Global IoT Wireless Communication Chip Market Growth 2026-2032
Description
The global IoT Wireless Communication Chip market size is predicted to grow from US$ 14362 million in 2025 to US$ 36835 million in 2032; it is expected to grow at a CAGR of 14.5% from 2026 to 2032.
IoT Wireless Communication Chips refer to semiconductor devices that provide wireless link establishment, data transmission and reception, and network access capabilities for IoT terminals, gateways, and edge nodes. Their core function is to enable wireless communication between devices, between devices and gateways, and between devices and the cloud in different IoT scenarios. They typically support one or more mainstream wireless standards and protocol stacks, such as Wi-Fi, Bluetooth/BLE, IEEE 802.15.4 (Zigbee/Thread/Matter related), Sub-GHz proprietary protocols, LPWAN (such as LoRa), and cellular IoT (NB-IoT, LTE-M, Cat.1bis, etc.), and can be equipped with supporting capabilities such as network configuration, roaming, networking (star or mesh), power management, and connection security. In terms of product form and statistical scope, IoT wireless communication chips generally refer to wireless system-on-a-chip (SoC) or multi-protocol wireless MCUs that integrate functions such as radio frequency transceivers (RF), baseband, storage, microcontrollers (MCUs), encryption, and protocol stacks. These chips support multiple wireless protocols, such as Wi-Fi, Bluetooth/BLE, Zigbee, and Thread, and enable wireless connectivity for IoT devices. Most modern IoT wireless chips integrate radio frequency and other processing modules into a single chip, simplifying design and improving system efficiency. Market statistics typically use the shipment volume or sales revenue of "chips/SoCs/combined chips for IoT connectivity" as the accounting unit. In 2025, global IoT wireless communication chip production reached 5,521.83 million units, with an average price of approximately US$2.66 per unit and a gross profit margin of 20.05%-55.26%. Downstream customers include Apple, Google, Amazon, Xiaomi, Logitech, Lenovo, Skyworth, Changhong, Haier, JBL, Sony, and Narwal.
From a competitive landscape perspective, core manufacturers of IoT wireless communication chips mainly include Qualcomm, Texas Instruments, Semtech Corporation, Nordic Semiconductor, and Renesas Electronics, while also covering key players such as Broadcom, MediaTek, Realtek, NXP, Infineon, and STMicroelectronics. In 2024, industry concentration was high, with the top ten manufacturers accounting for approximately 71.0% of the market share. The leading global manufacturers were primarily Broadcom, Qualcomm, and MediaTek, holding a combined market share of approximately 30.2%. The second tier of manufacturers included Realtek, NXP, Infineon, and Renesas Electronics, holding a combined market share of approximately 27.0%. As leading manufacturers continue to strengthen their advantages in multi-protocol platform SoCs, ecosystems and channels, and customer certification systems, market share will continue to concentrate on the top players in the short term. However, in high-growth regions like China, structural substitution will accelerate the redistribution of market share. From a regional perspective, the Chinese market is one of the core variables determining global economic conditions and market share changes. In 2024, the Chinese market size was US$4,770.67 million, accounting for approximately 36.3% of the global market; it is projected to reach US$12,742.03 million by 2031, increasing its global share to 38.8%. Strong consumer demand will further accelerate local supply chain collaboration and the pace of domestic substitution, making the Chinese market one of the most competitive and fastest-evolving regions for products in the coming years. In terms of product type and technological evolution, Bluetooth and Bluetooth Low Energy (BLE) remain the most prevalent technologies (approximately 57.3% share in 2024, projected to reach 52.5% in 2031), with advantages in ultra-low power consumption and a mature ecosystem. Meanwhile, the share of Wi-Fi IoT continues to increase (approximately 21.7% in 2024, projected to reach 23.6% in 2031), primarily benefiting from the growth in direct-connect networks and the demand for higher bandwidth. Multi-protocol interconnectivity, represented by Zigbee/Thread/Matter, is steadily increasing its market share under the trend of "platformization" in smart homes (approximately 9.9% by 2031), while cellular and LPWAN routes are more reflected in structural growth in specific industry scenarios. From the application perspective, smart homes remain the core scenario for large-scale deployment, with a stable market share of approximately 34.1% in 2024. Revenue is projected to grow at a CAGR of approximately 14.2% from 2025 to 2031, continuing to benefit from home network upgrades, increased demand for cross-brand interconnectivity, and the penetration of multi-protocol integrated SoCs. Overall, industry competition will intensify in the coming years, especially in the Chinese market, where price, delivery, and ecosystem integration will jointly determine market share changes. Long-term winners will primarily depend on low power consumption and RF performance, protocol stacks and software ecosystems, platform-based product iteration efficiency, and the ability to replicate success on a large scale with leading customers and channel systems.
