Global Liquid-cooled Computing Equipment Heat Dissipation Module Market Growth 2025-2031

The global Liquid-cooled Computing Equipment Heat Dissipation Module market size is predicted to grow from US$ 2394 million in 2025 to US$ 4102 million in 2031; it is expected to grow at a CAGR of 9.4% from 2025 to 2031.

Liquid-cooled Computing Equipment Heat Dissipation Module is an efficient heat dissipation system designed to tackle the heat dissipation challenges of high-power computing power equipment. With the development of technologies such as artificial intelligence and blockchain, the computing power of computing equipment has been continuously improving, and the heat generated has also increased sharply. Traditional air-cooled heat dissipation methods are difficult to meet the requirements. The liquid-cooled heat dissipation module uses a coolant (such as water or a special coolant) as the heat exchange medium, and the coolant is driven to circulate by a water pump. It usually consists of components such as cold plates, coolant pipes, and radiators. The cold plate is in close contact with the heat-generating parts of the computing power equipment, absorbs the heat and transfers it to the coolant. The coolant carrying the heat flows through the radiator, where the heat is dissipated through air cooling or other means, and then returns to the cold plate to continue the cycle. This heat dissipation module has high heat dissipation efficiency, can reduce the equipment temperature more accurately and quickly, and ensure that the computing power equipment operates in a stable temperature environment, reducing performance degradation and hardware damage caused by overheating. It is suitable for scenarios with extremely high heat dissipation requirements, such as data centers and high-performance computers.

United States market for Liquid-cooled Computing Equipment Heat Dissipation Module is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for Liquid-cooled Computing Equipment Heat Dissipation Module is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for Liquid-cooled Computing Equipment Heat Dissipation Module is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key Liquid-cooled Computing Equipment Heat Dissipation Module players cover NIDEC CORPORATION, SHENZHEN FRD SCIENCE& TECHNOLOGY, AURAS Technology, Forcecon Technology, Jentech Precision Industrial, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LP Information, Inc. (LPI) ' newest research report, the “Liquid-cooled Computing Equipment Heat Dissipation Module Industry Forecast” looks at past sales and reviews total world Liquid-cooled Computing Equipment Heat Dissipation Module sales in 2024, providing a comprehensive analysis by region and market sector of projected Liquid-cooled Computing Equipment Heat Dissipation Module sales for 2025 through 2031. With Liquid-cooled Computing Equipment Heat Dissipation Module sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Liquid-cooled Computing Equipment Heat Dissipation Module industry.

This Insight Report provides a comprehensive analysis of the global Liquid-cooled Computing Equipment Heat Dissipation Module landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Liquid-cooled Computing Equipment Heat Dissipation Module portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Liquid-cooled Computing Equipment Heat Dissipation Module market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Liquid-cooled Computing Equipment Heat Dissipation Module and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Liquid-cooled Computing Equipment Heat Dissipation Module.

This report presents a comprehensive overview, market shares, and growth opportunities of Liquid-cooled Computing Equipment Heat Dissipation Module market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Water-cooled
Oil-cooled
Fluorinated Liquid-cooled
Others

Segmentation by Application:
Server
GPU
Laptop
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
NIDEC CORPORATION
SHENZHEN FRD SCIENCE& TECHNOLOGY
AURAS Technology
Forcecon Technology
Jentech Precision Industrial
Taisol Electronics
ZheJiang RIFA Precision Machinery

Key Questions Addressed in this Report

What is the 10-year outlook for the global Liquid-cooled Computing Equipment Heat Dissipation Module market?

What factors are driving Liquid-cooled Computing Equipment Heat Dissipation Module market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Liquid-cooled Computing Equipment Heat Dissipation Module market opportunities vary by end market size?

How does Liquid-cooled Computing Equipment Heat Dissipation Module break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.