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Semiconductor Devices for High-Temperature Applications: Market Opportunities

Publisher BCC Research
Published Mar 28, 2025
Length 141 Pages
SKU # WA19890983

Description

Report Scope

This report provides an overview of the global semiconductor devices for high-temperature applications market and analyzes market trends. It provides the global revenue (in $ millions) for segments and regions, considering 2023 as the base year, with estimated market data for 2024 through 2029. The market is based on materials, device types, operating temperatures, industries and regions. Geographical segments covered are North America (U.S., Canada, Mexico), Europe (U.K., Germany, France, Italy, Rest of Europe), Asia-Pacific (China, Japan, South Korea, Rest of Asia-Pacific) and the Rest of the World (RoW), which includes South America, Middle East and Africa. The report also focuses on emerging technologies and vendor landscape. It concludes with profiles of the major players in the market.

Report Includes

59 data tables and 54 additional tables

An analysis of the global market for semiconductor devices for high-temperature applications

Analyses of the global market trends, with data from 2023, estimates for 2024, forecasts for 2025 and 2026, and projections of compound annual growth rates (CAGRs) through 2029

Evaluation of the market potential for semiconductor devices for hightemperature applications, industry growth drivers, and forecasts for this market’s segments and sub-segments

Estimates of the actual market size and revenue forecast for the global market for semiconductor devices for high-temperature applications, and a corresponding market share analysis by material type, device type, operating temperature, industry and region

Description of gallium nitride (GaN), silicon carbide (SiC) and gallium arsenide (GaAs); their products and applications

Discussion of the market dynamics and shifts, and the regulations, industry challenges, and macroeconomic factors affecting the demand for semiconductor devices for high-temperature applications

Discussion on the industry’s ESG challenges and practices

Identification of the companies that are best positioned to meet this demand because of their proprietary technologies, strategic alliances or other advantages

Insights into the industry structure for semiconductor devices for high-temperature applications, and the competitive landscape

Company profiles of major players within the industry, including Infineon Technologies AG, NXP Semiconductors, TDK Corp., Wolfspeed Inc., and Allegro MicroSystems LLC.

Companies Mentioned

Allegro Microsystems Inc.
Analog Devices Inc.
Cissoid
Fujitsu
General Electric Co.
Honeywell International Inc.
Infineon Technologies Ag
Lattice Semiconductor
Mitsubishi Electric Corp.
Nxp Semiconductors
Qorvo Inc.
Renesas Electronics Corp.
Rtx
Tdk Corp.
Texas Instruments Inc.
Toshiba Corp.
Wolfspeed Inc.

Table of Contents

141 Pages
Chapter 1 Executive Summary
Market Outlook
Scope of Report
Market Summary
Market Dynamics and Growth Factors
Emerging Technologies
Segmental Analysis
Regional Insights and Emerging Markets
Conclusion
Chapter 2 Market Overview
Current Market Scenario and Future Expectations
Macro-Economic Factors Analysis
Impact of Rising Inflation and Labor Shortages
Currency Exchange Rate Fluctuations
Geopolitical Tension and Trade Dynamics
Porter’s Five Force Analysis
Value Chain Analysis
Regulatory Landscape
Chapter 3 Market Dynamics
Key Takeaways
Market Drivers
Emergence of UWBG Materials
Growing Demand for High-Temperature Electronics
Growing Demand for Electric Aircraft and EVs
Market Restraints
Complexity in Design, Testing and Manufacturing for Semiconductor Devices
Higher Cost of Specialized Materials
Packaging Limitations and Absence of Standardized Testing
Market Opportunities
Growing Government Initiatives and Collaborative Efforts
Advancing Ultra-High-Temperature Electronics
Increasing Global Space Exploration
Chapter 4 Emerging Trends and Technologies
Overview
Emerging Trends
Advances in High-Temperature SiC Technologies and Manufacturing
Rising Focus on Ultra-High-Temperature Semiconductors Materials Beyond Silicon
Emerging Technologies
Packaging Innovations Enabling Reliable High-Temperature Semiconductor Operation
Ferroelectric Non-volatile Memory (NVM) and Thermal Management Innovations
Patent Analysis
Geographical Patterns
Key Findings
Chapter 5 Market Segmentation Analysis
Segmentation Breakdown
Market Breakdown by Materials
Key Takeaways
Silicon
III-V materials
Gallium Arsenide (GaAs)
Gallium Nitride (GaN)
Silicon Carbide (SiC)
Others
Market Breakdown by Device Types
Key Takeaways
Microcontrollers and Processing
Power Semiconductors
Power Management and Control
Others
Market Breakdown by Operating Temperature
Key Takeaways
126°C to 250°C
Higher than 250°C
Market Breakdown by Industry
Key Takeaways
Industrial and Instrumentation
Automotive
Aerospace and Defense
Energy and Power
Others
Geographic Breakdown
Market Breakdown by Region
Key Takeaways
North America
Europe
Asia-Pacific
Rest of the World
Chapter 6 Competitive Intelligence
Key Takeaways
Market Ecosystem Analysis
Analysis of Key Companies
Infineon Technologies AG
NXP Semiconductors
TDK Corp.
Strategic Analysis
Chapter 7 Sustainability in the Semiconductor Devices for High-Temperature Applications Industry: An ESG Perspective
Key Takeaways
Key ESG Issues in the Semiconductor Devices for High-Temperature Applications Market
Key Environmental Issues in Semiconductor Devices for High-Temperature Applications
Social Responsibility in Semiconductor Devices for High-Temperature Applications
Governance in Semiconductor Devices for High-Temperature Applications
ESG Performance Analysis
Environmental Performance
Social Performance
Governance Performance
Current Status of ESG in the Semiconductor Devices for High-Temperature Applications Market
Concluding Remarks from BCC Research
Chapter 8 Appendix
Methodology
Abbreviations
Company Profiles
ALLEGRO MICROSYSTEMS INC.
ANALOG DEVICES INC.
CISSOID
FUJITSU
GENERAL ELECTRIC CO.
HONEYWELL INTERNATIONAL INC.
INFINEON TECHNOLOGIES AG
LATTICE SEMICONDUCTOR
MITSUBISHI ELECTRIC CORP.
NXP SEMICONDUCTORS
QORVO INC.
RENESAS ELECTRONICS CORP.
RTX
TDK CORP.
TEXAS INSTRUMENTS INC.
TOSHIBA CORP.
WOLFSPEED INC.

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