LP Information, Inc. (LPI) ' newest research report, the “IoT Wireless Communication Chip Industry Forecast” looks at past sales and reviews total world IoT Wireless Communication Chip sales in 2025, providing a comprehensive analysis by region and market sector of projected IoT Wireless Communication Chip sales for 2026 through 2032. With IoT Wireless Communication Chip sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world IoT Wireless Communication Chip industry.
This Insight Report provides a comprehensive analysis of the global IoT Wireless Communication Chip landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on IoT Wireless Communication Chip portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global IoT Wireless Communication Chip market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for IoT Wireless Communication Chip and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global IoT Wireless Communication Chip.
This report presents a comprehensive overview, market shares, and growth opportunities of IoT Wireless Communication Chip market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
BLE
Wi-Fi IoT
Zigbee/Thread/Matter
Cellular IoT
LoRaWAN IoT
Others
Segmentation by Integration:
Single-mode
Multi-mode
Segmentation by Technology:
Short Range
Long Range
Segmentation by Application:
Smart Home
Smart Healthcare
Retail Logistics
Consumer Electronics
Automotive Electronics
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Broadcomm
Qualcomm
Texas Instruments
Semtech Corporation
Nordic Semiconductor
Renesas Electronics (Dialog Semiconductor)
Silicon Labs
NXP Semiconductors
STMicroelectronics
Realtek Semiconductor Corporation
Infineon
Microchip Technology
Toshiba
Sequans
Onsemi
MediaTek
Qorvo
UNISOC
Telink Semiconductor (shanghai)co.,ltd.
Shenzhen HiSilicon Technologies
ASR Microelectronics Co., Ltd.
Zhuhai All Winner Technology
Espressif Systems
Beken Corporation
Key Questions Addressed in this Report
What is the 10-year outlook for the global IoT Wireless Communication Chip market?
What factors are driving IoT Wireless Communication Chip market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do IoT Wireless Communication Chip market opportunities vary by end market size?
How does IoT Wireless Communication Chip break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
IoT Wireless Communication Chips refer to semiconductor devices that provide wireless link establishment, data transmission and reception, and network access capabilities for IoT terminals, gateways, and edge nodes. Their core function is to enable wireless communication between devices, between devices and gateways, and between devices and the cloud in different IoT scenarios. They typically support one or more mainstream wireless standards and protocol stacks, such as Wi-Fi, Bluetooth/BLE, IEEE 802.15.4 (Zigbee/Thread/Matter related), Sub-GHz proprietary protocols, LPWAN (such as LoRa), and cellular IoT (NB-IoT, LTE-M, Cat.1bis, etc.), and can be equipped with supporting capabilities such as network configuration, roaming, networking (star or mesh), power management, and connection security. In terms of product form and statistical scope, IoT wireless communication chips generally refer to wireless system-on-a-chip (SoC) or multi-protocol wireless MCUs that integrate functions such as radio frequency transceivers (RF), baseband, storage, microcontrollers (MCUs), encryption, and protocol stacks. These chips support multiple wireless protocols, such as Wi-Fi, Bluetooth/BLE, Zigbee, and Thread, and enable wireless connectivity for IoT devices. Most modern IoT wireless chips integrate radio frequency and other processing modules into a single chip, simplifying design and improving system efficiency. Market statistics typically use the shipment volume or sales revenue of "chips/SoCs/combined chips for IoT connectivity" as the accounting unit. In 2025, global IoT wireless communication chip production reached 5,521.83 million units, with an average price of approximately US$2.66 per unit and a gross profit margin of 20.05%-55.26%. Downstream customers include Apple, Google, Amazon, Xiaomi, Logitech, Lenovo, Skyworth, Changhong, Haier, JBL, Sony, and Narwal.
