Global Planar Die Bonder Market Growth 2025-2031
Description
The global Planar Die Bonder market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.
A planar die bonder is a device used in the electronics assembly and packaging process. It is mainly used in the process of fixing micro components such as chips, chipsets, sensors, etc. on printed circuit boards (PCB) or other substrates. A planar die bonder usually includes a workbench, a feeding system and a die bonding head. In operation, the table holds the substrate, the feeding system supplies the chips or components, and the die attach head is responsible for placing the chip precisely on the substrate and fixing it using appropriate methods such as heat pressure or soldering. The operation process of a planar die bonder usually involves the following steps: Preparatory work: setting up and calibrating the machine, preparing substrates and chips. Loading: Place the chip or component in the feeding system, usually using a suction nozzle or other suitable fixture. Positioning: Place the substrate on the workbench and make sure the position is accurate. Die-bonding: The die-bonding head precisely places the chip or component on the substrate, and applies appropriate pressure or temperature to make it firmly connected to the substrate. Inspection: Check whether the connection after die bonding is accurate and reliable. Unloading: Remove the die-bonded substrate from the feeding system and prepare for the next operation. Planar die bonding machine plays a key role in the electronics manufacturing industry. It can improve production efficiency and ensure assembly quality, and is widely used in electronic equipment manufacturing, semiconductor packaging, sensor manufacturing and other fields.
United States market for Planar Die Bonder is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
China market for Planar Die Bonder is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Europe market for Planar Die Bonder is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Global key Planar Die Bonder players cover ASM Pacific Technology Ltd., Kulicke & Soffa Industries, Inc., Tokyo Electron Limited, Applied Materials, Inc., Disco Corporation, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.
LP Information, Inc. (LPI) ' newest research report, the “Planar Die Bonder Industry Forecast” looks at past sales and reviews total world Planar Die Bonder sales in 2024, providing a comprehensive analysis by region and market sector of projected Planar Die Bonder sales for 2025 through 2031. With Planar Die Bonder sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Planar Die Bonder industry.
This Insight Report provides a comprehensive analysis of the global Planar Die Bonder landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Planar Die Bonder portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Planar Die Bonder market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Planar Die Bonder and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Planar Die Bonder.
This report presents a comprehensive overview, market shares, and growth opportunities of Planar Die Bonder market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Manual Plane Die Bonder
Semi-Automatic Planar Die Bonder
Fully Automatic Flat Die Bonder
Segmentation by Application:
Semiconductor Manufacturing
Electronic Packaging
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
ASM Pacific Technology Ltd.
Kulicke & Soffa Industries, Inc.
Tokyo Electron Limited
Applied Materials, Inc.
Disco Corporation
EV Group (EVG)
SPTS Technologies Ltd.
Besi (BE Semiconductor Industries N.V.)
Nordson Corporation
Shibaura Mechatronics Corporation
Palomar Technologies, Inc.
Shinkawa Ltd.
Towa Corporation
F&K Delvotec Bondtechnik GmbH
West Bond, Inc.
Orthodyne Electronics Corporation
Key Questions Addressed in this Report
What is the 10-year outlook for the global Planar Die Bonder market?
What factors are driving Planar Die Bonder market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Planar Die Bonder market opportunities vary by end market size?
How does Planar Die Bonder break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
A planar die bonder is a device used in the electronics assembly and packaging process. It is mainly used in the process of fixing micro components such as chips, chipsets, sensors, etc. on printed circuit boards (PCB) or other substrates. A planar die bonder usually includes a workbench, a feeding system and a die bonding head. In operation, the table holds the substrate, the feeding system supplies the chips or components, and the die attach head is responsible for placing the chip precisely on the substrate and fixing it using appropriate methods such as heat pressure or soldering. The operation process of a planar die bonder usually involves the following steps: Preparatory work: setting up and calibrating the machine, preparing substrates and chips. Loading: Place the chip or component in the feeding system, usually using a suction nozzle or other suitable fixture. Positioning: Place the substrate on the workbench and make sure the position is accurate. Die-bonding: The die-bonding head precisely places the chip or component on the substrate, and applies appropriate pressure or temperature to make it firmly connected to the substrate. Inspection: Check whether the connection after die bonding is accurate and reliable. Unloading: Remove the die-bonded substrate from the feeding system and prepare for the next operation. Planar die bonding machine plays a key role in the electronics manufacturing industry. It can improve production efficiency and ensure assembly quality, and is widely used in electronic equipment manufacturing, semiconductor packaging, sensor manufacturing and other fields.
United States market for Planar Die Bonder is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
China market for Planar Die Bonder is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Europe market for Planar Die Bonder is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Global key Planar Die Bonder players cover ASM Pacific Technology Ltd., Kulicke & Soffa Industries, Inc., Tokyo Electron Limited, Applied Materials, Inc., Disco Corporation, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.
LP Information, Inc. (LPI) ' newest research report, the “Planar Die Bonder Industry Forecast” looks at past sales and reviews total world Planar Die Bonder sales in 2024, providing a comprehensive analysis by region and market sector of projected Planar Die Bonder sales for 2025 through 2031. With Planar Die Bonder sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Planar Die Bonder industry.
This Insight Report provides a comprehensive analysis of the global Planar Die Bonder landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Planar Die Bonder portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Planar Die Bonder market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Planar Die Bonder and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Planar Die Bonder.
This report presents a comprehensive overview, market shares, and growth opportunities of Planar Die Bonder market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Manual Plane Die Bonder
Semi-Automatic Planar Die Bonder
Fully Automatic Flat Die Bonder
Segmentation by Application:
Semiconductor Manufacturing
Electronic Packaging
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
ASM Pacific Technology Ltd.
Kulicke & Soffa Industries, Inc.
Tokyo Electron Limited
Applied Materials, Inc.
Disco Corporation
EV Group (EVG)
SPTS Technologies Ltd.
Besi (BE Semiconductor Industries N.V.)
Nordson Corporation
Shibaura Mechatronics Corporation
Palomar Technologies, Inc.
Shinkawa Ltd.
Towa Corporation
F&K Delvotec Bondtechnik GmbH
West Bond, Inc.
Orthodyne Electronics Corporation
Key Questions Addressed in this Report
What is the 10-year outlook for the global Planar Die Bonder market?
What factors are driving Planar Die Bonder market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Planar Die Bonder market opportunities vary by end market size?
How does Planar Die Bonder break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
126 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Planar Die Bonder by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Planar Die Bonder by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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