Global Isobutylene-Based Thermoplastic Elastomer Market Growth 2025-2031
Description
The global CSP Carrier Tape market size is predicted to grow from US$ 246 million in 2025 to US$ 412 million in 2031; it is expected to grow at a CAGR of 9.0% from 2025 to 2031.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
CSP carrier tape is an important tool in semiconductor packaging and automated assembly processes. It is used to carry and protect the safety of the chip during transportation, storage and assembly. The carrier tape is usually made of plastic material with special grooves or holes embedded in it to hold the chip and ensures smooth gripping during machine automation. Chip-level packaging (CSP) is the latest generation of memory chip packaging technology, and its technical performance has been improved. Chip-level packaging (CSP) can make the ratio of chip area to package area exceed 1:1.14, which is quite close to the ideal situation of 1:1. The absolute size is only 32 square millimeters, about 1/3 of ordinary BGA, and only 1/6 of the area of TSOP memory chip. Compared to BGA packages, chip-level packages (CSPs) under the same space can triple the storage capacity.
United States market for CSP Carrier Tape is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
China market for CSP Carrier Tape is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Europe market for CSP Carrier Tape is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Global key CSP Carrier Tape players cover 3M, Advantek, Shin-Etsu Polymer, Nissho Corporation, Zhejiang Jiemei Electronic Technology, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.
LP Information, Inc. (LPI) ' newest research report, the “CSP Carrier Tape Industry Forecast” looks at past sales and reviews total world CSP Carrier Tape sales in 2024, providing a comprehensive analysis by region and market sector of projected CSP Carrier Tape sales for 2025 through 2031. With CSP Carrier Tape sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world CSP Carrier Tape industry.
This Insight Report provides a comprehensive analysis of the global CSP Carrier Tape landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on CSP Carrier Tape portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global CSP Carrier Tape market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for CSP Carrier Tape and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global CSP Carrier Tape.
This report presents a comprehensive overview, market shares, and growth opportunities of CSP Carrier Tape market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Polycarbonate
Polystyrene
Others
Segmentation by Application:
Consumer Electronics
Automotive Electronics
Internet of Things
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
3M
Advantek
Shin-Etsu Polymer
Nissho Corporation
Zhejiang Jiemei Electronic Technology
NIPPO CO.,LTD
YAC GARTER
U-PAK
C-Pak
ePAK International
ROTHE
Sumitomo Bakelite
Tek Pak
Jiangyin WINPACK Technology
SEKISUI SEIKEI
Asahi Kasei
Kanazu Giken
Taiwan Carrier Tape Enterprise
LaserTek
JSK Co.,Ltd
Miyata System
Hwa Shu Enterpris
Xiamen Haidelong Electronics Limited
DNP Group
Wuxi Bejia Plastic
Key Questions Addressed in this Report
What is the 10-year outlook for the global CSP Carrier Tape market?
What factors are driving CSP Carrier Tape market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do CSP Carrier Tape market opportunities vary by end market size?
How does CSP Carrier Tape break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
CSP carrier tape is an important tool in semiconductor packaging and automated assembly processes. It is used to carry and protect the safety of the chip during transportation, storage and assembly. The carrier tape is usually made of plastic material with special grooves or holes embedded in it to hold the chip and ensures smooth gripping during machine automation. Chip-level packaging (CSP) is the latest generation of memory chip packaging technology, and its technical performance has been improved. Chip-level packaging (CSP) can make the ratio of chip area to package area exceed 1:1.14, which is quite close to the ideal situation of 1:1. The absolute size is only 32 square millimeters, about 1/3 of ordinary BGA, and only 1/6 of the area of TSOP memory chip. Compared to BGA packages, chip-level packages (CSPs) under the same space can triple the storage capacity.
United States market for CSP Carrier Tape is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
China market for CSP Carrier Tape is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Europe market for CSP Carrier Tape is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Global key CSP Carrier Tape players cover 3M, Advantek, Shin-Etsu Polymer, Nissho Corporation, Zhejiang Jiemei Electronic Technology, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.
LP Information, Inc. (LPI) ' newest research report, the “CSP Carrier Tape Industry Forecast” looks at past sales and reviews total world CSP Carrier Tape sales in 2024, providing a comprehensive analysis by region and market sector of projected CSP Carrier Tape sales for 2025 through 2031. With CSP Carrier Tape sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world CSP Carrier Tape industry.
This Insight Report provides a comprehensive analysis of the global CSP Carrier Tape landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on CSP Carrier Tape portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global CSP Carrier Tape market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for CSP Carrier Tape and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global CSP Carrier Tape.
This report presents a comprehensive overview, market shares, and growth opportunities of CSP Carrier Tape market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Polycarbonate
Polystyrene
Others
Segmentation by Application:
Consumer Electronics
Automotive Electronics
Internet of Things
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
3M
Advantek
Shin-Etsu Polymer
Nissho Corporation
Zhejiang Jiemei Electronic Technology
NIPPO CO.,LTD
YAC GARTER
U-PAK
C-Pak
ePAK International
ROTHE
Sumitomo Bakelite
Tek Pak
Jiangyin WINPACK Technology
SEKISUI SEIKEI
Asahi Kasei
Kanazu Giken
Taiwan Carrier Tape Enterprise
LaserTek
JSK Co.,Ltd
Miyata System
Hwa Shu Enterpris
Xiamen Haidelong Electronics Limited
DNP Group
Wuxi Bejia Plastic
Key Questions Addressed in this Report
What is the 10-year outlook for the global CSP Carrier Tape market?
What factors are driving CSP Carrier Tape market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do CSP Carrier Tape market opportunities vary by end market size?
How does CSP Carrier Tape break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
160 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Isobutylene-Based Thermoplastic Elastomer by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Isobutylene-Based Thermoplastic Elastomer by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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