How does Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
PECVD is a deposition technology to deposit thin films using plasma technology. Compared to other deposition technologies such as PVD and Thermal CVD which are widely used for semiconductor device fabrication, PECVD can deposit thin films with high uniformity over the wafers at relatively low temperature (less than 350°C). Furthermore, this plasma deposition technology offers excellent material property control (refractive index, hardness and more) of thin films such as SiO2, SiNx, a-Si, SiON and DLC. In 2025, the global shipment volume of PECVD systems is expected to be approximately 13,000 units, with an average product price of approximately US$350,000 per unit.
The PECVD systems market is primarily driven by sustained demand for high-performance thin-film deposition capabilities within the electronics and photovoltaic sectors. In semiconductor manufacturing, as technology nodes shrink and packaging complexity increases, there is a growing reliance on low-temperature, high-uniformity film deposition processes for passivation, barrier, and dielectric layers, reinforcing the need for advanced plasma-enhanced deposition equipment. In the photovoltaic industry, production capacity for advanced cell technologies such as high-efficiency heterojunction (HJT) and passivated emitter rear contact (PERC) cells stimulates PECVD adoption due to their requirements for high-quality thin films. Growth in displays, sensors, and MEMS devices also expands the range of thin-film applications necessitating PECVD technology. Additionally, the global shift toward higher-value manufacturing and the push for automation and equipment reliability further encourage investment in high-throughput, stable PECVD systems, contributing to market growth.
The key players are Applied Materials, ASM International, Lam Research, Wonik IPS, Meyer Burger, Centrotherm, Tempress, Plasma-Therm, S.C New Energy Technology, Jusung Engineering, KLA-Tencor (Orbotech), ULVAC, Inc, Beijing NAURA, Shenyang Piotech, Oxford Instruments, SAMCO, CVD Equipment Corporation, Trion Technology, SENTECH Instruments, NANO-MASTER and so on. Some of the leading manufacturers such as Applied Materials, ASM International, Lam Research, Wonik IPS accounted for a market share of about 75% in 2025 due to high demand from end users and advancements in R&D. Asia Pacific dominated the industry. Based on type, the market has been further segregated into Parallel Plate Type PECVD Systems and Tube Type PECVD Systems. The Tube Type Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems segment accounted for the largest market share in 2025. The Semiconductor Industry and Solar Industry segment dominated the market in 2025.
LP Information, Inc. (LPI) ' newest research report, the “Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems Industry Forecast” looks at past sales and reviews total world Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems sales in 2025, providing a comprehensive analysis by region and market sector of projected Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems sales for 2026 through 2032. With Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems industry.
This Insight Report provides a comprehensive analysis of the global Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems.
This report presents a comprehensive overview, market shares, and growth opportunities of Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Parallel Plate Type PECVD Systems
Tube Type PECVD Systems
Segmentation by Chamber Configuration:
Single-Chamber Systems
Multi-Chamber Cluster Systems
In-Line Systems
Roll-to-Roll Systems
Segmentation by Film Type:
Dielectric Film Deposition Systems
Passivation Film Deposition Systems
Barrier Film Deposition Systems
Functional and Optical Film Deposition Systems
Segmentation by Application:
Semiconductor Industry
Solar Industry
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Applied Materials
ASM International
Lam Research
Wonik IPS
Meyer Burger
Centrotherm
Tempress
Plasma-Therm
S.C New Energy Technology
Jusung Engineering
KLA-Tencor (Orbotech)
ULVAC, Inc
Beijing NAURA
Shenyang Piotech
Oxford Instruments
SAMCO
CVD Equipment Corporation
Trion Technology
SENTECH Instruments
NANO-MASTER
Key Questions Addressed in this Report
What is the 10-year outlook for the global Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems market?
What factors are driving Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems market opportunities vary by end market size?
How does Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
126 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Plasma Enhanced Chemical Vapor Deposition (PECVD) Systems by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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