From a competitive landscape perspective, core manufacturers of IoT wireless communication chips mainly include Qualcomm, Texas Instruments, Semtech Corporation, Nordic Semiconductor, and Renesas Electronics, while also covering key players such as Broadcom, MediaTek, Realtek, NXP, Infineon, and STMicroelectronics. In 2024, industry concentration was high, with the top ten manufacturers accounting for approximately 71.0% of the market share. The leading global manufacturers were primarily Broadcom, Qualcomm, and MediaTek, holding a combined market share of approximately 30.2%. The second tier of manufacturers included Realtek, NXP, Infineon, and Renesas Electronics, holding a combined market share of approximately 27.0%. As leading manufacturers continue to strengthen their advantages in multi-protocol platform SoCs, ecosystems and channels, and customer certification systems, market share will continue to concentrate on the top players in the short term. However, in high-growth regions like China, structural substitution will accelerate the redistribution of market share. From a regional perspective, the Chinese market is one of the core variables determining global economic conditions and market share changes. In 2024, the Chinese market size was US$4,770.67 million, accounting for approximately 36.3% of the global market; it is projected to reach US$12,742.03 million by 2031, increasing its global share to 38.8%. Strong consumer demand will further accelerate local supply chain collaboration and the pace of domestic substitution, making the Chinese market one of the most competitive and fastest-evolving regions for products in the coming years. In terms of product type and technological evolution, Bluetooth and Bluetooth Low Energy (BLE) remain the most prevalent technologies (approximately 57.3% share in 2024, projected to reach 52.5% in 2031), with advantages in ultra-low power consumption and a mature ecosystem. Meanwhile, the share of Wi-Fi IoT continues to increase (approximately 21.7% in 2024, projected to reach 23.6% in 2031), primarily benefiting from the growth in direct-connect networks and the demand for higher bandwidth. Multi-protocol interconnectivity, represented by Zigbee/Thread/Matter, is steadily increasing its market share under the trend of "platformization" in smart homes (approximately 9.9% by 2031), while cellular and LPWAN routes are more reflected in structural growth in specific industry scenarios. From the application perspective, smart homes remain the core scenario for large-scale deployment, with a stable market share of approximately 34.1% in 2024. Revenue is projected to grow at a CAGR of approximately 14.2% from 2025 to 2031, continuing to benefit from home network upgrades, increased demand for cross-brand interconnectivity, and the penetration of multi-protocol integrated SoCs. Overall, industry competition will intensify in the coming years, especially in the Chinese market, where price, delivery, and ecosystem integration will jointly determine market share changes. Long-term winners will primarily depend on low power consumption and RF performance, protocol stacks and software ecosystems, platform-based product iteration efficiency, and the ability to replicate success on a large scale with leading customers and channel systems.
LP Information, Inc. (LPI) ' newest research report, the “IoT Wireless Communication Chip Industry Forecast” looks at past sales and reviews total world IoT Wireless Communication Chip sales in 2025, providing a comprehensive analysis by region and market sector of projected IoT Wireless Communication Chip sales for 2026 through 2032. With IoT Wireless Communication Chip sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world IoT Wireless Communication Chip industry.
This Insight Report provides a comprehensive analysis of the global IoT Wireless Communication Chip landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on IoT Wireless Communication Chip portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global IoT Wireless Communication Chip market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for IoT Wireless Communication Chip and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global IoT Wireless Communication Chip.
This report presents a comprehensive overview, market shares, and growth opportunities of IoT Wireless Communication Chip market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
BLE
Wi-Fi IoT
Zigbee/Thread/Matter
Cellular IoT
LoRaWAN IoT
Others
Segmentation by Integration:
Single-mode
Multi-mode
Segmentation by Technology:
Short Range
Long Range
Segmentation by Application:
Smart Home
Smart Healthcare
Retail Logistics
Consumer Electronics
Automotive Electronics
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Broadcomm
Qualcomm
Texas Instruments
Semtech Corporation
Nordic Semiconductor
Renesas Electronics (Dialog Semiconductor)
Silicon Labs
NXP Semiconductors
STMicroelectronics
Realtek Semiconductor Corporation
Infineon
Microchip Technology
Toshiba
Sequans
Onsemi
MediaTek
Qorvo
UNISOC
Telink Semiconductor (shanghai)co.,ltd.
Shenzhen HiSilicon Technologies
ASR Microelectronics Co., Ltd.
Zhuhai All Winner Technology
Espressif Systems
Beken Corporation
Key Questions Addressed in this Report
What is the 10-year outlook for the global IoT Wireless Communication Chip market?
What factors are driving IoT Wireless Communication Chip market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do IoT Wireless Communication Chip market opportunities vary by end market size?
How does IoT Wireless Communication Chip break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
158 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for IoT Wireless Communication Chip by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for IoT Wireless Communication Chip by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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