Global Laser Debonding Equipment Market Growth 2025-2031

The global Laser Debonding Equipment market size is predicted to grow from US$ 191 million in 2025 to US$ 307 million in 2031; it is expected to grow at a CAGR of 8.3% from 2025 to 2031.

Laser debonding is to quickly irradiate laser energy on the adhesive material to partially dissociate the adhesive material, thereby separating the temporary substrate from the wafer. Using the laser debonding process, a layer of laser release layer (Laser Release Layer) is first coated or bonded on a temporary substrate, and the subsequent processes are all carried out on this substrate. After the packaging process is completed, the laser is applied to the adhesive material to separate the wafer from the temporary substrate. In this process, the laser will pass through the transparent glass sheet and reach the surface of the adhesive material, and evenly apply the laser energy to the adhesive material in a scanning manner, quickly separating the adhesive material and the glass.

In recent years, with the rapid development of the semiconductor industry and electronic technology, laser debonding technology has gradually become an efficient and precise choice, and its market demand has also been growing steadily.

The market for laser debonding equipment has expanded rapidly in the past few years. With the miniaturization and high performance of integrated circuits, traditional mechanical bonding methods have gradually faced challenges in accuracy and efficiency, while laser debonding equipment has gradually become a mainstream solution with its high precision, contactless and damage-free characteristics.

In the semiconductor industry, laser debonding equipment is mainly used in the debonding process of chip packaging, especially in the production of miniaturized devices such as flip chips, optoelectronic chips, and MEMS sensors. With the continuous advancement of packaging technology, the demand for laser debonding equipment continues to grow.

In addition, the technology of laser debonding equipment is also developing in the direction of environmental protection and low energy consumption, which meets the current demand for green manufacturing. For example, some advanced laser equipment can minimize the impact on the environment by finely adjusting the laser wavelength and power, and meet the increasingly stringent environmental protection standards of various countries.

LP Information, Inc. (LPI) ' newest research report, the “Laser Debonding Equipment Industry Forecast” looks at past sales and reviews total world Laser Debonding Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Laser Debonding Equipment sales for 2025 through 2031. With Laser Debonding Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Laser Debonding Equipment industry.

This Insight Report provides a comprehensive analysis of the global Laser Debonding Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Laser Debonding Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Laser Debonding Equipment market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Laser Debonding Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Laser Debonding Equipment.

This report presents a comprehensive overview, market shares, and growth opportunities of Laser Debonding Equipment market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:

Fully Automatic

Semi-automatic

Segmentation by Application:

200mm Wafer

300mm Wafer

Others

This report also splits the market by region:

Americas

United States

Canada

Mexico

Brazil

APAC

China

Japan

Korea

Southeast Asia

India

Australia

Europe

Germany

France

UK

Italy

Russia

Middle East & Africa

Egypt

South Africa

Israel

Turkey

GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.

SUSS

Han's Laser Technology Industry Group Co., Ltd.

TAZMO

Shin-Etsu Chemical Co., Ltd.

EV Group

Chengdu Laipu Technology

Honghao Semiconductor

Suzhou Wisee Tec

Tokyo Electron

Bio-Nano Micro Electronic Equipment

Wushi Microelectronics

Shanghai Micro Electronics Equipment

Key Questions Addressed in this Report

What is the 10-year outlook for the global Laser Debonding Equipment market?

What factors are driving Laser Debonding Equipment market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Laser Debonding Equipment market opportunities vary by end market size?

How does Laser Debonding Equipment break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.