Global Molded Interconnect Substrate (MIS) Market Growth 2025-2031

The global Molded Interconnect Substrate (MIS) market size is predicted to grow from US$ 112 million in 2025 to US$ 228 million in 2031; it is expected to grow at a CAGR of 12.6% from 2025 to 2031.

Molded Interconnect Substrate Technology (MIS) is a novel substrate solution that is ideal for mobile industry. It encompasses a wide range of solutions for the complex needs of IC package for mobile applications. With its embedded copper trace technology, it enable a finer line and space that is needed for high I/O count with smaller form factor. It also provides a robust Flip Chip assembly process. Another important feature of MIS substrate is copper filled-via and filled-pad technologies, which is significantly important for high frequency requirements, and improve thermal dissipation.

Taiwanese PPt, Chineses MiSpak Technology and Malaysian QDOS.

PPt now can supply 1 layer, 2 layer, 3 layer, 4 layer and 6 layer MIS substrates. MiSpak Technology supplies 1 layer and 2 layer MIS substrates. QDOS supplies 1 layer, 2 layer and 3 layer MIS substrates

The growth potential of MIS products in the substrate application market will come from network communication products such as servers and data centers, automotive electronic control equipment driven by electric vehicles and automotive intelligence, as well as 5G, AIoT and other applications. With the launch of these related products, the requirements for substrates used in semiconductor packaging will also increase significantly, requiring a high degree of design flexibility, improved performance and high reliability.

In terms of advanced lead frame products, MIS manufacturers (PPt, MiSpak and QDOS) mainly supply products that are not limited to single-layer boards. PPt can also provide multi-layer board windable lead frame products for multi-chip packaging, which are products that are difficult for traditional lead frame suppliers to provide.

Currently the MIS substrates are mainly used in power/PMIC/analog, automotive electronics, RF/5G, Optical Image Stabilization (OIS), fingerprint recognition, third generation semiconductor, and LED, etc. Most of MIS substrates are used in power segment. For third generation semiconductor, MIS substrates are mainly used in GaN devices.

LP Information, Inc. (LPI) ' newest research report, the “Molded Interconnect Substrate (MIS) Industry Forecast” looks at past sales and reviews total world Molded Interconnect Substrate (MIS) sales in 2024, providing a comprehensive analysis by region and market sector of projected Molded Interconnect Substrate (MIS) sales for 2025 through 2031. With Molded Interconnect Substrate (MIS) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Molded Interconnect Substrate (MIS) industry.

This Insight Report provides a comprehensive analysis of the global Molded Interconnect Substrate (MIS) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Molded Interconnect Substrate (MIS) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Molded Interconnect Substrate (MIS) market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Molded Interconnect Substrate (MIS) and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Molded Interconnect Substrate (MIS).

This report presents a comprehensive overview, market shares, and growth opportunities of Molded Interconnect Substrate (MIS) market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
1 Layer MIS Substrate
2 Layer MIS Substrate
3 Layer MIS Substrate
4 Layer MIS Substrate
6 Layer MIS Substrate
Others

Segmentation by Application:
Analog Chip
Power IC
RF/5G
Fingerprint Sensor
OIS (Optical Image Stablization)
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
PPt
MiSpak Technology
QDOS

Key Questions Addressed in this Report

What is the 10-year outlook for the global Molded Interconnect Substrate (MIS) market?

What factors are driving Molded Interconnect Substrate (MIS) market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Molded Interconnect Substrate (MIS) market opportunities vary by end market size?

How does Molded Interconnect Substrate (MIS) break out by Type, by Application?

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