Global Laser Dicing Machine for Semiconductor Market Growth 2025-2031
Description
The global Laser Dicing Machine for Semiconductor market size is predicted to grow from US$ 349 million in 2025 to US$ 454 million in 2031; it is expected to grow at a CAGR of 4.5% from 2025 to 2031.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
Wafer fabs continually face challenges in manufacturing semiconductor devices because the devices continue to get tinier and more complicated. Integrated circuits continue to increase in circuit density. Trends in chip design and materials, such as using die attach films and wafers as thin as 50 μm, add to the complexity of manufacturing. In fabrication processes, wafer dicing plays an early and critical role in the quality of the final product.
Silicon wafers thicker than 100 μm traditionally are cut by diamond blades or saws, and the blade’ s thickness, grit size, and rotating and cutting speeds affect the cutting quality. This technique has been refined over the years, yet it still causes problems that cannot be ignored. Chipping of the wafer occurs because of the force of the sawing process. The large cut width (kerf) caused by the blade wastes the wafer and produces debris that must be cleaned up. Other issues include wearing down of the blade over time and the cost of blade replacement.
For silicon wafers less than 100 μm thick, laser ablation offers an alternative to the blade technique, which is too powerful for the delicate thin wafers. However, laser ablation has its own problems. Vaporizing the wafer with a laser along the dicing path creates molten debris and microcracks. The debris deposited on the surface of the wafer is difficult to clean up, and the cracks result in chips with lower strength.
In contrast, stealth dicing does not generate the problems brought on by either the blade or laser ablation techniques. With stealth dicing, there is no chipping or debris, which eliminates the need for a cleanup process. It also reduces the amount of wasted wafer because of its very narrow dicing path, offering space on the wafer for more chips and higher production yield. Also, the technique does not cause heat damage because the laser cuts below the surface of the wafer; this contributes to rendering the chips more resistant to breakage.
One significant driver for the growth of the semiconductor laser dicing machine market is the rising demand for miniaturized semiconductor devices across various industries such as electronics, automotive, military, and healthcare. Small and more efficient devices require precise cutting, which laser dicing machines provide.
With continuous advancements in technology, more sophisticated dicing machines with improved accuracy, speed, and efficiency are being developed. This innovation cycle serves as a significant driver for the market growth.The use of laser dicing machines in the solar industry for slicing silicon wafer sheets represents a significant growth opportunity.Developing countries are rapidly adopting advanced technologies in various sectors which creates a vast market potential for semiconductor laser dicing machines.Increased investment in research and development activities towards creating better performing and high-speed dicing machines can result in substantial growth opportunities.
The semiconductor laser dicing machine industry is undergoing continuous innovation with advanced technologies such as AI and IoT increasingly embedded in the equipment. There's a trend towards higher precision, speed, and automation in the machines.
With the introduction of new materials like silicon carbide (SiC) and gallium nitride (GaN), the market for semiconductor laser dicing machines is seeing considerable growth. These materials require specific dicing techniques, which are well-served by the modern laser dicing machines.
The rising investments in the semiconductor industry across the globe will positively impact the semiconductor laser dicing machine market. Countries like China and India are heavily investing in semiconductor manufacturing, thereby driving the demand for these machines.
With the rapid industrialization and technological advancements in developing nations, there is a growing demand for semiconductor laser dicing machines. This presents a significant growth opportunity for the industry.
LP Information, Inc. (LPI) ' newest research report, the “Laser Dicing Machine for Semiconductor Industry Forecast” looks at past sales and reviews total world Laser Dicing Machine for Semiconductor sales in 2024, providing a comprehensive analysis by region and market sector of projected Laser Dicing Machine for Semiconductor sales for 2025 through 2031. With Laser Dicing Machine for Semiconductor sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Laser Dicing Machine for Semiconductor industry.
This Insight Report provides a comprehensive analysis of the global Laser Dicing Machine for Semiconductor landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Laser Dicing Machine for Semiconductor portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Laser Dicing Machine for Semiconductor market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Laser Dicing Machine for Semiconductor and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Laser Dicing Machine for Semiconductor.
This report presents a comprehensive overview, market shares, and growth opportunities of Laser Dicing Machine for Semiconductor market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Traditional Dicing
Stealth Dicing
Segmentation by Application:
Foundry
IDM
Seal Testing
PV Industry
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
DISCO
Wuxi Autowell Technology Co
Han's Laser Technology Co
Wuhan Huagong Laser Engineering Co
Suzhou Delphi Laser Co
Tokyo Seimitsu
Suzhou Maxwell Technologies Co
Suzhou Quick Laser Technology Co
EO Technics
Synova S.A.
Shenzhen Guangyuan Intelligent Equipment Co
China Electronics Technology Group Corporation
3D-Micromac AG
Genesem
ASMPT
GIE
Suzhou Lumi Laser Technology Co
Corning
Zhejiang Darcet Technology
Qinghong Laser
Sholaser Semiconductor Technology (Suzhou)
Key Questions Addressed in this Report
What is the 10-year outlook for the global Laser Dicing Machine for Semiconductor market?
What factors are driving Laser Dicing Machine for Semiconductor market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Laser Dicing Machine for Semiconductor market opportunities vary by end market size?
