Global NEV IGBT Modules Heatsink Market Growth 2026-2032
Description
The global NEV IGBT Modules Heatsink market size is predicted to grow from US$ 287 million in 2025 to US$ 615 million in 2032; it is expected to grow at a CAGR of 10.9% from 2026 to 2032.
NEV IGBT modules heatsink refers to a thermal management component specifically designed to dissipate the heat generated by IGBT (Insulated Gate Bipolar Transistor) modules used in New Energy Vehicles (NEVs). These heatsinks ensure the stable operation of power electronics such as inverters, DC-DC converters, and onboard chargers by effectively transferring heat away from the semiconductor junctions to maintain safe operating temperatures.
The value chain spans metals and alloys, seals/coatings, joining processes, TIM and coolant systems upstream; cold-plate/heatsink manufacturing and inspection midstream; and downstream power-module makers and Tier-1 e-drive system integrators that validate performance under automotive reliability regimes.
In 2025, global NEV IGBT modules heatsink production reached approximately 29 million units, with an average global market price is $10 per unit.
In new energy vehicles (NEVs), IGBT modules are widely adopted as core power devices in the powertrain system. Their efficient operation relies heavily on effective thermal management, with the heatsink playing a critical role in ensuring the reliability, longevity, and overall performance of the IGBT module and the vehicle.
Currently, mainstream IGBT heatsink substrates are mainly categorized into flat-base and pin-fin types. Flat-base heatsinks feature smooth surfaces, typically made from high-thermal-conductivity aluminum alloys or copper. These are attached to the IGBT module via press-fitting or bolts, ensuring close contact for efficient heat conduction. Characterized by simple structure and low manufacturing cost, flat-base heatsinks are suitable for low thermal density applications, such as hybrid vehicle power modules and on-board chargers (OBCs).
In contrast, pin-fin heatsinks employ densely arranged metal pins or columns to enhance heat exchange through liquid or air cooling. They are particularly suited for high-current, high heat-flux scenarios. Key power components such as motor control units (MCUs), motor controllers, and main inverter systems typically use pin-fin structures combined with cold plates to achieve high-performance thermal dissipation.
From an application standpoint, these heatsinks are widely used in motor controllers (MCUs), DC/AC inverters, OBC charging modules, and DC/DC converters in battery electric vehicles (BEVs) and plug-in hybrid electric vehicles (PHEVs). As NEVs evolve toward higher voltage and greater power output, IGBT modules are becoming increasingly integrated, imposing new demands on heatsinks for lightweight construction, compact design, and efficient thermal conductivity.
Looking ahead, with SiC devices gradually replacing traditional IGBTs, further improvements in thermal resistance control and structural compatibility are expected. This will drive the broader adoption of liquid cooling and hybrid cooling technologies in NEVs. As the demand for high-voltage, high-frequency, and high-power-density IGBT modules continues to rise, modular and integrated heatsink designs are becoming the trend, advancing toward lightweight, highly integrated structures with multi-channel flow paths.
LP Information, Inc. (LPI) ' newest research report, the “NEV IGBT Modules Heatsink Industry Forecast” looks at past sales and reviews total world NEV IGBT Modules Heatsink sales in 2025, providing a comprehensive analysis by region and market sector of projected NEV IGBT Modules Heatsink sales for 2026 through 2032. With NEV IGBT Modules Heatsink sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world NEV IGBT Modules Heatsink industry.
This Insight Report provides a comprehensive analysis of the global NEV IGBT Modules Heatsink landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on NEV IGBT Modules Heatsink portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global NEV IGBT Modules Heatsink market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for NEV IGBT Modules Heatsink and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global NEV IGBT Modules Heatsink.
This report presents a comprehensive overview, market shares, and growth opportunities of NEV IGBT Modules Heatsink market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Flat-base Heat Sink
Pin-fin Heat Sink
Segmentation by Material:
Cu Baseplate
AlSIC Baseplate
Other
Segmentation by Vehicle:
Passenger Car
Commercial Vehicle
Segmentation by Application:
BEV
PHEV
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Huangshan Googe
Heatsink Advanced Materials
Kunshan Gootage Thermal Technology
Dana Incorporated
Jentech Precision Industrial
Amulaire Thermal Technology
TAIWA CO., Ltd.
Wieland Microcool
Jiangyin Saiying Electron
Suzhou Haoli Electronic Technology
Sitritec Thermal Control Materials
Key Questions Addressed in this Report
What is the 10-year outlook for the global NEV IGBT Modules Heatsink market?
What factors are driving NEV IGBT Modules Heatsink market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do NEV IGBT Modules Heatsink market opportunities vary by end market size?
