Global Liquid Molding Compounds (LMC) Market Growth 2025-2031
Description
The global Liquid Molding Compounds (LMC) market size is predicted to grow from US$ 636 million in 2025 to US$ 974 million in 2031; it is expected to grow at a CAGR of 7.4% from 2025 to 2031.
Liquid Molding Compounds (LMC) are widely used in the semiconductor industry for the encapsulation of electronic components, particularly semiconductor devices such as integrated circuits (ICs), power semiconductors, and other microelectronics. LMCs serve as protective materials, ensuring that the sensitive internal circuitry of semiconductors is shielded from environmental factors such as moisture, chemicals, and physical stress. They also provide electrical insulation, thermal conductivity, and mechanical protection, which are critical for the long-term reliability and performance of semiconductor devices.
The Liquid Molding Compounds (LMC) market has been evolving as a critical component in semiconductor packaging, especially in advanced applications like 5G, automotive electronics, AI, and consumer electronics. LMC is used in encapsulating and protecting semiconductor devices during the packaging process, and its importance has surged with the increasing complexity and miniaturization of electronic components.
Demand Driven by Advanced Semiconductor Packaging:
High-performance packaging: With the rapid advancement in semiconductor technology, especially in areas like 5G and automotive electronics, LMC plays a crucial role in the protection and encapsulation of complex chips. System-in-Package (SiP) and 3D-IC packaging are growing, and LMC is essential for providing efficient, reliable, and high-performance protection in these advanced packaging techniques.
Miniaturization and integration: As semiconductor devices become smaller and more densely packed, LMC formulations are being adapted for thinner layers, higher precision, and more effective heat dissipation.
Technological Advancements in LMC:
Customization for specific applications: The trend is toward more specialized LMC formulations tailored for different semiconductor packages, such as flip-chip, ball grid array (BGA), and chip-on-wafer (COW). This ensures the performance characteristics (such as thermal conductivity, reliability, and moisture resistance) are optimized for the respective device.
Higher thermal conductivity: As power densities in devices increase, LMC with higher thermal conductivity is becoming more critical to efficiently dissipate heat from the chip, preventing thermal damage.
Low-stress formulations: To avoid damaging delicate semiconductor components, the focus has shifted toward developing low-stress LMCs that minimize mechanical stress during the curing process, especially important for advanced and stacked ICs.
LP Information, Inc. (LPI) ' newest research report, the “Liquid Molding Compounds (LMC) Industry Forecast” looks at past sales and reviews total world Liquid Molding Compounds (LMC) sales in 2024, providing a comprehensive analysis by region and market sector of projected Liquid Molding Compounds (LMC) sales for 2025 through 2031. With Liquid Molding Compounds (LMC) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Liquid Molding Compounds (LMC) industry.
This Insight Report provides a comprehensive analysis of the global Liquid Molding Compounds (LMC) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Liquid Molding Compounds (LMC) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Liquid Molding Compounds (LMC) market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Liquid Molding Compounds (LMC) and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Liquid Molding Compounds (LMC).
This report presents a comprehensive overview, market shares, and growth opportunities of Liquid Molding Compounds (LMC) market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Liquid Epoxy Underfill
Liquid Epoxy Encapsulat Material
Segmentation by Application:
Fan-Out Wafer Level Packaging (FOWLP)
Ball Grid Array Package (BGA)
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Nagase ChemteX
NAMICS
Shin-Etsu Chemical
Eternal Materials
HHCK
Scienchem
Wuhan Sanxuan Technology
Key Questions Addressed in this Report
What is the 10-year outlook for the global Liquid Molding Compounds (LMC) market?
What factors are driving Liquid Molding Compounds (LMC) market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Liquid Molding Compounds (LMC) market opportunities vary by end market size?
How does Liquid Molding Compounds (LMC) break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Liquid Molding Compounds (LMC) are widely used in the semiconductor industry for the encapsulation of electronic components, particularly semiconductor devices such as integrated circuits (ICs), power semiconductors, and other microelectronics. LMCs serve as protective materials, ensuring that the sensitive internal circuitry of semiconductors is shielded from environmental factors such as moisture, chemicals, and physical stress. They also provide electrical insulation, thermal conductivity, and mechanical protection, which are critical for the long-term reliability and performance of semiconductor devices.
The Liquid Molding Compounds (LMC) market has been evolving as a critical component in semiconductor packaging, especially in advanced applications like 5G, automotive electronics, AI, and consumer electronics. LMC is used in encapsulating and protecting semiconductor devices during the packaging process, and its importance has surged with the increasing complexity and miniaturization of electronic components.
Demand Driven by Advanced Semiconductor Packaging:
High-performance packaging: With the rapid advancement in semiconductor technology, especially in areas like 5G and automotive electronics, LMC plays a crucial role in the protection and encapsulation of complex chips. System-in-Package (SiP) and 3D-IC packaging are growing, and LMC is essential for providing efficient, reliable, and high-performance protection in these advanced packaging techniques.
Miniaturization and integration: As semiconductor devices become smaller and more densely packed, LMC formulations are being adapted for thinner layers, higher precision, and more effective heat dissipation.
Technological Advancements in LMC:
Customization for specific applications: The trend is toward more specialized LMC formulations tailored for different semiconductor packages, such as flip-chip, ball grid array (BGA), and chip-on-wafer (COW). This ensures the performance characteristics (such as thermal conductivity, reliability, and moisture resistance) are optimized for the respective device.
Higher thermal conductivity: As power densities in devices increase, LMC with higher thermal conductivity is becoming more critical to efficiently dissipate heat from the chip, preventing thermal damage.
Low-stress formulations: To avoid damaging delicate semiconductor components, the focus has shifted toward developing low-stress LMCs that minimize mechanical stress during the curing process, especially important for advanced and stacked ICs.
LP Information, Inc. (LPI) ' newest research report, the “Liquid Molding Compounds (LMC) Industry Forecast” looks at past sales and reviews total world Liquid Molding Compounds (LMC) sales in 2024, providing a comprehensive analysis by region and market sector of projected Liquid Molding Compounds (LMC) sales for 2025 through 2031. With Liquid Molding Compounds (LMC) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Liquid Molding Compounds (LMC) industry.
This Insight Report provides a comprehensive analysis of the global Liquid Molding Compounds (LMC) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Liquid Molding Compounds (LMC) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Liquid Molding Compounds (LMC) market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Liquid Molding Compounds (LMC) and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Liquid Molding Compounds (LMC).
This report presents a comprehensive overview, market shares, and growth opportunities of Liquid Molding Compounds (LMC) market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Liquid Epoxy Underfill
Liquid Epoxy Encapsulat Material
Segmentation by Application:
Fan-Out Wafer Level Packaging (FOWLP)
Ball Grid Array Package (BGA)
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Nagase ChemteX
NAMICS
Shin-Etsu Chemical
Eternal Materials
HHCK
Scienchem
Wuhan Sanxuan Technology
Key Questions Addressed in this Report
What is the 10-year outlook for the global Liquid Molding Compounds (LMC) market?
What factors are driving Liquid Molding Compounds (LMC) market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Liquid Molding Compounds (LMC) market opportunities vary by end market size?
How does Liquid Molding Compounds (LMC) break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
87 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Liquid Molding Compounds (LMC) by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Liquid Molding Compounds (LMC) by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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