Global PCB Copper Foil Market Growth 2025-2031

The global PCB Copper Foil market size is predicted to grow from US$ 5470 million in 2025 to US$ 6417 million in 2031; it is expected to grow at a CAGR of 2.7% from 2025 to 2031.

The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.

According to our Semiconductor Research Center, the global total output value of PCB was about US$ 81 billion in 2022. With strong drivers from new technology, such as AI, 5G and new energy vehicles, it is estimated that the PCB industry will continue to grow steadily in the next six years. Global PCB manufacturers are mainly located in China mainland, China Taiwan, Japan, South Korea, Europe and the United States. Among them, Chinese local PCB companies hold the biggest share.

LP Information, Inc. (LPI) ' newest research report, the “PCB Copper Foil Industry Forecast” looks at past sales and reviews total world PCB Copper Foil sales in 2024, providing a comprehensive analysis by region and market sector of projected PCB Copper Foil sales for 2025 through 2031. With PCB Copper Foil sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world PCB Copper Foil industry.

This Insight Report provides a comprehensive analysis of the global PCB Copper Foil landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on PCB Copper Foil portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global PCB Copper Foil market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for PCB Copper Foil and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global PCB Copper Foil.

This report presents a comprehensive overview, market shares, and growth opportunities of PCB Copper Foil market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Electrolytic Copper Foil
Rolled Copper Foil

Segmentation by Application:
Rigid Printed Circuit Board
Flexible Printed Circuit Board

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Fukuda
Mitsui Kinzoku
Furukawa Electric
JX Nippon Mining & Metal
Iljin Materials
Changchun Group
NPC
Co-Tech
LYCT
Jinbao Electronics
Kingboard Chemical
NUODE
Tongling Nonferrous Metal Group

Key Questions Addressed in this Report

What is the 10-year outlook for the global PCB Copper Foil market?

What factors are driving PCB Copper Foil market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do PCB Copper Foil market opportunities vary by end market size?

How does PCB Copper Foil break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver. Show more