Global Photoresists for Advanced IC Packaging Market Growth 2025-2031

The global Photoresists for Advanced IC Packaging market size is predicted to grow from US$ 149 million in 2025 to US$ 212 million in 2031; it is expected to grow at a CAGR of 6.0% from 2025 to 2031.

In terms of product type, Thick Film Positive Photoresists accounting for 62% of the Photoresists for Advanced IC Packaging. And in terms of application, currently Thick Film Positive Photoresists are mainly used in semiconductor advanced packaging process, Wafer-Level Packaging and Flip Chip (FC) packaging, among them Flip Chip (FC) packaging is the largest application, with a share over 50%. Currently the Photoresists for Advanced IC Packaging are mainly produced in Japan, US, and Europe. Japan is the largest producer of thick layer photoresists, occupied over 55 percent, followed by Europe and North America. The global major manufacturers of Photoresists for Advanced IC Packaging include JSR, TOKYO OHKA KOGYO CO., LTD. (TOK), DuPont, and Merck KGaA (AZ), etc. In terms of revenue, the global 3 largest players have a market share over 80%.

LP Information, Inc. (LPI) ' newest research report, the “Photoresists for Advanced IC Packaging Industry Forecast” looks at past sales and reviews total world Photoresists for Advanced IC Packaging sales in 2024, providing a comprehensive analysis by region and market sector of projected Photoresists for Advanced IC Packaging sales for 2025 through 2031. With Photoresists for Advanced IC Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Photoresists for Advanced IC Packaging industry.

This Insight Report provides a comprehensive analysis of the global Photoresists for Advanced IC Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Photoresists for Advanced IC Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Photoresists for Advanced IC Packaging market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Photoresists for Advanced IC Packaging and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Photoresists for Advanced IC Packaging.

This report presents a comprehensive overview, market shares, and growth opportunities of Photoresists for Advanced IC Packaging market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Thick Film Positive Photoresists
Thick Film Negative Photoresists

Segmentation by Application:
Wafer-Level Packaging
2.5D & 3D Packaging
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
JSR
Tokyo Ohka Kogyo (TOK)
Merck KGaA (AZ)
DuPont
Shin-Etsu
Allresist
Futurrex
KemLab™ Inc
Youngchang Chemical
Everlight Chemical
Crystal Clear Electronic Material
Kempur Microelectronics Inc
Xuzhou B & C Chemical
nepes
Shanghai Sinyang Semiconductor Materials
eChem Slolutions Japan
Fuyang Sineva Material Technology

Key Questions Addressed in this Report

What is the 10-year outlook for the global Photoresists for Advanced IC Packaging market?

What factors are driving Photoresists for Advanced IC Packaging market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Photoresists for Advanced IC Packaging market opportunities vary by end market size?

How does Photoresists for Advanced IC Packaging break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.