Global Laser Grooving Equipment for Semiconductor Market Growth 2025-2031

The global Laser Grooving Equipment for Semiconductor market size is predicted to grow from US$ 466 million in 2025 to US$ 808 million in 2031; it is expected to grow at a CAGR of 9.6% from 2025 to 2031.

The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.

Laser grooving equipment for semiconductor is a kind of machine that through laser scribing, remove the Low-k substances in the wafer saw track and the coating formed by the metal wiring layer in advance, thereby reducing the occurrence of chip defects and improving chip production efficiency in the subsequent blade dicing process.

The Laser Grooving Equipment for Semiconductor market has shown strong growth momentum in recent years, mainly benefiting from the rapid development of the semiconductor industry and the increased demand for precision manufacturing processes. With the increase in chip integration, traditional blade-wheel scribing technology can no longer meet the processing requirements of low-k dielectric wafers. Laser grooving technology, due to its non-contact processing characteristics, can effectively avoid film cracking and shedding, and has become the preferred process in the field of advanced packaging. The Asia-Pacific region occupies a dominant position, accounting for approximately 70% in 2024. Among them, China dominates photovoltaic and consumer electronics demand, while Japan and South Korea focus on high-end chip manufacturing.

At present, the global laser grooving equipment for semiconductor market is mainly dominated by international manufacturers such as DISCO, ASMPT and EO Technics, with a combined market share of more than 71%. With the advancement of localization, domestic manufacturers such as Dr Laser and Huagong Laser have made significant progress in technology research and development and market expansion, gradually narrowing the gap with international leading companies.

Laser grooving equipment for semiconductors is widely used in solar cell, integrated circuits and other fields. In the solar industry, it is mainly used for back electrode grooving and heterojunction precision processing of PERC and HJT cells, accounting for about 35% in 2024. This equipment is gradually penetrating into emerging fields such as MEMS sensors, quantum chips and optical communication devices.

In the future, with the further popularization of fields such as 5G, artificial intelligence, and the Internet of Things, the market demand for Laser Grooving Equipment is expected to continue to grow. At the same time, technological progress and innovation will drive the improvement of equipment performance, reduce production costs, and improve production efficiency. In addition, the demand for environmental protection and sustainable development will also prompt companies to develop more energy-saving and environmentally friendly equipment. Overall, the Laser Grooving Equipment market has broad prospects and will usher in more opportunities and challenges in the next few years.

LP Information, Inc. (LPI) ' newest research report, the “Laser Grooving Equipment for Semiconductor Industry Forecast” looks at past sales and reviews total world Laser Grooving Equipment for Semiconductor sales in 2024, providing a comprehensive analysis by region and market sector of projected Laser Grooving Equipment for Semiconductor sales for 2025 through 2031. With Laser Grooving Equipment for Semiconductor sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Laser Grooving Equipment for Semiconductor industry.

This Insight Report provides a comprehensive analysis of the global Laser Grooving Equipment for Semiconductor landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Laser Grooving Equipment for Semiconductor portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Laser Grooving Equipment for Semiconductor market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Laser Grooving Equipment for Semiconductor and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Laser Grooving Equipment for Semiconductor.

This report presents a comprehensive overview, market shares, and growth opportunities of Laser Grooving Equipment for Semiconductor market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Fully Automatic
Semi-automatic

Segmentation by Application:
Semiconductor Wafer
Solar Cells

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
DISCO
ASMPT
EO Technics
Wuhan Dr Laser Technology
Delphi Laser
Synova
Suzhou Maxwell Technologies
Suzhou Lumi Laser Technology
Han's Laser Technology
Wuhan Huagong Laser Engineering

Key Questions Addressed in this Report

What is the 10-year outlook for the global Laser Grooving Equipment for Semiconductor market?

What factors are driving Laser Grooving Equipment for Semiconductor market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Laser Grooving Equipment for Semiconductor market opportunities vary by end market size?

How does Laser Grooving Equipment for Semiconductor break out by Type, by Application?

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