Global PCB Cooling Buffer Market Growth 2026-2032
Description
The global PCB Cooling Buffer market size is predicted to grow from US$ 104 million in 2025 to US$ 149 million in 2032; it is expected to grow at a CAGR of 5.3% from 2026 to 2032.
The PCB cooling buffer machine is used for SMT or coating production lines and has two main functions. 1. Relieve the production speed issue of front-end and back-end devices. If the front-end devices are too fast or the back-end devices have abnormalities, resulting in product PCBA or PCB accumulation, the temporary storage machine can automatically store the products produced by the front-end devices, balance the speed of the front-end and back-end machines, and play a buffering role in the production speed of the front-end and back-end devices. 2. Temporary storage function: In the dispensing/coating production line, after dispensing or applying glue to PCBA, set the buffer time of the temporary storage machine and implement a first in first out mode for PCBA. The product is naturally dried (cured) through the temporary storage machine
United States market for PCB Cooling Buffer is estimated to increase from US$ million in 2025 to US$ million by 2032, at a CAGR of % from 2026 through 2032.
China market for PCB Cooling Buffer is estimated to increase from US$ million in 2025 to US$ million by 2032, at a CAGR of % from 2026 through 2032.
Europe market for PCB Cooling Buffer is estimated to increase from US$ million in 2025 to US$ million by 2032, at a CAGR of % from 2026 through 2032.
Global key PCB Cooling Buffer players cover INTEON Corporation, Famecs, KIHEUNG FA, I.C.T, Vanstron, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2025.
LP Information, Inc. (LPI) ' newest research report, the “PCB Cooling Buffer Industry Forecast” looks at past sales and reviews total world PCB Cooling Buffer sales in 2025, providing a comprehensive analysis by region and market sector of projected PCB Cooling Buffer sales for 2026 through 2032. With PCB Cooling Buffer sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world PCB Cooling Buffer industry.
This Insight Report provides a comprehensive analysis of the global PCB Cooling Buffer landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on PCB Cooling Buffer portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global PCB Cooling Buffer market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for PCB Cooling Buffer and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global PCB Cooling Buffer.
This report presents a comprehensive overview, market shares, and growth opportunities of PCB Cooling Buffer market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Power: Less Than 2 KW
Power: 2-5 KW
Power: Above 5 KW
Segmentation by Application:
PCB Board
LED Light Bar
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
INTEON Corporation
Famecs
KIHEUNG FA
I.C.T
Vanstron
Shenzhen Yongxinda Technology
Shenzhen WIT Intelligent Manufacturing Equipment
Shenzhen TOPSMT
Hayawin
Shenzhen WHC Electronic Technology
Shenzhen NLT
Shenzhen QIQI
WEC
Key Questions Addressed in this Report
What is the 10-year outlook for the global PCB Cooling Buffer market?
What factors are driving PCB Cooling Buffer market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do PCB Cooling Buffer market opportunities vary by end market size?
How does PCB Cooling Buffer break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
The PCB cooling buffer machine is used for SMT or coating production lines and has two main functions. 1. Relieve the production speed issue of front-end and back-end devices. If the front-end devices are too fast or the back-end devices have abnormalities, resulting in product PCBA or PCB accumulation, the temporary storage machine can automatically store the products produced by the front-end devices, balance the speed of the front-end and back-end machines, and play a buffering role in the production speed of the front-end and back-end devices. 2. Temporary storage function: In the dispensing/coating production line, after dispensing or applying glue to PCBA, set the buffer time of the temporary storage machine and implement a first in first out mode for PCBA. The product is naturally dried (cured) through the temporary storage machine
United States market for PCB Cooling Buffer is estimated to increase from US$ million in 2025 to US$ million by 2032, at a CAGR of % from 2026 through 2032.
China market for PCB Cooling Buffer is estimated to increase from US$ million in 2025 to US$ million by 2032, at a CAGR of % from 2026 through 2032.
Europe market for PCB Cooling Buffer is estimated to increase from US$ million in 2025 to US$ million by 2032, at a CAGR of % from 2026 through 2032.
Global key PCB Cooling Buffer players cover INTEON Corporation, Famecs, KIHEUNG FA, I.C.T, Vanstron, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2025.
LP Information, Inc. (LPI) ' newest research report, the “PCB Cooling Buffer Industry Forecast” looks at past sales and reviews total world PCB Cooling Buffer sales in 2025, providing a comprehensive analysis by region and market sector of projected PCB Cooling Buffer sales for 2026 through 2032. With PCB Cooling Buffer sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world PCB Cooling Buffer industry.
This Insight Report provides a comprehensive analysis of the global PCB Cooling Buffer landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on PCB Cooling Buffer portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global PCB Cooling Buffer market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for PCB Cooling Buffer and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global PCB Cooling Buffer.
This report presents a comprehensive overview, market shares, and growth opportunities of PCB Cooling Buffer market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Power: Less Than 2 KW
Power: 2-5 KW
Power: Above 5 KW
Segmentation by Application:
PCB Board
LED Light Bar
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
INTEON Corporation
Famecs
KIHEUNG FA
I.C.T
Vanstron
Shenzhen Yongxinda Technology
Shenzhen WIT Intelligent Manufacturing Equipment
Shenzhen TOPSMT
Hayawin
Shenzhen WHC Electronic Technology
Shenzhen NLT
Shenzhen QIQI
WEC
Key Questions Addressed in this Report
What is the 10-year outlook for the global PCB Cooling Buffer market?
What factors are driving PCB Cooling Buffer market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do PCB Cooling Buffer market opportunities vary by end market size?
How does PCB Cooling Buffer break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
111 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for PCB Cooling Buffer by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for PCB Cooling Buffer by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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