How does NEV IGBT Modules Heatsink break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
NEV IGBT modules heatsink refers to a thermal management component specifically designed to dissipate the heat generated by IGBT (Insulated Gate Bipolar Transistor) modules used in New Energy Vehicles (NEVs). These heatsinks ensure the stable operation of power electronics such as inverters, DC-DC converters, and onboard chargers by effectively transferring heat away from the semiconductor junctions to maintain safe operating temperatures.
The value chain spans metals and alloys, seals/coatings, joining processes, TIM and coolant systems upstream; cold-plate/heatsink manufacturing and inspection midstream; and downstream power-module makers and Tier-1 e-drive system integrators that validate performance under automotive reliability regimes.
In 2025, global NEV IGBT modules heatsink production reached approximately 29 million units, with an average global market price is $10 per unit.
In new energy vehicles (NEVs), IGBT modules are widely adopted as core power devices in the powertrain system. Their efficient operation relies heavily on effective thermal management, with the heatsink playing a critical role in ensuring the reliability, longevity, and overall performance of the IGBT module and the vehicle.
Currently, mainstream IGBT heatsink substrates are mainly categorized into flat-base and pin-fin types. Flat-base heatsinks feature smooth surfaces, typically made from high-thermal-conductivity aluminum alloys or copper. These are attached to the IGBT module via press-fitting or bolts, ensuring close contact for efficient heat conduction. Characterized by simple structure and low manufacturing cost, flat-base heatsinks are suitable for low thermal density applications, such as hybrid vehicle power modules and on-board chargers (OBCs).
In contrast, pin-fin heatsinks employ densely arranged metal pins or columns to enhance heat exchange through liquid or air cooling. They are particularly suited for high-current, high heat-flux scenarios. Key power components such as motor control units (MCUs), motor controllers, and main inverter systems typically use pin-fin structures combined with cold plates to achieve high-performance thermal dissipation.
From an application standpoint, these heatsinks are widely used in motor controllers (MCUs), DC/AC inverters, OBC charging modules, and DC/DC converters in battery electric vehicles (BEVs) and plug-in hybrid electric vehicles (PHEVs). As NEVs evolve toward higher voltage and greater power output, IGBT modules are becoming increasingly integrated, imposing new demands on heatsinks for lightweight construction, compact design, and efficient thermal conductivity.
Looking ahead, with SiC devices gradually replacing traditional IGBTs, further improvements in thermal resistance control and structural compatibility are expected. This will drive the broader adoption of liquid cooling and hybrid cooling technologies in NEVs. As the demand for high-voltage, high-frequency, and high-power-density IGBT modules continues to rise, modular and integrated heatsink designs are becoming the trend, advancing toward lightweight, highly integrated structures with multi-channel flow paths.
LP Information, Inc. (LPI) ' newest research report, the “NEV IGBT Modules Heatsink Industry Forecast” looks at past sales and reviews total world NEV IGBT Modules Heatsink sales in 2025, providing a comprehensive analysis by region and market sector of projected NEV IGBT Modules Heatsink sales for 2026 through 2032. With NEV IGBT Modules Heatsink sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world NEV IGBT Modules Heatsink industry.
This Insight Report provides a comprehensive analysis of the global NEV IGBT Modules Heatsink landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on NEV IGBT Modules Heatsink portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global NEV IGBT Modules Heatsink market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for NEV IGBT Modules Heatsink and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global NEV IGBT Modules Heatsink.
This report presents a comprehensive overview, market shares, and growth opportunities of NEV IGBT Modules Heatsink market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Flat-base Heat Sink
Pin-fin Heat Sink
Segmentation by Material:
Cu Baseplate
AlSIC Baseplate
Other
Segmentation by Vehicle:
Passenger Car
Commercial Vehicle
Segmentation by Application:
BEV
PHEV
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Huangshan Googe
Heatsink Advanced Materials
Kunshan Gootage Thermal Technology
Dana Incorporated
Jentech Precision Industrial
Amulaire Thermal Technology
TAIWA CO., Ltd.
Wieland Microcool
Jiangyin Saiying Electron
Suzhou Haoli Electronic Technology
Sitritec Thermal Control Materials
Key Questions Addressed in this Report
What is the 10-year outlook for the global NEV IGBT Modules Heatsink market?
What factors are driving NEV IGBT Modules Heatsink market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do NEV IGBT Modules Heatsink market opportunities vary by end market size?
How does NEV IGBT Modules Heatsink break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
125 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for NEV IGBT Modules Heatsink by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for NEV IGBT Modules Heatsink by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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