How does Laser Dicing Machine for Semiconductor break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
Wafer fabs continually face challenges in manufacturing semiconductor devices because the devices continue to get tinier and more complicated. Integrated circuits continue to increase in circuit density. Trends in chip design and materials, such as using die attach films and wafers as thin as 50 μm, add to the complexity of manufacturing. In fabrication processes, wafer dicing plays an early and critical role in the quality of the final product.
Silicon wafers thicker than 100 μm traditionally are cut by diamond blades or saws, and the blade’ s thickness, grit size, and rotating and cutting speeds affect the cutting quality. This technique has been refined over the years, yet it still causes problems that cannot be ignored. Chipping of the wafer occurs because of the force of the sawing process. The large cut width (kerf) caused by the blade wastes the wafer and produces debris that must be cleaned up. Other issues include wearing down of the blade over time and the cost of blade replacement.
For silicon wafers less than 100 μm thick, laser ablation offers an alternative to the blade technique, which is too powerful for the delicate thin wafers. However, laser ablation has its own problems. Vaporizing the wafer with a laser along the dicing path creates molten debris and microcracks. The debris deposited on the surface of the wafer is difficult to clean up, and the cracks result in chips with lower strength.
In contrast, stealth dicing does not generate the problems brought on by either the blade or laser ablation techniques. With stealth dicing, there is no chipping or debris, which eliminates the need for a cleanup process. It also reduces the amount of wasted wafer because of its very narrow dicing path, offering space on the wafer for more chips and higher production yield. Also, the technique does not cause heat damage because the laser cuts below the surface of the wafer; this contributes to rendering the chips more resistant to breakage.
One significant driver for the growth of the semiconductor laser dicing machine market is the rising demand for miniaturized semiconductor devices across various industries such as electronics, automotive, military, and healthcare. Small and more efficient devices require precise cutting, which laser dicing machines provide.
With continuous advancements in technology, more sophisticated dicing machines with improved accuracy, speed, and efficiency are being developed. This innovation cycle serves as a significant driver for the market growth.The use of laser dicing machines in the solar industry for slicing silicon wafer sheets represents a significant growth opportunity.Developing countries are rapidly adopting advanced technologies in various sectors which creates a vast market potential for semiconductor laser dicing machines.Increased investment in research and development activities towards creating better performing and high-speed dicing machines can result in substantial growth opportunities.
The semiconductor laser dicing machine industry is undergoing continuous innovation with advanced technologies such as AI and IoT increasingly embedded in the equipment. There's a trend towards higher precision, speed, and automation in the machines.
With the introduction of new materials like silicon carbide (SiC) and gallium nitride (GaN), the market for semiconductor laser dicing machines is seeing considerable growth. These materials require specific dicing techniques, which are well-served by the modern laser dicing machines.
The rising investments in the semiconductor industry across the globe will positively impact the semiconductor laser dicing machine market. Countries like China and India are heavily investing in semiconductor manufacturing, thereby driving the demand for these machines.
With the rapid industrialization and technological advancements in developing nations, there is a growing demand for semiconductor laser dicing machines. This presents a significant growth opportunity for the industry.
LP Information, Inc. (LPI) ' newest research report, the “Laser Dicing Machine for Semiconductor Industry Forecast” looks at past sales and reviews total world Laser Dicing Machine for Semiconductor sales in 2024, providing a comprehensive analysis by region and market sector of projected Laser Dicing Machine for Semiconductor sales for 2025 through 2031. With Laser Dicing Machine for Semiconductor sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Laser Dicing Machine for Semiconductor industry.
This Insight Report provides a comprehensive analysis of the global Laser Dicing Machine for Semiconductor landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Laser Dicing Machine for Semiconductor portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Laser Dicing Machine for Semiconductor market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Laser Dicing Machine for Semiconductor and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Laser Dicing Machine for Semiconductor.
This report presents a comprehensive overview, market shares, and growth opportunities of Laser Dicing Machine for Semiconductor market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Traditional Dicing
Stealth Dicing
Segmentation by Application:
Foundry
IDM
Seal Testing
PV Industry
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
DISCO
Wuxi Autowell Technology Co
Han's Laser Technology Co
Wuhan Huagong Laser Engineering Co
Suzhou Delphi Laser Co
Tokyo Seimitsu
Suzhou Maxwell Technologies Co
Suzhou Quick Laser Technology Co
EO Technics
Synova S.A.
Shenzhen Guangyuan Intelligent Equipment Co
China Electronics Technology Group Corporation
3D-Micromac AG
Genesem
ASMPT
GIE
Suzhou Lumi Laser Technology Co
Corning
Zhejiang Darcet Technology
Qinghong Laser
Sholaser Semiconductor Technology (Suzhou)
Key Questions Addressed in this Report
What is the 10-year outlook for the global Laser Dicing Machine for Semiconductor market?
What factors are driving Laser Dicing Machine for Semiconductor market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Laser Dicing Machine for Semiconductor market opportunities vary by end market size?
How does Laser Dicing Machine for Semiconductor break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
156 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Laser Dicing Machine for Semiconductor by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Laser Dicing Machine for Semiconductor by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
Pricing
Currency Rates
Questions or Comments?
Our team has the ability to search within reports to verify it suits your needs. We can also help maximize your budget by finding sections of reports you can purchase.
