Global Multilayer HDI PCBs Market Growth 2025-2031

The global Multilayer HDI PCBs market size is predicted to grow from US$ 9494 million in 2025 to US$ 13110 million in 2031; it is expected to grow at a CAGR of 5.5% from 2025 to 2031.

Printed circuit boards (PCBs), also known as electronic circuit boards, are essential components found in various electronic devices that support our daily lives. The role of a printed circuit board is to serve as a foundation for mounting components and to establish electrical connections between them, allowing the transmission of electrical signals.

To draw an analogy, a printed circuit board functions as the skeletal and nervous system of the human body, playing a crucial role as the core device in electrical products.

Printed circuit boards play a vital role in various applications, bridging our lives and shaping the future.

This report studies the Multilayer HDI PCBs, include HDI PCB (1+N+1), HDI PCB (2+N+2), HDI PCB (3+N+3) and Anylayer HDI.

High-Density Interconnect (HDI) PCBs are advanced printed circuit boards characterized by high wiring density per unit area, achieved through the use of microvias, blind and buried vias, and build-up laminations. This design enables more compact and efficient electronic devices.

The global PCB market was valued at US$ 78.9billion in 2024 and is anticipated to reach US$ 101.6 billion by 2031, witnessing a CAGR of 4.86% during the forecast period 2025-2031. Asia-Pacific dominates the market, accounting for over 85% of global PCB production, led by China Mainland, China Taiwan, and South Korea.

The major global manufacturers of PCB include Unimicron, DSBJ (Dongshan Precision), Zhen Ding Technology, Kinwong, Shennan Circuit, Tripod Technology, Suntak Technology, Shenzhen Fastprint Circuit Tech, and Gul Technologies Group, etc. In 2024, the world's top 20 manufacturers accounted for approximately 54.12 % of the revenue.

LP Information, Inc. (LPI) ' newest research report, the “Multilayer HDI PCBs Industry Forecast” looks at past sales and reviews total world Multilayer HDI PCBs sales in 2024, providing a comprehensive analysis by region and market sector of projected Multilayer HDI PCBs sales for 2025 through 2031. With Multilayer HDI PCBs sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Multilayer HDI PCBs industry.

This Insight Report provides a comprehensive analysis of the global Multilayer HDI PCBs landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Multilayer HDI PCBs portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Multilayer HDI PCBs market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Multilayer HDI PCBs and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Multilayer HDI PCBs.

This report presents a comprehensive overview, market shares, and growth opportunities of Multilayer HDI PCBs market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
HDI PCB (1+N+1)
HDI PCB (2+N+2)
HDI PCB (3+N+3)
Anylayer HDI

Segmentation by Application:
Consumer Electronics
Automotive Electronics
Server & Data Center
Telecommunications
Industrial & Medical
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Zhen Ding Technology
Kinwong
Shennan Circuit
Suntak Technology
Shenzhen Fastprint Circuit Tech
Gul Technologies Group
Compeq Manufacturing
TTM Technologies, Inc
Ibiden
HannStar Board Corporation
Nan Ya PCB
Meiko Electronics
Daeduck Electronics
Simmtech
Victory Giant Technology
AKM Meadville
CMK Corporation
Aoshikang Technology
CHIN POON Industrial
Olympic Circuit
Dongguan Shengyi Electronics
Dynamic Electronics
Bomin Electronics
Founder PCB
TPT
KCE GROUP
Shenzhen Sun & Lynn Circuits
CCTC
Guangdong Kingshine Electronics
Sunshine Global Circuits

Key Questions Addressed in this Report

What is the 10-year outlook for the global Multilayer HDI PCBs market?

What factors are driving Multilayer HDI PCBs market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Multilayer HDI PCBs market opportunities vary by end market size?

How does Multilayer HDI PCBs break out by Type, by Application?

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