Global Molded Underfill Material Market Growth 2026-2032
Description
The global Molded Underfill Material market size is predicted to grow from US$ 1517 million in 2025 to US$ 2447 million in 2032; it is expected to grow at a CAGR of 7.1% from 2026 to 2032.
Molded underfill material is a packaging material used in semiconductor packaging processes to improve the mechanical reliability and performance of integrated circuits (ICs). During assembly, it is coated between the IC chip and the substrate/circuit board to provide structural support, heat dissipation, and protection against mechanical stress. The molded underfill material industry chain includes upstream epoxy resins, curing agents, fillers, coupling agents, and functional additives; midstream material formulation design, mixing and processing, molding-grade preparation, and quality testing; and downstream applications are mainly concentrated in semiconductor packaging plants, packaging and testing service providers, and electronics manufacturing companies. Supporting services cover material testing, reliability verification, application engineering support, and supply chain management to ensure stable packaging performance and improved yield. In 2025, the global production of molded underfill material was approximately 31,016 tons, with a global average market price of approximately US$50 per kilogram. The gross profit margin of major companies in the industry ranged from 25% to 45%. In 2025, the global production capacity of molded underfill material was approximately 41,355 tons.
The molded underfill material market is supported by the rapid expansion of advanced semiconductor packaging and the growing demand for reliable, high-density electronic devices. Trends such as chip miniaturization, higher I/O density, and heterogeneous integration increase the need for materials with low stress, strong adhesion, and high thermal stability. Automotive electronics, power devices, AI computing, and communication equipment are key growth areas due to stringent reliability requirements. Manufacturers are focusing on cost optimization, fast-curing formulations, and environmentally compliant materials. Overall, molded underfill materials are becoming a standard solution in modern packaging technologies, driving steady long-term market growth.
LP Information, Inc. (LPI) ' newest research report, the “Molded Underfill Material Industry Forecast” looks at past sales and reviews total world Molded Underfill Material sales in 2025, providing a comprehensive analysis by region and market sector of projected Molded Underfill Material sales for 2026 through 2032. With Molded Underfill Material sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Molded Underfill Material industry.
This Insight Report provides a comprehensive analysis of the global Molded Underfill Material landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Molded Underfill Material portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Molded Underfill Material market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Molded Underfill Material and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Molded Underfill Material.
This report presents a comprehensive overview, market shares, and growth opportunities of Molded Underfill Material market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Liquid Type
Paste Type
Other
Segmentation by Material Type:
Epoxy-based Molded Underfill
Silicone-based Molded Underfill
Hybrid Resin Molded Underfill
Segmentation by Curing Method:
Thermal Curing Underfill
UV-assisted Curing Underfill
Segmentation by Application:
Flip Chips
Chip Scale Packaging
Ball Grid Array
HBM
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Henkel Adhesives
Namics Corporation
Panasonic
Nordson
Parker
AIM Solder
AI Technology, Inc. (AIT)
Won Chemicals
H.B. Fuller
Dow
Sumitomo Bakelite
Resonac
Shin-Etsu Chemical
Kyocera
Jiangsu HHCK Advanced Materials Co.,Ltd.
Key Questions Addressed in this Report
What is the 10-year outlook for the global Molded Underfill Material market?
What factors are driving Molded Underfill Material market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Molded Underfill Material market opportunities vary by end market size?
How does Molded Underfill Material break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Molded underfill material is a packaging material used in semiconductor packaging processes to improve the mechanical reliability and performance of integrated circuits (ICs). During assembly, it is coated between the IC chip and the substrate/circuit board to provide structural support, heat dissipation, and protection against mechanical stress. The molded underfill material industry chain includes upstream epoxy resins, curing agents, fillers, coupling agents, and functional additives; midstream material formulation design, mixing and processing, molding-grade preparation, and quality testing; and downstream applications are mainly concentrated in semiconductor packaging plants, packaging and testing service providers, and electronics manufacturing companies. Supporting services cover material testing, reliability verification, application engineering support, and supply chain management to ensure stable packaging performance and improved yield. In 2025, the global production of molded underfill material was approximately 31,016 tons, with a global average market price of approximately US$50 per kilogram. The gross profit margin of major companies in the industry ranged from 25% to 45%. In 2025, the global production capacity of molded underfill material was approximately 41,355 tons.
The molded underfill material market is supported by the rapid expansion of advanced semiconductor packaging and the growing demand for reliable, high-density electronic devices. Trends such as chip miniaturization, higher I/O density, and heterogeneous integration increase the need for materials with low stress, strong adhesion, and high thermal stability. Automotive electronics, power devices, AI computing, and communication equipment are key growth areas due to stringent reliability requirements. Manufacturers are focusing on cost optimization, fast-curing formulations, and environmentally compliant materials. Overall, molded underfill materials are becoming a standard solution in modern packaging technologies, driving steady long-term market growth.
LP Information, Inc. (LPI) ' newest research report, the “Molded Underfill Material Industry Forecast” looks at past sales and reviews total world Molded Underfill Material sales in 2025, providing a comprehensive analysis by region and market sector of projected Molded Underfill Material sales for 2026 through 2032. With Molded Underfill Material sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Molded Underfill Material industry.
This Insight Report provides a comprehensive analysis of the global Molded Underfill Material landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Molded Underfill Material portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Molded Underfill Material market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Molded Underfill Material and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Molded Underfill Material.
This report presents a comprehensive overview, market shares, and growth opportunities of Molded Underfill Material market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Liquid Type
Paste Type
Other
Segmentation by Material Type:
Epoxy-based Molded Underfill
Silicone-based Molded Underfill
Hybrid Resin Molded Underfill
Segmentation by Curing Method:
Thermal Curing Underfill
UV-assisted Curing Underfill
Segmentation by Application:
Flip Chips
Chip Scale Packaging
Ball Grid Array
HBM
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Henkel Adhesives
Namics Corporation
Panasonic
Nordson
Parker
AIM Solder
AI Technology, Inc. (AIT)
Won Chemicals
H.B. Fuller
Dow
Sumitomo Bakelite
Resonac
Shin-Etsu Chemical
Kyocera
Jiangsu HHCK Advanced Materials Co.,Ltd.
Key Questions Addressed in this Report
What is the 10-year outlook for the global Molded Underfill Material market?
What factors are driving Molded Underfill Material market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Molded Underfill Material market opportunities vary by end market size?
How does Molded Underfill Material break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
115 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Molded Underfill Material by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Molded Underfill Material by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
Pricing
Currency Rates
Questions or Comments?
Our team has the ability to search within reports to verify it suits your needs. We can also help maximize your budget by finding sections of reports you can purchase.
